GREGORIO R. MURTAGIAN

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Socket load regulation utilizing CPU carriers with shim components
- Patent number 11,818,832
- Issue date Nov 14, 2023
- Intel Corporation
- Feroz Mohammad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebond and leadframe magnetic inductors
- Patent number 11,804,456
- Issue date Oct 31, 2023
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective ground flood around reduced land pad on package base laye...
- Patent number 11,737,227
- Issue date Aug 22, 2023
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective ground flood around reduced land pad on package base laye...
- Patent number 11,291,133
- Issue date Mar 29, 2022
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar based socket
- Patent number 10,522,450
- Issue date Dec 31, 2019
- Intel Corporation
- Gregorio Murtagian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CPU socket contact for improving bandwidth throughput
- Patent number 10,431,912
- Issue date Oct 1, 2019
- Intel Corporation
- Gregorio R. Murtagian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rlink-ground shielding attachment structures and shadow voiding for...
- Patent number 10,396,036
- Issue date Aug 27, 2019
- Intel Corporation
- Yu Amos Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder contacts for socket assemblies
- Patent number 10,321,573
- Issue date Jun 11, 2019
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-mount inductor structures for forming one or more inductors...
- Patent number 10,056,182
- Issue date Aug 21, 2018
- Intel Corporation
- Gregorio R. Murtagian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal linear edge connector
- Patent number 10,044,115
- Issue date Aug 7, 2018
- Intel Corporation
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder contacts for socket assemblies
- Patent number 9,860,988
- Issue date Jan 2, 2018
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CPU package substrates with removable memory mechanical interfaces
- Patent number 9,832,876
- Issue date Nov 28, 2017
- Intel Corporation
- Mani Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Small form factor sockets and connectors
- Patent number 9,692,147
- Issue date Jun 27, 2017
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly that includes a plurality of electronic packages
- Patent number 9,603,276
- Issue date Mar 21, 2017
- Intel Corporation
- David J. Llapitan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanism for facilitating and employing a magnetic grid array
- Patent number 9,461,431
- Issue date Oct 4, 2016
- Intel Corporation
- Gregorio R. Murtagian
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Mechanism for facilitating and employing a magnetic grid array
- Patent number 9,118,143
- Issue date Aug 25, 2015
- Intel Corporation
- Gregorio R. Murtagian
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
TECHNOLOGIES FOR TESTING LIQUID METAL ARRAY INTERCONNECT PACKAGES
- Publication number 20230314503
- Publication date Oct 5, 2023
- Intel Corporation
- Gregorio Roberto Murtagian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR LIQUID METAL MIXTURES FOR ELECTRICAL INTERCONNECTS
- Publication number 20230317533
- Publication date Oct 5, 2023
- Intel Corporation
- Gregorio Roberto Murtagian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL INTERCONNECT FOR MODULAR PACKAGE SERVER ARCHITECTURE
- Publication number 20230197621
- Publication date Jun 22, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERPOSER SERVE...
- Publication number 20230197622
- Publication date Jun 22, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERCONNECT SER...
- Publication number 20230197594
- Publication date Jun 22, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL CONNECTION DEVICE AND METHOD
- Publication number 20230187850
- Publication date Jun 15, 2023
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE LIQUID METAL CONNECTION DEVICE AND METHOD
- Publication number 20230187337
- Publication date Jun 15, 2023
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE CARRIER STRUCTURES INCLUDING POLYMER LAYERS AS BA...
- Publication number 20220386457
- Publication date Dec 1, 2022
- Georgia Tech Research Corporation
- Omkar Gupte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE EXPANDED BEAM CONNECTOR FOR ON-PACKAGE OPTICS
- Publication number 20220308294
- Publication date Sep 29, 2022
- Intel Corporation
- Wesley MORGAN
- G02 - OPTICS
Information Patent Application
SELECTIVE GROUND FLOOD AROUND REDUCED LAND PAD ON PACKAGE BASE LAYE...
- Publication number 20220183177
- Publication date Jun 9, 2022
- Intel Corporation
- Zhichao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET LOAD REGULATION UTILIZING CPU CARRIERS WITH SHIM COMPONENTS
- Publication number 20210307153
- Publication date Sep 30, 2021
- Intel Corporation
- Feroz MOHAMMAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MOUNTING TECHNIQUES TO REDUCE CIRCUIT BOARD DEFLECTION
- Publication number 20200335432
- Publication date Oct 22, 2020
- Intel Corporation
- Gregorio R. Murtagian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIREBOND AND LEADFRAME MAGNETIC INDUCTORS
- Publication number 20200066659
- Publication date Feb 27, 2020
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE GROUND FLOOD AROUND REDUCED LAND PAD ON PACKAGE BASE LAYE...
- Publication number 20190307009
- Publication date Oct 3, 2019
- Zhichao ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REPLACEABLE ON-PACKAGE MEMORY DEVICES
- Publication number 20190182955
- Publication date Jun 13, 2019
- Intel Corporation
- Gregorio R. Murtagian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CPU SOCKET CONTACT FOR IMPROVING BANDWIDTH THROUGHPUT
- Publication number 20190103687
- Publication date Apr 4, 2019
- Intel Corporation
- GREGORIO R. MURTAGIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RLINK-GROUND SHIELDING ATTACHMENT STRUCTURES AND SHADOW VOIDING FOR...
- Publication number 20180331043
- Publication date Nov 15, 2018
- Intel Corporation
- Yu Amos ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER CONTACTS FOR SOCKET ASSEMBLIES
- Publication number 20180192519
- Publication date Jul 5, 2018
- Intel Corporation
- Fay HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES
- Publication number 20180007791
- Publication date Jan 4, 2018
- Intel Corporation
- Mani Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Universal linear edge connector
- Publication number 20170187147
- Publication date Jun 29, 2017
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALL FORM FACTOR SOCKETS AND CONNECTORS
- Publication number 20170179622
- Publication date Jun 22, 2017
- Intel Corporation
- SRIKANT NEKKANTY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER CONTACTS FOR SOCKET ASSEMBLIES
- Publication number 20160338199
- Publication date Nov 17, 2016
- Intel Corporation
- Fay HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET THAT ENGAGES A PLURALITY OF ELECTRONIC PACKAGES
- Publication number 20160190716
- Publication date Jun 30, 2016
- Kuang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY THAT INCLUDES A PLURALITY OF ELECTRONIC PACKAGES
- Publication number 20160190717
- Publication date Jun 30, 2016
- David J. Llapitan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES
- Publication number 20160183374
- Publication date Jun 23, 2016
- Mani Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISM FOR FACILITATING AND EMPLOYING A MAGNETIC GRID ARRAY
- Publication number 20150318655
- Publication date Nov 5, 2015
- Intel Corporation
- GREGORIO R. MURTAGIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE-MOUNT INDUCTOR STRUCTURES FOR FORMING ONE OR MORE INDUCTORS...
- Publication number 20150155092
- Publication date Jun 4, 2015
- Intel Corporation
- Gregorio R. Murtagian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISM FOR FACILITATING AND EMPLOYING A MAGNETIC GRID ARRAY
- Publication number 20140187057
- Publication date Jul 3, 2014
- Gregorio R. Murtagian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE-MOUNT INDUCTOR STRUCTURES FOR FORMING ONE OR MORE INDUCTORS...
- Publication number 20140167900
- Publication date Jun 19, 2014
- Gregorio R. Murtagian
- H01 - BASIC ELECTRIC ELEMENTS

