Gretchen Adema

Person

Raleigh, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device, electronic module and methods for fabricating th...
- Patent number 11,615,963
- Issue date Mar 28, 2023
- Infineon Technologies AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, electronic module and methods for fabricating th...
- Patent number 10,741,402
- Issue date Aug 11, 2020
- Infineon Technologies AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder structures including barrier layers with nickel and/or copper
- Patent number 7,839,000
- Issue date Nov 23, 2010
- Unitive International Limited
- J. Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming lead free solder bumps
- Patent number 7,547,623
- Issue date Jun 16, 2009
- Unitive International Limited
- J. Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump fabrication methods and structures including a titanium...
- Patent number 6,222,279
- Issue date Apr 24, 2001
- MCNC
- Joseph Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic module having optical and electrical interconnects
- Patent number 5,923,796
- Issue date Jul 13, 1999
- MCNC
- Michael R. Feldman
- G02 - OPTICS
Information Patent Grant
Solder bump fabrication methods and structure including a titanium...
- Patent number 5,767,010
- Issue date Jun 16, 1998
- MCNC
- Joseph Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic module having optical and electrical interconnects
- Patent number 5,638,469
- Issue date Jun 10, 1997
- MCNC
- Michael R. Feldman
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...
- Publication number 20200343094
- Publication date Oct 29, 2020
- INFINEON TECHNOLOGIES AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...
- Publication number 20180082848
- Publication date Mar 22, 2018
- INFINEON TECHNOLOGIES AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS METALLIC FILM AS DIE ATTACH AND INTERCONNECT
- Publication number 20170092611
- Publication date Mar 30, 2017
- Infineon Technologies Americas Corp.
- Gretchen Adema
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Porous Metallic Film as Die Attach and Interconnect
- Publication number 20130256894
- Publication date Oct 3, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Gretchen Adema
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Structures Including Barrier Layers with Nickel and/or Copper
- Publication number 20090212427
- Publication date Aug 27, 2009
- UNITIVE INTERNATIONAL LIMITED
- J. Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming lead free solder bumps and related structures
- Publication number 20060030139
- Publication date Feb 9, 2006
- J. Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS

Gretchen Adema

Person

Patents Grantslast 30 patents

Electronic device, electronic module and methods for fabricating th...

Electronic device, electronic module and methods for fabricating th...

Solder structures including barrier layers with nickel and/or copper

Methods of forming lead free solder bumps

Solder bump fabrication methods and structures including a titanium...

Microelectronic module having optical and electrical interconnects

Solder bump fabrication methods and structure including a titanium...

Microelectronic module having optical and electrical interconnects

Patents Applicationslast 30 patents

ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...

ELECTRONIC DEVICE, ELECTRONIC MODULE AND METHODS FOR FABRICATING TH...

POROUS METALLIC FILM AS DIE ATTACH AND INTERCONNECT

Porous Metallic Film as Die Attach and Interconnect

Solder Structures Including Barrier Layers with Nickel and/or Copper

Methods of forming lead free solder bumps and related structures