Goon Woo KIM

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Cheonan-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus to manufacture a semiconductor package having a buffer di...
- Patent number 8,156,636
- Issue date Apr 17, 2012
- Samsung Electronics Co., Ltd.
- Goon Woo Kim
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
Method of Fabricating Semiconductor Device
- Publication number 20120108035
- Publication date May 3, 2012
- Goon-Woo Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
- Publication number 20100071854
- Publication date Mar 25, 2010
- Samsung Electronics Co., Ltd.
- Goon Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING FILM HAVING WIRE, SEMICONDUCTOR PACKAGE INCLUDING THE WIRING...
- Publication number 20080111230
- Publication date May 15, 2008
- Samsung Electronics Co., Ltd.
- Goon-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer level chip package and method of manufacturing...
- Publication number 20070052094
- Publication date Mar 8, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Goon-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for ejecting relatively thin IC chip from semiconductor w...
- Publication number 20060003491
- Publication date Jan 5, 2006
- Goon-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS