This is a divisional of copending application U.S. Ser. No. 08/577,677 filed on Dec. 21, 1995.
Number | Name | Date | Kind |
---|---|---|---|
4254445 | Ho | Mar 1981 | |
4480288 | Gazdik et al. | Oct 1984 | |
4489364 | Chance et al. | Dec 1984 | |
5220490 | Weigler et al. | Jun 1993 | |
5224022 | Weigler et al. | Jun 1993 | |
5243140 | Bhatla et al. | Sep 1993 | |
5258236 | Arjavalingam et al. | Nov 1993 |
Entry |
---|
IBM Technical Disclosure Bulletin, vol. 20, No. 9 Feb. 1978 C.W. Ho and C.Y. Ting, Planar Wiring Repair Technique for the Thin-Film Metal Package Via Solder Evaporation, vol. 20, No. 9, IBM Corp. 1978, pp. 3729-3730. |
Number | Date | Country | |
---|---|---|---|
Parent | 577677 | Dec 1995 |