Guy Hudson

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and methods for selective removal of material from wafer...
- Patent number 8,053,371
- Issue date Nov 8, 2011
- Micron Technology, Inc.
- Russell C. Zahorik
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Contact integration method
- Patent number 7,294,570
- Issue date Nov 13, 2007
- Micron Technology, Inc.
- Richard L. Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for selective removal of material from wafer alignment marks
- Patent number 7,244,681
- Issue date Jul 17, 2007
- Micron Technology, Inc.
- Guy F. Hudson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling pH during planarization and cleaning of micr...
- Patent number 7,214,125
- Issue date May 8, 2007
- Micron Technology, Inc.
- Judson R. Sharples
- B24 - GRINDING POLISHING
Information Patent Grant
Low friction polish-stop stratum for endpointing chemical-mechanica...
- Patent number RE39413
- Issue date Nov 28, 2006
- Micron Technology, Inc.
- Guy F. Hudson
- 438 - Semiconductor device manufacturing: process
Information Patent Grant
Methods for using bi-modal abrasive slurries for mechanical and che...
- Patent number 7,122,475
- Issue date Oct 17, 2006
- Micron Technology, Inc.
- Guy F. Hudson
- B24 - GRINDING POLISHING
Information Patent Grant
Method for post chemical-mechanical planarization cleaning of semic...
- Patent number 7,045,017
- Issue date May 16, 2006
- Micron Technology, Inc.
- David Gonzales
- B08 - CLEANING
Information Patent Grant
Method for controlling pH during planarization and cleaning of micr...
- Patent number 6,913,523
- Issue date Jul 5, 2005
- Micron Technology, Inc.
- Judson R. Sharples
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for selective removal of material from wafer alignment marks
- Patent number 6,889,698
- Issue date May 10, 2005
- Micron Technology, Inc.
- Russell C. Zahorik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of planarizing by removing all or part of an oxidizable mate...
- Patent number 6,803,316
- Issue date Oct 12, 2004
- Micron Technology, Inc.
- Guy F. Hudson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatuses for making and using bi-modal abrasive slurr...
- Patent number 6,794,289
- Issue date Sep 21, 2004
- Micron Technology, Inc.
- Guy F. Hudson
- B24 - GRINDING POLISHING
Information Patent Grant
Method for controlling pH during planarization and cleaning of micr...
- Patent number 6,716,089
- Issue date Apr 6, 2004
- Micron Technology, Inc.
- Judson R. Sharples
- B24 - GRINDING POLISHING
Information Patent Grant
Contact integration method
- Patent number 6,713,384
- Issue date Mar 30, 2004
- Micron Technology, Inc.
- Richard L. Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for post chemical-mechanical planarization cleaning of semic...
- Patent number 6,640,816
- Issue date Nov 4, 2003
- Micron Technology, Inc.
- David Gonzales
- B08 - CLEANING
Information Patent Grant
Method of removing material from a semiconductor substrate
- Patent number 6,635,574
- Issue date Oct 21, 2003
- Micron Technology, Inc.
- Guy F. Hudson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for selective removal of material from wafer alignment marks
- Patent number 6,610,610
- Issue date Aug 26, 2003
- Micron Technology, Inc.
- Russell C. Zahorik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact integration article
- Patent number 6,593,657
- Issue date Jul 15, 2003
- Micron Technology, Inc.
- Richard L. Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for selective removal of material from wafer alignment marks
- Patent number 6,530,113
- Issue date Mar 11, 2003
- Micron Technology, Inc.
- Russell C. Zahorik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for selective removal of material from wafer a...
- Patent number 6,447,634
- Issue date Sep 10, 2002
- Micron Technology, Inc.
- Russell C. Zahorik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for predicting process characteristics of poly...
- Patent number 6,440,319
- Issue date Aug 27, 2002
- Micron Technology, Inc.
- Scott G. Meikle
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatuses for making and using bi-modal abrasive slurr...
- Patent number 6,407,000
- Issue date Jun 18, 2002
- Micron Technology, Inc.
- Guy F. Hudson
- B24 - GRINDING POLISHING
Information Patent Grant
Planarization process with abrasive polishing slurry that is select...
- Patent number 6,379,225
- Issue date Apr 30, 2002
- Micron Technology, Inc.
- Karl M. Robinson
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for controlling PH during planarization and cleaning of m...
- Patent number 6,368,194
- Issue date Apr 9, 2002
- Micron Technology, Inc.
- Judson R. Sharples
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for selective removal of material from wafer a...
- Patent number 6,329,301
- Issue date Dec 11, 2001
- Micron Technology, Inc.
- Russell C. Zahorik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for post chemical-mechanical planarization cleaning of semic...
- Patent number 6,273,101
- Issue date Aug 14, 2001
- Micron Technology, Inc.
- David Gonzales
- B08 - CLEANING
Information Patent Grant
Method for controlling pH during planarization and cleaning of micr...
- Patent number 6,220,934
- Issue date Apr 24, 2001
- Micron Technology, Inc.
- Judson R. Sharples
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing polymer surfaces on non-porous CMP pads
- Patent number 6,200,901
- Issue date Mar 13, 2001
- Micron Technology, Inc.
- Guy F. Hudson
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method and apparatus for predicting process characteristics of poly...
- Patent number 6,114,706
- Issue date Sep 5, 2000
- Micron Technology, Inc.
- Scott G. Meikle
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for selective removal of material from wafer a...
- Patent number 6,103,636
- Issue date Aug 15, 2000
- Micron Technology, Inc.
- Russell C. Zahorik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization process with abrasive polishing slurry that is select...
- Patent number 6,062,952
- Issue date May 16, 2000
- Karl M. Robinson
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Methods for selective removal of material from wafer alignment marks
- Publication number 20070207613
- Publication date Sep 6, 2007
- Russell C. Zahorik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONTROLLING PH DURING PLANARIZATION AND CLEANING OF MICR...
- Publication number 20060011585
- Publication date Jan 19, 2006
- Judson R. Sharples
- B24 - GRINDING POLISHING
Information Patent Application
Systems for making and using bi-modal abrasive slurries for mechani...
- Publication number 20040229551
- Publication date Nov 18, 2004
- Guy F. Hudson
- B24 - GRINDING POLISHING
Information Patent Application
Methods for using bi-modal abrasive slurries for mechanical and che...
- Publication number 20040198194
- Publication date Oct 7, 2004
- Guy F. Hudson
- B24 - GRINDING POLISHING
Information Patent Application
Apparatuses for making and using bi-modal abrasive slurries for mec...
- Publication number 20040198195
- Publication date Oct 7, 2004
- Guy F. Hudson
- B24 - GRINDING POLISHING
Information Patent Application
Method for controlling PH during planarization and cleaning of micr...
- Publication number 20040192174
- Publication date Sep 30, 2004
- Judson R. Sharples
- B24 - GRINDING POLISHING
Information Patent Application
Contact integration method
- Publication number 20040180535
- Publication date Sep 16, 2004
- Micron Technology, Inc.
- Richard L. Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for post chemical-mechanical planarization cleaning of semic...
- Publication number 20040089326
- Publication date May 13, 2004
- David Gonzales
- B08 - CLEANING
Information Patent Application
Methods for selective removal of material from wafer alignment marks
- Publication number 20040038543
- Publication date Feb 26, 2004
- Russell C. Zahorik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polishing polymer surfaces on nonporous CMP pads
- Publication number 20030207577
- Publication date Nov 6, 2003
- Guy F. Hudson
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Apparatus for selective removal of material from wafer alignment marks
- Publication number 20030121538
- Publication date Jul 3, 2003
- Russell C. Zahorik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for selective removal of material from wafer a...
- Publication number 20020144720
- Publication date Oct 10, 2002
- Russell C. Zahorik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatuses for making and using bi-modal abrasive slurr...
- Publication number 20020146907
- Publication date Oct 10, 2002
- Guy F. Hudson
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method and apparatus for selective removal of material from wafer a...
- Publication number 20020025687
- Publication date Feb 28, 2002
- Russell C. Zahorik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for controlling pH during planarization and cl...
- Publication number 20020019197
- Publication date Feb 14, 2002
- Judson R. Sharples
- B24 - GRINDING POLISHING
Information Patent Application
Method for post chemical-mechanical planarization cleaning of semic...
- Publication number 20020011255
- Publication date Jan 31, 2002
- David Gonzales
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polishing polymer surfaces on non-porous CMP pads
- Publication number 20010007796
- Publication date Jul 12, 2001
- Guy F. Hudson
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Apparatus and methods for selective removal of material from wafer...

