Gregory M. Chapman

Person

Meridian, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Concave face wire bond capillary and method
- Patent number 7,677,429
- Issue date Mar 16, 2010
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Concave face wire bond capillary and method
- Patent number 7,416,107
- Issue date Aug 26, 2008
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a support frame for semiconductor packages
- Patent number 7,271,018
- Issue date Sep 18, 2007
- Micron Technology, Inc.
- Gregory M. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for application of adhesive tape to semiconductor devices
- Patent number 7,087,133
- Issue date Aug 8, 2006
- Micron Technology, Inc.
- Gregory M. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for modifying the configuration of an exposed surface of...
- Patent number 7,087,116
- Issue date Aug 8, 2006
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concave face wire bond capillary and method
- Patent number 6,966,480
- Issue date Nov 22, 2005
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support frame for semiconductor packages
- Patent number 6,956,272
- Issue date Oct 18, 2005
- Micron Technology, Inc.
- Gregory M. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for modifying the configuration of an exposed...
- Patent number 6,890,384
- Issue date May 10, 2005
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for application of adhesive tape to semiconductor devices
- Patent number 6,883,574
- Issue date Apr 26, 2005
- Micron Technology, Inc.
- Gregory M. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying adhesives to a lead frame
- Patent number 6,818,460
- Issue date Nov 16, 2004
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for singulating semiconductor components
- Patent number 6,787,382
- Issue date Sep 7, 2004
- Micron Technology, Inc.
- Jason C. Wing
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Use of a reference fiducial on a semiconductor package to monitor a...
- Patent number 6,744,134
- Issue date Jun 1, 2004
- Micron Technology, Inc.
- Jay Roberts
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for singulating semiconductor components utilizing alignment...
- Patent number 6,683,378
- Issue date Jan 27, 2004
- Micron Technology, Inc.
- Jason C. Wing
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Use of a reference fiducial on a semiconductor package to monitor a...
- Patent number 6,638,831
- Issue date Oct 28, 2003
- Micron Technology, Inc.
- Jay Roberts
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for application of adhesive tape to semiconductor devices
- Patent number 6,623,592
- Issue date Sep 23, 2003
- Micron Technology, Inc.
- Gregory M. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for application of adhesive tape to semiconduc...
- Patent number 6,607,019
- Issue date Aug 19, 2003
- Micron Technology, Inc.
- Gregory M. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concave face wire bond capillary and method
- Patent number 6,595,406
- Issue date Jul 22, 2003
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of applying an adhesive material to lead fingers of a lead f...
- Patent number 6,485,778
- Issue date Nov 26, 2002
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concave face wire bond capillary
- Patent number 6,439,450
- Issue date Aug 27, 2002
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for applying adhesives to a lead frame
- Patent number 6,346,152
- Issue date Feb 12, 2002
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for modifying the configuration of an exposed...
- Patent number 6,336,973
- Issue date Jan 8, 2002
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concave face wire bond capillary
- Patent number 6,311,890
- Issue date Nov 6, 2001
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for application of adhesive tape to semiconduc...
- Patent number 6,267,167
- Issue date Jul 31, 2001
- Micron Technology, Inc.
- Gregory M. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concave face wire bond capillary
- Patent number 6,158,647
- Issue date Dec 12, 2000
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for application of adhesive tape to semiconduc...
- Patent number 6,096,165
- Issue date Aug 1, 2000
- Micron Technology, Inc.
- Gregory M. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying adhesives to a lead frame
- Patent number 6,013,535
- Issue date Jan 11, 2000
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming "J" leads on a semiconductor device
- Patent number 5,375,320
- Issue date Dec 27, 1994
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Out-of-tube inspection part holder
- Patent number 4,977,993
- Issue date Dec 18, 1990
- Micron Technology, Inc.
- Gregory M. Chapman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONCAVE FACE WIRE BOND CAPILLARY AND METHOD
- Publication number 20080302862
- Publication date Dec 11, 2008
- Micron Technology, Inc.
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for application of adhesive tape to semiconductor devices
- Publication number 20060260742
- Publication date Nov 23, 2006
- Gregory M. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Concave face wire bond capillary and method
- Publication number 20060032888
- Publication date Feb 16, 2006
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Blades, saws, and methods for cutting microfeature workpieces
- Publication number 20060005672
- Publication date Jan 12, 2006
- Gregory M. Chapman
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method of forming a support frame for semiconductor packages
- Publication number 20050236699
- Publication date Oct 27, 2005
- Gregory M. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT FRAME FOR SEMICONDUCTOR PACKAGES
- Publication number 20050199974
- Publication date Sep 15, 2005
- Gregory M. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Concave face wire bond capillary and method
- Publication number 20040056072
- Publication date Mar 25, 2004
- Gregory M. Chapman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for application of adhesive tape to semiconductor devices
- Publication number 20040033642
- Publication date Feb 19, 2004
- Gregory M. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for application of adhesive tape to semiconduc...
- Publication number 20040026044
- Publication date Feb 12, 2004
- Gregory M. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR SINGULATING SEMICONDUCTOR COMPONENTS UTILIZING ALIGNMENT...
- Publication number 20030200855
- Publication date Oct 30, 2003
- Jason C. Wing
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Apparatus for modifying the configuration of an exposed surface of...
- Publication number 20030116085
- Publication date Jun 26, 2003
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Concave face wire bond capillary
- Publication number 20020134819
- Publication date Sep 26, 2002
- Gregory M. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of a reference fiducial on a semiconductor package to monitor a...
- Publication number 20020058396
- Publication date May 16, 2002
- Jay Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for applying adhesives to a lead frame
- Publication number 20020029743
- Publication date Mar 14, 2002
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for modifying the configuration of an exposed...
- Publication number 20020029742
- Publication date Mar 14, 2002
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Concave face wire bond capillary
- Publication number 20020023943
- Publication date Feb 28, 2002
- Gregory M. Chapman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for application of adhesive tape to semiconduc...
- Publication number 20010027841
- Publication date Oct 11, 2001
- Gregory M. Chapman
- H01 - BASIC ELECTRIC ELEMENTS

