Gill Y. Lee

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for low temperature chemical vapor deposition of low-k films...
- Patent number 7,084,079
- Issue date Aug 1, 2006
- International Business Machines Corporation
- Richard A. Conti
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
MRAM MTJ stack to conductive line alignment method
- Patent number 6,858,441
- Issue date Feb 22, 2005
- Infineon Technologies AG
- Joachim Nuetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning a magnetic memory cell bottom electrode before...
- Patent number 6,849,465
- Issue date Feb 1, 2005
- Infineon Technologies AG
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration scheme for avoiding plasma damage in MRAM technology
- Patent number 6,806,096
- Issue date Oct 19, 2004
- Infineon Technologies AG
- Woosik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive stud formation for MRAM manufacturing
- Patent number 6,783,999
- Issue date Aug 31, 2004
- Infineon Technologies AG
- Gill Yong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon-graded layer for improved adhesion of low-k dielectrics to s...
- Patent number 6,740,539
- Issue date May 25, 2004
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic tunnel junction patterning using SiC or SiN
- Patent number 6,713,802
- Issue date Mar 30, 2004
- Infineon Technologies AG
- Gill Yong Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Process for forming a damascene structure
- Patent number 6,649,531
- Issue date Nov 18, 2003
- International Business Machines Corporation
- William J. Cote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removable inorganic anti-reflection coating process
- Patent number 6,607,984
- Issue date Aug 19, 2003
- International Business Machines Corporation
- Gill Yong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon-graded layer for improved adhesion of low-k dielectrics to s...
- Patent number 6,570,256
- Issue date May 27, 2003
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low temperature chemical vapor deposition of low-k films...
- Patent number 6,531,412
- Issue date Mar 11, 2003
- International Business Machines Corporation
- Richard A. Conti
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Disposable spacers for improved array gapfill in high density DRAMs
- Patent number 6,281,084
- Issue date Aug 28, 2001
- Infineon Technologies Corporation
- Hiroyuki Akatsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PATTERNING A MAGNETIC MEMORY CELL BOTTOM ELECTRODE BEFORE...
- Publication number 20040259274
- Publication date Dec 23, 2004
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM MTJ stack to conductive line alignment method
- Publication number 20040043579
- Publication date Mar 4, 2004
- Joachim Nuetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carbon-graded layer for improved adhesion of low-k dielectrics to s...
- Publication number 20030153198
- Publication date Aug 14, 2003
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for forming a damascene structure
- Publication number 20030100190
- Publication date May 29, 2003
- International Business Machines Corporation
- William J. Cote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low k dielectric film deposition process
- Publication number 20030087043
- Publication date May 8, 2003
- International Business Machines Corporation
- Daniel C. Edelstein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for low temperature chemical vapor deposition of low-k films...
- Publication number 20030068853
- Publication date Apr 10, 2003
- International Business Machines Corporation
- Richard A. Conti
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR LOW TEMPERATURE CHEMICAL VAPOR DEPOSITION OF LOW-K FILMS...
- Publication number 20030032306
- Publication date Feb 13, 2003
- International Business Machines Corporation
- Richard A. Conti
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Carbon-graded layer for improved adhesion of low-k dielectrics to s...
- Publication number 20030017642
- Publication date Jan 23, 2003
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS

Gill Y. Lee

Person

Patents Grantslast 30 patents

Method for low temperature chemical vapor deposition of low-k films...

MRAM MTJ stack to conductive line alignment method

Method of patterning a magnetic memory cell bottom electrode before...

Integration scheme for avoiding plasma damage in MRAM technology

Subtractive stud formation for MRAM manufacturing

Carbon-graded layer for improved adhesion of low-k dielectrics to s...

Magnetic tunnel junction patterning using SiC or SiN

Process for forming a damascene structure

Removable inorganic anti-reflection coating process

Carbon-graded layer for improved adhesion of low-k dielectrics to s...

Method for low temperature chemical vapor deposition of low-k films...

Disposable spacers for improved array gapfill in high density DRAMs

Patents Applicationslast 30 patents

METHOD OF PATTERNING A MAGNETIC MEMORY CELL BOTTOM ELECTRODE BEFORE...

MRAM MTJ stack to conductive line alignment method

Carbon-graded layer for improved adhesion of low-k dielectrics to s...

Process for forming a damascene structure

Low k dielectric film deposition process

Method for low temperature chemical vapor deposition of low-k films...

METHOD FOR LOW TEMPERATURE CHEMICAL VAPOR DEPOSITION OF LOW-K FILMS...

Carbon-graded layer for improved adhesion of low-k dielectrics to s...