Guenther Schindler

Person

Munich, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Chip edge sealing
- Patent number 9,054,150
- Issue date Jun 9, 2015
- Infineon Technologies AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect arrangement and associated production methods
- Patent number 8,877,631
- Issue date Nov 4, 2014
- Infineon Technologies AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM capacitor and associated production method
- Patent number 8,709,906
- Issue date Apr 29, 2014
- Infineon Technologies AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM capacitor and associated production method
- Patent number 8,093,637
- Issue date Jan 10, 2012
- Infineon Technologies AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a layer arrangement and layer arrangement
- Patent number 7,807,563
- Issue date Oct 5, 2010
- Infineon Technologies AG
- Zvonimir Gabric
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma excited chemical vapor deposition method silicon/oxygen/nitr...
- Patent number 7,755,160
- Issue date Jul 13, 2010
- Infineon Technologies AG
- Zvonimir Gabric
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interconnect arrangement and method for fabricating an interconnect...
- Patent number 6,888,244
- Issue date May 3, 2005
- Infineon Technologies AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a ferroelectric layer
- Patent number 6,790,676
- Issue date Sep 14, 2004
- Infineon Technologies AG
- Hans Cerva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electrically conducting connection
- Patent number 6,708,405
- Issue date Mar 23, 2004
- Infineon Technologies AG
- Barbara Hasler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage component with storage cells, logic areas and...
- Patent number 6,670,662
- Issue date Dec 30, 2003
- Infineon Technologies, AG
- Christine Dehm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture of a capacitor with a dielectric on the basis...
- Patent number 6,455,328
- Issue date Sep 24, 2002
- Infineon Technologies AG
- Harald Bachhofer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP EDGE SEALING
- Publication number 20140077262
- Publication date Mar 20, 2014
- INFINEON TECHNOLOGIES AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM CAPACITOR AND ASSOCIATED PRODUCTION METHOD
- Publication number 20120100689
- Publication date Apr 26, 2012
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect arrangement and associated production methods
- Publication number 20110217839
- Publication date Sep 8, 2011
- Manfred ENGELHARDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma Excited Chemical Vapor Deposition Method Silicon/Oxygen/Nitr...
- Publication number 20080308898
- Publication date Dec 18, 2008
- Zvonimir Gabric
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for manufacturing a layer arrangement and layer arrangement
- Publication number 20070246831
- Publication date Oct 25, 2007
- Zvonimir Gabric
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING A MULTILAYER CAPACITANCE ARRANGEMENT
- Publication number 20070216030
- Publication date Sep 20, 2007
- INFINEON TECHNOLOGIES AG
- Guenther Schindler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductor track arrangement and associated production method
- Publication number 20070120263
- Publication date May 31, 2007
- Zvonimir Gabric
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM capacitor and associated production method
- Publication number 20070111431
- Publication date May 17, 2007
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect arrangement and associated production methods
- Publication number 20060199368
- Publication date Sep 7, 2006
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect arrangement and method for fabricating an interconnect...
- Publication number 20040113274
- Publication date Jun 17, 2004
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing capacitor structures
- Publication number 20030139006
- Publication date Jul 24, 2003
- Hartner Walter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a ferroelectric layer
- Publication number 20030138977
- Publication date Jul 24, 2003
- Hans Cerva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing an electrically conducting connection
- Publication number 20020032962
- Publication date Mar 21, 2002
- Barbara Hasler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacture of a capacitor with a dielectric on the basis...
- Publication number 20020019108
- Publication date Feb 14, 2002
- Infineon Technologies, AG
- Harald Bachhofer
- H01 - BASIC ELECTRIC ELEMENTS

Guenther Schindler

Person

Patents Grantslast 30 patents

Chip edge sealing

Interconnect arrangement and associated production methods

MIM capacitor and associated production method

MIM capacitor and associated production method

Method for manufacturing a layer arrangement and layer arrangement

Plasma excited chemical vapor deposition method silicon/oxygen/nitr...

Interconnect arrangement and method for fabricating an interconnect...

Method for producing a ferroelectric layer

Method for producing an electrically conducting connection

Semiconductor storage component with storage cells, logic areas and...

Method of manufacture of a capacitor with a dielectric on the basis...

Patents Applicationslast 30 patents

CHIP EDGE SEALING

MIM CAPACITOR AND ASSOCIATED PRODUCTION METHOD

Interconnect arrangement and associated production methods

Plasma Excited Chemical Vapor Deposition Method Silicon/Oxygen/Nitr...

Method for manufacturing a layer arrangement and layer arrangement

INTEGRATED CIRCUIT HAVING A MULTILAYER CAPACITANCE ARRANGEMENT

Conductor track arrangement and associated production method

MIM capacitor and associated production method

Interconnect arrangement and associated production methods

Interconnect arrangement and method for fabricating an interconnect...

Method for producing capacitor structures

Method for producing a ferroelectric layer

Method for producing an electrically conducting connection

Method of manufacture of a capacitor with a dielectric on the basis...