Gregory M. Chapman

Person

Patents Grantslast 30 patents

Concave face wire bond capillary and method

Concave face wire bond capillary and method

Method of forming a support frame for semiconductor packages

Methods for application of adhesive tape to semiconductor devices

Apparatus for modifying the configuration of an exposed surface of...

Concave face wire bond capillary and method

Support frame for semiconductor packages

Apparatus and method for modifying the configuration of an exposed...

Apparatus for application of adhesive tape to semiconductor devices

Method for applying adhesives to a lead frame

Method and system for singulating semiconductor components

Use of a reference fiducial on a semiconductor package to monitor a...

System for singulating semiconductor components utilizing alignment...

Use of a reference fiducial on a semiconductor package to monitor a...

Methods for application of adhesive tape to semiconductor devices

Method and apparatus for application of adhesive tape to semiconduc...

Concave face wire bond capillary and method

Method of applying an adhesive material to lead fingers of a lead f...

Concave face wire bond capillary

Method and apparatus for applying adhesives to a lead frame

Apparatus and method for modifying the configuration of an exposed...

Concave face wire bond capillary

Method and apparatus for application of adhesive tape to semiconduc...

Concave face wire bond capillary

Method and apparatus for application of adhesive tape to semiconduc...

Method for applying adhesives to a lead frame

Method of forming "J" leads on a semiconductor device

Out-of-tube inspection part holder

Patents Applicationslast 30 patents

CONCAVE FACE WIRE BOND CAPILLARY AND METHOD

Methods for application of adhesive tape to semiconductor devices

Concave face wire bond capillary and method

Blades, saws, and methods for cutting microfeature workpieces

Method of forming a support frame for semiconductor packages

SUPPORT FRAME FOR SEMICONDUCTOR PACKAGES

Concave face wire bond capillary and method

Methods for application of adhesive tape to semiconductor devices

Method and apparatus for application of adhesive tape to semiconduc...

SYSTEM FOR SINGULATING SEMICONDUCTOR COMPONENTS UTILIZING ALIGNMENT...

Apparatus for modifying the configuration of an exposed surface of...

Concave face wire bond capillary

Use of a reference fiducial on a semiconductor package to monitor a...

Method and apparatus for applying adhesives to a lead frame

Apparatus and method for modifying the configuration of an exposed...

Concave face wire bond capillary

Method and apparatus for application of adhesive tape to semiconduc...