Giovanni DEAMICIS

Person

L'Aquila, IT

People

Patents Grantslast 30 patents

Information Patent Grant
Hybrid bonding method for semiconductor wafers and related three-di...
- Patent number 11,127,776
- Issue date Sep 21, 2021
- LFoundry S.r.l.
- Giovanni De Amicis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging systems with backside isolation trenches
- Patent number 10,192,919
- Issue date Jan 29, 2019
- Semiconductor Components Industries, LLC
- Peter Rupert Barabash Barr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel isolation regions formed with conductive layers
- Patent number 9,595,555
- Issue date Mar 14, 2017
- Semiconductor Components Industries, LLC
- Daniel Tekleab
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Alignment marks and alignment methods for aligning backside compone...
- Patent number 9,281,335
- Issue date Mar 8, 2016
- Semiconductor Components Industries, LLC
- Gianluca Testa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging systems with backside isolation trenches
- Patent number 9,269,730
- Issue date Feb 23, 2016
- Semiconductor Components Industries, LLC
- Peter Rupert Barabash Barr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment marks and alignment methods for aligning backside compone...
- Patent number 8,846,494
- Issue date Sep 30, 2014
- Aptina Imaging Corporation
- Gianluca Testa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID BONDING METHOD FOR SEMICONDUCTOR WAFERS AND RELATED THREE-DI...
- Publication number 20200212086
- Publication date Jul 2, 2020
- LFOUNDRY S.R.L.
- Giovanni DE AMICIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR WITH NARROW ANGULAR RESPONSE
- Publication number 20180192876
- Publication date Jul 12, 2018
- LFOUNDRY S.R.L.
- Fabio Spaziani
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
OPTICAL SENSOR WITH NARROW ANGULAR RESPONSE
- Publication number 20170007130
- Publication date Jan 12, 2017
- LFOUNDRY S.r.I.
- Fabio Spaziani
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
PIXEL ISOLATION REGIONS FORMED WITH CONDUCTIVE LAYERS
- Publication number 20160329365
- Publication date Nov 10, 2016
- Semiconductor Components Industries, LLC
- Daniel TEKLEAB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING SYSTEMS WITH BACKSIDE ISOLATION TRENCHES
- Publication number 20160126267
- Publication date May 5, 2016
- Semiconductor Components Industries, LLC
- Peter Rupert Barabash BARR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT MARKS AND ALIGNMENT METHODS FOR ALIGNING BACKSIDE COMPONE...
- Publication number 20150102445
- Publication date Apr 16, 2015
- Semiconductor Components Industries, LLC
- Gianluca Testa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT MARKS AND ALIGNMENT METHODS FOR ALIGNING BACKSIDE COMPONE...
- Publication number 20130009268
- Publication date Jan 10, 2013
- Gianluca Testa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT MARKS AND ALIGNMENT METHODS FOR ALIGNING BACKSIDE COMPONE...
- Publication number 20130009269
- Publication date Jan 10, 2013
- Gianluca Testa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE ILLUMINATED IMAGE SENSORS WITH VERTICAL LIGHT SHIELDS
- Publication number 20130001728
- Publication date Jan 3, 2013
- Giovanni De Amicis
- H01 - BASIC ELECTRIC ELEMENTS

Giovanni DEAMICIS

Person

Patents Grantslast 30 patents

Hybrid bonding method for semiconductor wafers and related three-di...

Imaging systems with backside isolation trenches

Pixel isolation regions formed with conductive layers

Alignment marks and alignment methods for aligning backside compone...

Imaging systems with backside isolation trenches

Alignment marks and alignment methods for aligning backside compone...

Patents Applicationslast 30 patents

HYBRID BONDING METHOD FOR SEMICONDUCTOR WAFERS AND RELATED THREE-DI...

OPTICAL SENSOR WITH NARROW ANGULAR RESPONSE

OPTICAL SENSOR WITH NARROW ANGULAR RESPONSE

PIXEL ISOLATION REGIONS FORMED WITH CONDUCTIVE LAYERS

IMAGING SYSTEMS WITH BACKSIDE ISOLATION TRENCHES

ALIGNMENT MARKS AND ALIGNMENT METHODS FOR ALIGNING BACKSIDE COMPONE...

ALIGNMENT MARKS AND ALIGNMENT METHODS FOR ALIGNING BACKSIDE COMPONE...

ALIGNMENT MARKS AND ALIGNMENT METHODS FOR ALIGNING BACKSIDE COMPONE...

BACKSIDE ILLUMINATED IMAGE SENSORS WITH VERTICAL LIGHT SHIELDS