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Multiprocessor module packaging
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Patent number 5,391,917
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Issue date Feb 21, 1995
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International Business Machines Corporation
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Richard J. Gilmour
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H01 - BASIC ELECTRIC ELEMENTS
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Stacked DCA memory chips
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Patent number 5,252,857
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Issue date Oct 12, 1993
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International Business Machines Corporation
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Milburn H. Kane
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H01 - BASIC ELECTRIC ELEMENTS
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Formulation of multichip modules
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Patent number 5,239,448
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Issue date Aug 24, 1993
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International Business Machines Corporation
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Charles T. Perkins
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H01 - BASIC ELECTRIC ELEMENTS
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Soldering method
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Patent number 4,967,950
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Issue date Nov 6, 1990
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International Business Machines Corporation
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Stephen P. Legg
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H01 - BASIC ELECTRIC ELEMENTS
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