GREGORIO R. MURTAGIAN

Person

Patents Grantslast 30 patents

Socket load regulation utilizing CPU carriers with shim components

Wirebond and leadframe magnetic inductors

Selective ground flood around reduced land pad on package base laye...

Selective ground flood around reduced land pad on package base laye...

Pillar based socket

CPU socket contact for improving bandwidth throughput

Rlink-ground shielding attachment structures and shadow voiding for...

Solder contacts for socket assemblies

Surface-mount inductor structures for forming one or more inductors...

Universal linear edge connector

Solder contacts for socket assemblies

CPU package substrates with removable memory mechanical interfaces

Small form factor sockets and connectors

Electronic assembly that includes a plurality of electronic packages

Mechanism for facilitating and employing a magnetic grid array

Mechanism for facilitating and employing a magnetic grid array

Patents Applicationslast 30 patents

TECHNOLOGIES FOR TESTING LIQUID METAL ARRAY INTERCONNECT PACKAGES

TECHNOLOGIES FOR LIQUID METAL MIXTURES FOR ELECTRICAL INTERCONNECTS

LIQUID METAL INTERCONNECT FOR MODULAR PACKAGE SERVER ARCHITECTURE

LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERPOSER SERVE...

LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERCONNECT SER...

LIQUID METAL CONNECTION DEVICE AND METHOD

FLEXIBLE LIQUID METAL CONNECTION DEVICE AND METHOD

ELECTRONIC DEVICE CARRIER STRUCTURES INCLUDING POLYMER LAYERS AS BA...

PACKAGE EXPANDED BEAM CONNECTOR FOR ON-PACKAGE OPTICS

SELECTIVE GROUND FLOOD AROUND REDUCED LAND PAD ON PACKAGE BASE LAYE...

SOCKET LOAD REGULATION UTILIZING CPU CARRIERS WITH SHIM COMPONENTS

CHIP MOUNTING TECHNIQUES TO REDUCE CIRCUIT BOARD DEFLECTION

WIREBOND AND LEADFRAME MAGNETIC INDUCTORS

SELECTIVE GROUND FLOOD AROUND REDUCED LAND PAD ON PACKAGE BASE LAYE...

REPLACEABLE ON-PACKAGE MEMORY DEVICES

CPU SOCKET CONTACT FOR IMPROVING BANDWIDTH THROUGHPUT

RLINK-GROUND SHIELDING ATTACHMENT STRUCTURES AND SHADOW VOIDING FOR...

SOLDER CONTACTS FOR SOCKET ASSEMBLIES

CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES

Universal linear edge connector

SMALL FORM FACTOR SOCKETS AND CONNECTORS

SOLDER CONTACTS FOR SOCKET ASSEMBLIES

SOCKET THAT ENGAGES A PLURALITY OF ELECTRONIC PACKAGES

ELECTRONIC ASSEMBLY THAT INCLUDES A PLURALITY OF ELECTRONIC PACKAGES

CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES

MECHANISM FOR FACILITATING AND EMPLOYING A MAGNETIC GRID ARRAY

SURFACE-MOUNT INDUCTOR STRUCTURES FOR FORMING ONE OR MORE INDUCTORS...

MECHANISM FOR FACILITATING AND EMPLOYING A MAGNETIC GRID ARRAY

SURFACE-MOUNT INDUCTOR STRUCTURES FOR FORMING ONE OR MORE INDUCTORS...