Gong Ouyang

Person

Olympia, WA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fine feature formation techniques for printed circuit boards
- Patent number 11,903,138
- Issue date Feb 13, 2024
- Intel Corporation
- Eric Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine feature formation techniques for printed circuit boards
- Patent number 11,089,689
- Issue date Aug 10, 2021
- Intel Corporation
- Eric Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compact via structures and method of making same
- Patent number 10,249,924
- Issue date Apr 2, 2019
- Intel Corporation
- Kai Xiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector
- Patent number 10,128,591
- Issue date Nov 13, 2018
- Intel Corporation
- Gong Ouyang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly with gathered insulated wires
- Patent number 9,935,036
- Issue date Apr 3, 2018
- Intel Corporation
- Gong Ouyang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board having a signal conductor disposed adjacent o...
- Patent number 9,935,353
- Issue date Apr 3, 2018
- Intel Corporation
- Gong Ouyang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Helically insulated twinax cable systems and methods
- Patent number 9,922,751
- Issue date Mar 20, 2018
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductors for circuit board through hole structures
- Patent number 9,894,752
- Issue date Feb 13, 2018
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to realize reconfigurable memory topology
- Patent number 9,791,899
- Issue date Oct 17, 2017
- Intel Corporation
- Gong Ouyang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Broadside coupled differential transmission lines having alternatin...
- Patent number 9,338,882
- Issue date May 10, 2016
- Intel Corporation
- Kai Xiao
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Shielding a connector to reduce interference
- Patent number 9,318,850
- Issue date Apr 19, 2016
- Intel Corporation
- Xiang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FINE FEATURE FORMATION TECHNIQUES FOR PRINTED CIRCUIT BOARDS
- Publication number 20210352807
- Publication date Nov 11, 2021
- Intel Corporation
- ERIC LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FINE FEATURE FORMATION TECHNIQUES FOR PRINTED CIRCUIT BOARDS
- Publication number 20190098764
- Publication date Mar 28, 2019
- Intel Corporation
- ERIC LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FINE-FEATURED TRACES FOR INTEGRATED CIRCUIT PACKAGE SUPPORT STRUCTURES
- Publication number 20180174940
- Publication date Jun 21, 2018
- Intel Corporation
- Shelby Ferguson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HELICALLY INSULATED TWINAX CABLE SYSTEMS AND METHODS
- Publication number 20170287591
- Publication date Oct 5, 2017
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY WITH GATHERED INSULATED WIRES
- Publication number 20170207146
- Publication date Jul 20, 2017
- Intel Corporation
- GONG OUYANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO REALIZE RECONFIGURABLE MEMORY TOPOLOGY
- Publication number 20170168528
- Publication date Jun 15, 2017
- Intel Corporation
- Gong Ouyang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERCONNECTS WITH TRENCHES
- Publication number 20170086288
- Publication date Mar 23, 2017
- Intel Corporation
- Gong Ouyang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR
- Publication number 20170069988
- Publication date Mar 9, 2017
- Intel Corporation
- GONG OUYANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT VIA STRUCTURES AND METHOD OF MAKING SAME
- Publication number 20160378215
- Publication date Dec 29, 2016
- Intel Corporation
- Kai Xiao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INDUCTORS FOR CIRCUIT BOARD THROUGH HOLE STRUCTURES
- Publication number 20160276091
- Publication date Sep 22, 2016
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTORS FOR CIRCUIT BOARD THROUGH HOLE STRUCTURES
- Publication number 20160276092
- Publication date Sep 22, 2016
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shielding A Connector To Reduce Interference
- Publication number 20150340817
- Publication date Nov 26, 2015
- Xiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROADSIDE COUPLED DIFFERENTIAL DESIGN
- Publication number 20150333387
- Publication date Nov 19, 2015
- KAI XIAO
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY

Gong Ouyang

Person

Patents Grantslast 30 patents

Fine feature formation techniques for printed circuit boards

Fine feature formation techniques for printed circuit boards

Compact via structures and method of making same

Electrical connector

Package assembly with gathered insulated wires

Printed circuit board having a signal conductor disposed adjacent o...

Helically insulated twinax cable systems and methods

Inductors for circuit board through hole structures

Method to realize reconfigurable memory topology

Broadside coupled differential transmission lines having alternatin...

Shielding a connector to reduce interference

Patents Applicationslast 30 patents

FINE FEATURE FORMATION TECHNIQUES FOR PRINTED CIRCUIT BOARDS

FINE FEATURE FORMATION TECHNIQUES FOR PRINTED CIRCUIT BOARDS

FINE-FEATURED TRACES FOR INTEGRATED CIRCUIT PACKAGE SUPPORT STRUCTURES

HELICALLY INSULATED TWINAX CABLE SYSTEMS AND METHODS

PACKAGE ASSEMBLY WITH GATHERED INSULATED WIRES

METHOD TO REALIZE RECONFIGURABLE MEMORY TOPOLOGY

INTERCONNECTS WITH TRENCHES

ELECTRICAL CONNECTOR

COMPACT VIA STRUCTURES AND METHOD OF MAKING SAME

INDUCTORS FOR CIRCUIT BOARD THROUGH HOLE STRUCTURES

INDUCTORS FOR CIRCUIT BOARD THROUGH HOLE STRUCTURES

Shielding A Connector To Reduce Interference

BROADSIDE COUPLED DIFFERENTIAL DESIGN