Girish A. Dixit

Person

Plano, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit insulator and method
- Patent number 6,962,883
- Issue date Nov 8, 2005
- Texas Instruments Incorporated
- Somnath S. Nag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure, low temperature, semiconductor gap filling process
- Patent number 6,589,865
- Issue date Jul 8, 2003
- Texas Instruments Incorporated
- Girish A. Dixit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization structure, and associated method, to improve crystall...
- Patent number 6,355,558
- Issue date Mar 12, 2002
- Texas Instruments Incorporated
- Girish Dixit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure, low temperature, semiconductor gap filling process
- Patent number 6,333,265
- Issue date Dec 25, 2001
- Texas Instruments Incorporated
- Girish A. Dixit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air-bridge integration scheme for reducing interconnect delay
- Patent number 6,297,125
- Issue date Oct 2, 2001
- Texas Instruments Incorporated
- Somnath S. Nag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-planarizing low-temperature doped-silicate-glass process capab...
- Patent number 6,268,297
- Issue date Jul 31, 2001
- Texas Instruments Incorporated
- Somnath S. Nag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hydrogen passivation of chemical-mechanically polished copper-conta...
- Patent number 6,251,771
- Issue date Jun 26, 2001
- Texas Instruments Incorporated
- Patricia B. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing recess for the formation of local interconnect...
- Patent number 6,194,313
- Issue date Feb 27, 2001
- Texas Instruments Incorporated
- Abha R. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer metal structure for improved interconnect reliability
- Patent number 6,159,847
- Issue date Dec 12, 2000
- Texas Instruments Incorporated
- Robert H. Havemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable doping of metal plugs for enhanced reliability
- Patent number 6,130,156
- Issue date Oct 10, 2000
- Texas Instruments Incorporated
- Robert H. Havemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CVD tin barrier layer for reduced electromigration of aluminum plugs
- Patent number 6,069,072
- Issue date May 30, 2000
- Texas Instruments Incorporated
- Anthony J. Konecni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Elemental titanium-free liner and fabrication process for inter-met...
- Patent number 5,849,367
- Issue date Dec 15, 1998
- Texas Instruments Incorporated
- Girish A. Dixit
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Integrated circuit insulator and method
- Publication number 20040259384
- Publication date Dec 23, 2004
- Somnath S. Nag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for selectively coupling a conductive material to...
- Publication number 20030168736
- Publication date Sep 11, 2003
- Anthony J. Konecni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low pressure, low temperature, semiconductor gap filling process
- Publication number 20020064942
- Publication date May 30, 2002
- Girish A. Dixit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for selectively coupling a conductive material to...
- Publication number 20010049192
- Publication date Dec 6, 2001
- Anthony J. Konecni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Girish A. Dixit

Person

Patents Grantslast 30 patents

Integrated circuit insulator and method

Low pressure, low temperature, semiconductor gap filling process

Metallization structure, and associated method, to improve crystall...

Low pressure, low temperature, semiconductor gap filling process

Air-bridge integration scheme for reducing interconnect delay

Self-planarizing low-temperature doped-silicate-glass process capab...

Hydrogen passivation of chemical-mechanically polished copper-conta...

Method for reducing recess for the formation of local interconnect...

Multilayer metal structure for improved interconnect reliability

Variable doping of metal plugs for enhanced reliability

CVD tin barrier layer for reduced electromigration of aluminum plugs

Elemental titanium-free liner and fabrication process for inter-met...

Patents Applicationslast 30 patents

Integrated circuit insulator and method

Method and system for selectively coupling a conductive material to...

Low pressure, low temperature, semiconductor gap filling process

Method and system for selectively coupling a conductive material to...