GILMAN KANG

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SUWON-SI, KR

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Patents Grantslast 30 patents

Information Patent Grant
Bonding head and a bonding apparatus having the same
- Patent number 11,456,273
- Issue date Sep 27, 2022
- Samsung Electronics Co., Ltd.
- Jaecheol Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096851
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Unbyoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING HEAD AND A BONDING APPARATUS HAVING THE SAME
- Publication number 20200343215
- Publication date Oct 29, 2020
- Samsung Electronics Co., Ltd.
- JAECHEOL KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR