Gordon Charles Osborne Jr.

Person

Essex Junction, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Releasable buried layer for 3-D fabrication and methods of manufact...
- Patent number 9,040,390
- Issue date May 26, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Planarized plastic package modules for integrated circuits
- Patent number 6,603,195
- Issue date Aug 5, 2003
- International Business Machines Corporation
- David V. Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for testing integrated circuit chips
- Patent number 5,672,980
- Issue date Sep 30, 1997
- International Business Machines Corporation
- Richard Gordon Charlton
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for testing integrated circuit chips
- Patent number 5,659,256
- Issue date Aug 19, 1997
- International Business Machines Corporation
- Richard Gordon Charlton
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for testing integrated circuit chips
- Patent number 5,528,159
- Issue date Jun 18, 1996
- International Business Machine Corp.
- Richard G. Charlton
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for testing integrated circuit chips
- Patent number 5,523,696
- Issue date Jun 4, 1996
- International Business Machines Corp.
- Richard G. Charlton
- G01 - MEASURING TESTING
Information Patent Grant
Method of bonding gold or gold alloy wire to lead tin solder
- Patent number 4,907,734
- Issue date Mar 13, 1990
- International Business Machines Corporation
- H. Ward Conru
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RELEASABLE BURIED LAYER FOR 3-D FABRICATION AND METHODS OF MANUFACT...
- Publication number 20130320521
- Publication date Dec 5, 2013
- International Business Machines Corporation
- Timothy H. DAUBENSPECK
- H01 - BASIC ELECTRIC ELEMENTS

Gordon Charles Osborne Jr.

Person

Patents Grantslast 30 patents

Releasable buried layer for 3-D fabrication and methods of manufact...

Planarized plastic package modules for integrated circuits

Method and apparatus for testing integrated circuit chips

Method and apparatus for testing integrated circuit chips

Method and apparatus for testing integrated circuit chips

Method and apparatus for testing integrated circuit chips

Method of bonding gold or gold alloy wire to lead tin solder

Patents Applicationslast 30 patents

RELEASABLE BURIED LAYER FOR 3-D FABRICATION AND METHODS OF MANUFACT...