Guo-Cheng Liao

Person

Kaohsiung County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,261,350
- Issue date Mar 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,721,884
- Issue date Aug 8, 2023
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,670,836
- Issue date Jun 6, 2023
- Advanced Semiconductor Engineering, Inc.
- Ting Ruei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,404,799
- Issue date Aug 2, 2022
- Advanced Semiconductor Engineering, Inc.
- Ting Ruei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,362,049
- Issue date Jun 14, 2022
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,296,001
- Issue date Apr 5, 2022
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,217,509
- Issue date Jan 4, 2022
- Advanced Semiconductor Engineering, Inc.
- Jyun-Chi Jhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure and semiconductor package structure including t...
- Patent number 11,107,777
- Issue date Aug 31, 2021
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,971,798
- Issue date Apr 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 10,847,470
- Issue date Nov 24, 2020
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and semiconductor package structure having...
- Patent number 9,978,705
- Issue date May 22, 2018
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and semiconductor package structure having...
- Patent number 9,437,565
- Issue date Sep 6, 2016
- ADVANCED SEMINCONDUCTOR ENGINEERING, INC.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and method for making the same
- Patent number 9,117,697
- Issue date Aug 25, 2015
- Advanced Semiconductor Engineering, Inc.
- Chun-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having increased input/output capacity and r...
- Patent number 8,531,017
- Issue date Sep 10, 2013
- Advanced Semiconductor Engineering, Inc.
- Guo-cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with buried conductive trace formed thereon and metho...
- Patent number 8,115,104
- Issue date Feb 14, 2012
- Advanced Semiconductor Engineering, Inc.
- Guo Cheng Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via hole structure with a conductive layer formed therein
- Patent number 7,999,389
- Issue date Aug 16, 2011
- Advanced Semiconductor Engineering, Inc.
- Guo-cheng Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method and structure for a substrate with vertically...
- Patent number 7,994,429
- Issue date Aug 9, 2011
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
CTS and inspecting method thereof
- Patent number 7,816,608
- Issue date Oct 19, 2010
- Advanced Semiconductor Engineering, Inc.,
- Guo-Cheng Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate strip, metal surface treatment method thereof and...
- Patent number 7,763,982
- Issue date Jul 27, 2010
- Advanced Semiconductor Engineering, Inc.
- Guo-cheng Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230402738
- Publication date Dec 14, 2023
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220140467
- Publication date May 5, 2022
- Advanced Semiconductor Engineering, Inc.
- Ting Ruei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210226317
- Publication date Jul 22, 2021
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20210225742
- Publication date Jul 22, 2021
- Advanced Semiconductor Engineering, Inc.
- Jyun-Chi JHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND ASSEMBLY STRUCTURE
- Publication number 20210225741
- Publication date Jul 22, 2021
- Advanced Semiconductor Engineering, Inc.
- I-Jen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20210202410
- Publication date Jul 1, 2021
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210125945
- Publication date Apr 29, 2021
- Advanced Semiconductor Engineering, Inc.
- Ting Ruei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200127366
- Publication date Apr 23, 2020
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200126881
- Publication date Apr 23, 2020
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING T...
- Publication number 20190363056
- Publication date Nov 28, 2019
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190244907
- Publication date Aug 8, 2019
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR PACKAGE STRUCTURE HAVING...
- Publication number 20160336287
- Publication date Nov 17, 2016
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Guo-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR PACKAGE STRUCTURE HAVING...
- Publication number 20160190079
- Publication date Jun 30, 2016
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Guo-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD FOR MAKING THE SAME
- Publication number 20140367837
- Publication date Dec 18, 2014
- Chun-Che LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING INCREASED INPUT/OUTPUT CAPACITY AND R...
- Publication number 20140001621
- Publication date Jan 2, 2014
- Advanced Semiconductor Engineering, Inc.
- Guo-cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING INCREASED INPUT/OUTPUT CAPACITY AND R...
- Publication number 20120061808
- Publication date Mar 15, 2012
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH BURIED CONDUCTIVE TRACE FORMED THEREON AND METHO...
- Publication number 20090308647
- Publication date Dec 17, 2009
- Advanced Semiconductor Engineering, Inc.
- Guo Cheng LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH BURIED CONDUCTIVE TRACE FORMED THEREON AND METHO...
- Publication number 20090288861
- Publication date Nov 26, 2009
- Advanced Semiconductor Engineering, Inc.
- Guo Cheng LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CTS AND INSPECTING METHOD THEREOF
- Publication number 20090034680
- Publication date Feb 5, 2009
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- G01 - MEASURING TESTING
Information Patent Application
PACKAGE SUBSTRATE STRIP, METAL SURFACE TREATMENT METHOD THEREOF AND...
- Publication number 20080217758
- Publication date Sep 11, 2008
- Advanced Semiconductor Engineering, Inc.
- Guo-cheng Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Via hole structure and manufacturing method thereof
- Publication number 20080211107
- Publication date Sep 4, 2008
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE, METHOD OF FABRICATING THE SAME AND CHIP PACKAGE
- Publication number 20080179740
- Publication date Jul 31, 2008
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20080157305
- Publication date Jul 3, 2008
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR FABRICATING PASSIVE CIRCUIT IN CIRCUIT SUBSTRATE
- Publication number 20080060194
- Publication date Mar 13, 2008
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD AND STRUCTURE FOR A SUBSTRATE WITH VERTICALLY...
- Publication number 20080053690
- Publication date Mar 6, 2008
- Guo-Cheng Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Common Assembly Substrate and Applications Thereof
- Publication number 20070235870
- Publication date Oct 11, 2007
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS

