Gisela Lang

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Regensburg, DE

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Patents Grantslast 30 patents

Information Patent Grant
Process for producing a semiconductor device with a roughened semic...
- Patent number 6,309,953
- Issue date Oct 30, 2001
- Siemens Aktiengesellschaft
- Helmut Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of severing a semiconductor wafer
- Patent number 6,281,031
- Issue date Aug 28, 2001
- Siemens Aktiengesellschaft
- Josef Maurer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a semiconductor device with a roughened semic...
- Patent number 6,140,248
- Issue date Oct 31, 2000
- Siemens Aktiengesellschaft
- Helmut Fischer
- H01 - BASIC ELECTRIC ELEMENTS