Gunter Tutsch

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Patents Grantslast 30 patents

Information Patent Grant
Modularly expandable multi-layered semiconductor component
- Patent number 6,630,727
- Issue date Oct 7, 2003
- Infineon Technologies AG
- Günter Tutsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with a number of substrate layers and at le...
- Patent number 6,380,616
- Issue date Apr 30, 2002
- Infineon Technologies AG
- Günter Tutsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element having a carrying device and a lead frame and...
- Patent number 6,036,173
- Issue date Mar 14, 2000
- Siemens Aktiengesellschaft
- Achim Neu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for producing a BGA chip module and BGA chip module
- Publication number 20050239237
- Publication date Oct 27, 2005
- Infineon Technologies AG
- Frank Puschner
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...