Guo-Cheng Liao

Person

Patents Grantslast 30 patents

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor device package

Semiconductor device package and method of manufacturing the same

Semiconductor device package

Semiconductor device package and method of manufacturing the same

Semiconductor package structure

Substrate structure and semiconductor package structure including t...

Semiconductor device package and method of manufacturing the same

Semiconductor package structure and method for manufacturing the same

Semiconductor substrate and semiconductor package structure having...

Semiconductor substrate and semiconductor package structure having...

Semiconductor substrate and method for making the same

Semiconductor packages having increased input/output capacity and r...

Circuit board with buried conductive trace formed thereon and metho...

Via hole structure with a conductive layer formed therein

Manufacturing method and structure for a substrate with vertically...

CTS and inspecting method thereof

Package substrate strip, metal surface treatment method thereof and...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE

LEAD FRAME AND ASSEMBLY STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING T...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR PACKAGE STRUCTURE HAVING...

SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR PACKAGE STRUCTURE HAVING...

SEMICONDUCTOR SUBSTRATE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR PACKAGES HAVING INCREASED INPUT/OUTPUT CAPACITY AND R...

SEMICONDUCTOR PACKAGES HAVING INCREASED INPUT/OUTPUT CAPACITY AND R...

CIRCUIT BOARD WITH BURIED CONDUCTIVE TRACE FORMED THEREON AND METHO...

CIRCUIT BOARD WITH BURIED CONDUCTIVE TRACE FORMED THEREON AND METHO...

CTS AND INSPECTING METHOD THEREOF

PACKAGE SUBSTRATE STRIP, METAL SURFACE TREATMENT METHOD THEREOF AND...

Via hole structure and manufacturing method thereof

PACKAGE SUBSTRATE, METHOD OF FABRICATING THE SAME AND CHIP PACKAGE

CHIP PACKAGE STRUCTURE

METHOD FOR FABRICATING PASSIVE CIRCUIT IN CIRCUIT SUBSTRATE

MANUFACTURING METHOD AND STRUCTURE FOR A SUBSTRATE WITH VERTICALLY...

Common Assembly Substrate and Applications Thereof