Gordon J. Robbins

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microprocessor bus structure
- Patent number 6,457,089
- Issue date Sep 24, 2002
- International Business Machines Corporation
- Gordon J. Robbins
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Column grid array substrate attachment with heat sink stress relief
- Patent number 6,395,991
- Issue date May 28, 2002
- International Business Machines Corporation
- Robert Charles Dockerty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Design and methodology for manufacturing data processing systems ha...
- Patent number 6,067,633
- Issue date May 23, 2000
- International Business Machines Corp.
- Gordon J. Robbins
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Column grid array substrate attachment with heat sink stress relief
- Patent number 6,053,394
- Issue date Apr 25, 2000
- International Business Machines Corporation
- Robert Charles Dockerty
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Minimal capture pads applied to ceramic vias in ceramic substrates
- Patent number 5,916,451
- Issue date Jun 29, 1999
- International Business Machines Corporation
- Eric Daniel Perfecto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of constructing an integrated circuit memory
- Patent number 5,817,543
- Issue date Oct 6, 1998
- International Business Machines Corporation
- Michael Ford McAllister
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structurally reinforced ball grid array semiconductor package and s...
- Patent number 5,796,169
- Issue date Aug 18, 1998
- International Business Machines Corporation
- Robert Charles Dockerty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for repairing defective electrical connections on multi-laye...
- Patent number 5,757,079
- Issue date May 26, 1998
- International Business Machines Corporation
- Michael McAllister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for repairing defective electrical connections on multi-laye...
- Patent number 5,747,095
- Issue date May 5, 1998
- International Business Machines Corporation
- Michael McAllister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density memory structure
- Patent number 5,523,619
- Issue date Jun 4, 1996
- International Business Machines Corporation
- Michael F. McAllister
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Minimal capture pads applied to ceramic vias in ceramic substrates
- Patent number 5,464,682
- Issue date Nov 7, 1995
- International Business Machines Corporation
- Eric D. Perfecto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film wiring layout for a non-planar thin-film structure
- Patent number 5,378,927
- Issue date Jan 3, 1995
- International Business Machines Corporation
- Michael F. McAllister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extrusion of polymer waveguides onto surfaces
- Patent number 5,317,657
- Issue date May 31, 1994
- International Business Machines Corporation
- Antonio R. Gallo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Optical signal distribution system
- Patent number 5,208,879
- Issue date May 4, 1993
- International Business Machines Corporation
- Antonio R. Gallo
- G02 - OPTICS
Information Patent Grant
Switch logic for shift register latch pair
- Patent number 4,535,467
- Issue date Aug 13, 1985
- International Business Machines Corporation
- James W. Davis
- G01 - MEASURING TESTING
Information Patent Grant
High density semiconductor chip organization
- Patent number 4,006,492
- Issue date Feb 1, 1977
- International Business Machines Corporation
- Edward Baxter Eichelberger
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High performance latch circuit
- Patent number 3,986,057
- Issue date Oct 12, 1976
- International Business Machines Corporation
- Edward Baxter Eichelberger
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
Chip interconnection method and apparatus
- Publication number 20040201970
- Publication date Oct 14, 2004
- International Business Machines Corporation
- Paul Marlan Harvey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for controlling power dissipation and convecti...
- Publication number 20030023889
- Publication date Jan 30, 2003
- Harm Peter Hofstee
- G06 - COMPUTING CALCULATING COUNTING

Gordon J. Robbins

Person

Patents Grantslast 30 patents

Microprocessor bus structure

Column grid array substrate attachment with heat sink stress relief

Design and methodology for manufacturing data processing systems ha...

Column grid array substrate attachment with heat sink stress relief

Minimal capture pads applied to ceramic vias in ceramic substrates

Method of constructing an integrated circuit memory

Structurally reinforced ball grid array semiconductor package and s...

Method for repairing defective electrical connections on multi-laye...

Method for repairing defective electrical connections on multi-laye...

High density memory structure

Minimal capture pads applied to ceramic vias in ceramic substrates

Thin-film wiring layout for a non-planar thin-film structure

Extrusion of polymer waveguides onto surfaces

Optical signal distribution system

Switch logic for shift register latch pair

High density semiconductor chip organization

High performance latch circuit

Patents Applicationslast 30 patents

Chip interconnection method and apparatus

Apparatus and method for controlling power dissipation and convecti...