Giles Humpston

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Optical imaging apparatus and methods of making the same
- Patent number 10,147,750
- Issue date Dec 4, 2018
- FLIR Systems Trading Belgium BVBA
- Moshe Kriman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Microelectronic package comprising offset conductive posts on compl...
- Patent number 8,207,604
- Issue date Jun 26, 2012
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact lens turret assembly
- Patent number 7,768,574
- Issue date Aug 3, 2010
- Tessera, Inc.
- Giles Humpston
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Microelectronic package optionally having differing cover and devic...
- Patent number 7,485,956
- Issue date Feb 3, 2009
- Tessera, Inc.
- David B. Tuckerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package having stacked semiconductor devices and a...
- Patent number 7,317,249
- Issue date Jan 8, 2008
- Tessera, Inc.
- Richard Dewitt Crisp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of making sealed capped chips
- Patent number 7,298,030
- Issue date Nov 20, 2007
- Tessera, Inc.
- Bruce M. McWilliams
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Connection structures for microelectronic devices and methods for f...
- Patent number 7,262,368
- Issue date Aug 28, 2007
- Tessera, Inc.
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Back-face and edge interconnects for lidded package
- Patent number 7,224,056
- Issue date May 29, 2007
- Tessera, Inc.
- Robert Burtzlaff
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacture of microelectronic fold packages
- Patent number 7,157,309
- Issue date Jan 2, 2007
- Tessera, Inc.
- Nicholas J. Colella
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Structure and method of making capped chips including vertical inte...
- Patent number 7,129,576
- Issue date Oct 31, 2006
- Tessera, Inc.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Compliant and hermetic solder seal
- Patent number 6,958,446
- Issue date Oct 25, 2005
- Agilent Technologies, Inc.
- Giles Humpston
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vented cavity, hermetic solder seal
- Patent number 6,732,905
- Issue date May 11, 2004
- Agilent Technologies, Inc.
- Giles Humpston
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Optical Imaging Apparatus And Methods Of Making The Same
- Publication number 20110273600
- Publication date Nov 10, 2011
- Moshe Kriman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method of making sealed capped chips
- Publication number 20080032457
- Publication date Feb 7, 2008
- Tessera, Inc.
- Bruce M. McWilliams
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microelectronic package optionally having differing cover and devic...
- Publication number 20070042527
- Publication date Feb 22, 2007
- Tessera, Inc.
- David B. Tuckerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic packages using a ceramic substrate having a window...
- Publication number 20060138626
- Publication date Jun 29, 2006
- Tessera, Inc.
- Victor Liew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic package having stacked semiconductor devices and a...
- Publication number 20060138647
- Publication date Jun 29, 2006
- Tessera, Inc.
- Richard Dewitt Crisp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder ball formation and transfer method
- Publication number 20060108402
- Publication date May 25, 2006
- Tessera, Inc.
- Richard Dewitt Crisp
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL MICROELECTRONIC PACKAGING WITH DOUBLE ISOLATION
- Publication number 20060081983
- Publication date Apr 20, 2006
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Connection structures for microelectronic devices and methods for f...
- Publication number 20060032670
- Publication date Feb 16, 2006
- Tessera, Inc.
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure with spherical contact pins
- Publication number 20060027899
- Publication date Feb 9, 2006
- Tessera, Inc.
- Giles Humpston
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Compact lens turret assembly
- Publication number 20050248680
- Publication date Nov 10, 2005
- Tessera, Inc.
- Giles Humpston
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Manufacture of microelectronic fold packages
- Publication number 20050227410
- Publication date Oct 13, 2005
- Tessera, Inc.
- Nicholas J. Colella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged acoustic and electromagnetic transducer chips
- Publication number 20050189622
- Publication date Sep 1, 2005
- Tessera, Inc.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Packaged acoustic and electromagnetic transducer chips
- Publication number 20050189635
- Publication date Sep 1, 2005
- Tessera, Inc.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micro pin grid array with wiping action
- Publication number 20050181655
- Publication date Aug 18, 2005
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package element and packaged chip having severable electrically con...
- Publication number 20050139984
- Publication date Jun 30, 2005
- Tessera, Inc.
- David B. Tuckerman
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Microelectronic element having trace formed after bond layer
- Publication number 20050116344
- Publication date Jun 2, 2005
- Tessera, Inc.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Structure and method of making capped chips having vertical interco...
- Publication number 20050095835
- Publication date May 5, 2005
- Tessera, Inc.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Back-face and edge interconnects for lidded package
- Publication number 20050087861
- Publication date Apr 28, 2005
- Tessera, Inc.
- Robert Burtzlaff
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Structure and method of making sealed capped chips
- Publication number 20050082653
- Publication date Apr 21, 2005
- Tessera, Inc.
- Bruce M. McWilliams
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Structure and self-locating method of making capped chips
- Publication number 20050082654
- Publication date Apr 21, 2005
- Tessera, Inc.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Structure and method of making capped chips using sacrificial layer
- Publication number 20050085016
- Publication date Apr 21, 2005
- Tessera, Inc.
- Bruce M. McWilliams
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Package having integral lens and wafer-scale fabrication method the...
- Publication number 20050067681
- Publication date Mar 31, 2005
- Tessera, Inc.
- Catherine De Villeneuve
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Structure and method of making capped chips including vertical inte...
- Publication number 20050067688
- Publication date Mar 31, 2005
- Tessera, Inc.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of soldering
- Publication number 20040173660
- Publication date Sep 9, 2004
- Kevin Joseph Lodge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Compliant and hermetic solder seal
- Publication number 20030198428
- Publication date Oct 23, 2003
- Giles Humpston
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vented cavity, hermetic solder seal
- Publication number 20030192942
- Publication date Oct 16, 2003
- Giles Humpston
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Giles Humpston

Person

Patents Grantslast 30 patents

Optical imaging apparatus and methods of making the same

Microelectronic package comprising offset conductive posts on compl...

Compact lens turret assembly

Microelectronic package optionally having differing cover and devic...

Microelectronic package having stacked semiconductor devices and a...

Structure and method of making sealed capped chips

Connection structures for microelectronic devices and methods for f...

Back-face and edge interconnects for lidded package

Manufacture of microelectronic fold packages

Structure and method of making capped chips including vertical inte...

Compliant and hermetic solder seal

Vented cavity, hermetic solder seal

Patents Applicationslast 30 patents

Optical Imaging Apparatus And Methods Of Making The Same

Structure and method of making sealed capped chips

Microelectronic package optionally having differing cover and devic...

Microelectronic packages using a ceramic substrate having a window...

Microelectronic package having stacked semiconductor devices and a...

Solder ball formation and transfer method

WAFER LEVEL MICROELECTRONIC PACKAGING WITH DOUBLE ISOLATION

Connection structures for microelectronic devices and methods for f...

Structure with spherical contact pins

Compact lens turret assembly

Manufacture of microelectronic fold packages

Packaged acoustic and electromagnetic transducer chips

Packaged acoustic and electromagnetic transducer chips

Micro pin grid array with wiping action

Package element and packaged chip having severable electrically con...

Microelectronic element having trace formed after bond layer

Structure and method of making capped chips having vertical interco...

Back-face and edge interconnects for lidded package

Structure and method of making sealed capped chips

Structure and self-locating method of making capped chips

Structure and method of making capped chips using sacrificial layer

Package having integral lens and wafer-scale fabrication method the...

Structure and method of making capped chips including vertical inte...

Method of soldering

Compliant and hermetic solder seal

Vented cavity, hermetic solder seal