Contact integration method

Methods for selective removal of material from wafer alignment marks

Method for controlling pH during planarization and cleaning of micr...

Low friction polish-stop stratum for endpointing chemical-mechanica...

Methods for using bi-modal abrasive slurries for mechanical and che...

Method for post chemical-mechanical planarization cleaning of semic...

Method for controlling pH during planarization and cleaning of micr...

Apparatus for selective removal of material from wafer alignment marks

Method of planarizing by removing all or part of an oxidizable mate...

Method and apparatuses for making and using bi-modal abrasive slurr...

Method for controlling pH during planarization and cleaning of micr...

Contact integration method

Method for post chemical-mechanical planarization cleaning of semic...

Method of removing material from a semiconductor substrate

Methods for selective removal of material from wafer alignment marks

Contact integration article

Apparatus for selective removal of material from wafer alignment marks

Method and apparatus for selective removal of material from wafer a...

Method and apparatus for predicting process characteristics of poly...

Method and apparatuses for making and using bi-modal abrasive slurr...

Planarization process with abrasive polishing slurry that is select...

Apparatus for controlling PH during planarization and cleaning of m...

Method and apparatus for selective removal of material from wafer a...

Method for post chemical-mechanical planarization cleaning of semic...

Method for controlling pH during planarization and cleaning of micr...

Polishing polymer surfaces on non-porous CMP pads

Method and apparatus for predicting process characteristics of poly...

Method and apparatus for selective removal of material from wafer a...

Planarization process with abrasive polishing slurry that is select...

Patents Applicationslast 30 patents

Methods for selective removal of material from wafer alignment marks

METHOD FOR CONTROLLING PH DURING PLANARIZATION AND CLEANING OF MICR...

Systems for making and using bi-modal abrasive slurries for mechani...

Methods for using bi-modal abrasive slurries for mechanical and che...

Apparatuses for making and using bi-modal abrasive slurries for mec...

Method for controlling PH during planarization and cleaning of micr...

Contact integration method

Method for post chemical-mechanical planarization cleaning of semic...

Methods for selective removal of material from wafer alignment marks

Polishing polymer surfaces on nonporous CMP pads

Apparatus for selective removal of material from wafer alignment marks

Method and apparatus for selective removal of material from wafer a...

Method and apparatuses for making and using bi-modal abrasive slurr...

Method and apparatus for selective removal of material from wafer a...

Method and apparatus for controlling pH during planarization and cl...

Method for post chemical-mechanical planarization cleaning of semic...

Polishing polymer surfaces on non-porous CMP pads