Gregory R. Martin

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Enhanced high-frequency via interconnection for improved reliability
- Patent number 6,900,395
- Issue date May 31, 2005
- International Business Machines Corporation
- Janet L. Jozwiak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive polymer interconnection configurations
- Patent number 6,858,111
- Issue date Feb 22, 2005
- International Business Machines Corporation
- Charles H. Perry
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming an electrical connector
- Patent number 6,532,654
- Issue date Mar 18, 2003
- International Business Machines Corporation
- Luc Gilbert Guerin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive polymer interconnection configurations
- Patent number 6,333,104
- Issue date Dec 25, 2001
- International Business Machines Corporation
- Charles H. Perry
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical interconnection package and method thereof
- Patent number 6,333,563
- Issue date Dec 25, 2001
- International Business Machines Corporation
- Raymond A. Jackson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for enhancing fatigue life of ball grid arrays
- Patent number 6,283,359
- Issue date Sep 4, 2001
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for enhancing fatigue life of ball grid arrays
- Patent number 6,158,644
- Issue date Dec 12, 2000
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic ball grid array using in-situ solder stretch
- Patent number 5,975,409
- Issue date Nov 2, 1999
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced ceramic ball grid array using in-situ solder stretch with...
- Patent number 5,968,670
- Issue date Oct 19, 1999
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced ceramic ball grid array using in-situ solder stretch with...
- Patent number 5,964,396
- Issue date Oct 12, 1999
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Enhanced high-frequency via interconnection for improved reliability
- Publication number 20040100754
- Publication date May 27, 2004
- International Business Machines Corporation
- Janet J. Jozwiak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming an electrical connector
- Publication number 20020092164
- Publication date Jul 18, 2002
- Luc Gilbert Guerin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive polymer interconnection configurations
- Publication number 20020028327
- Publication date Mar 7, 2002
- Charles H. Perry
- H01 - BASIC ELECTRIC ELEMENTS

Gregory R. Martin

Person

Patents Grantslast 30 patents

Enhanced high-frequency via interconnection for improved reliability

Conductive polymer interconnection configurations

Method of forming an electrical connector

Conductive polymer interconnection configurations

Electrical interconnection package and method thereof

Method for enhancing fatigue life of ball grid arrays

Method for enhancing fatigue life of ball grid arrays

Ceramic ball grid array using in-situ solder stretch

Enhanced ceramic ball grid array using in-situ solder stretch with...

Enhanced ceramic ball grid array using in-situ solder stretch with...

Patents Applicationslast 30 patents

Enhanced high-frequency via interconnection for improved reliability

Method of forming an electrical connector

Conductive polymer interconnection configurations