Number | Date | Country | Kind |
---|---|---|---|
198 01 312 | Jan 1998 | DE |
This is a continuation of copending international application PCT/DE99/00069, filed Jan. 14, 1999, which designated the United States.
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5708297 | Clayton | Jan 1998 | A |
5726492 | Suzuki et al. | Mar 1998 | A |
5786628 | Beilstein et al. | Jul 1998 | A |
5923080 | Chun | Jul 1999 | A |
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3838085 | May 1990 | DE |
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0575806 | Dec 1993 | EP |
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Entry |
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Published International Application No. 95/05005 (Contolatis et al.), dated Feb. 16, 1995. |
“Kompakte Leiterplatten durch Plasma-Bohren”, Wakter Schmidt, Carl Hanser Verlag, München, F & M 104, 1996, pp. 844-848. |
“A New Approach to Using Anisotropically Conductive Adhesives for Flip-Chip Assembly”, Alan M. Lyons et al., IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, vol. 19, No. 1, Mar. 1990, pp. 5-11. |
“Mechanism of Electrical Conduction Through Anisotropically Conductive Adhesive Films”, Masuo Mizuno et al., IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, vol. 19, No. 4, Dec. 1996, pp. 546-553. |
Number | Date | Country | |
---|---|---|---|
Parent | PCT/DE99/00069 | Jan 1999 | US |
Child | 09/617652 | US |