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Gwo-Shyan Sheu

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  • Kaohsiung City, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Layout structure of a flexible circuit board
    • Patent number 11,812,554
    • Issue date Nov 7, 2023
    • Chipbond Technology Corporation
    • Yu-Chen Ma
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Flexible circuit board
    • Patent number 11,606,860
    • Issue date Mar 14, 2023
    • Chipbond Technology Corporation
    • Gwo-Shyan Sheu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Flip chip package and circuit board thereof
    • Patent number 11,581,283
    • Issue date Feb 14, 2023
    • Chipbond Technology Corporation
    • Yu-Chen Ma
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Flip chip interconnection and circuit board thereof
    • Patent number 11,322,437
    • Issue date May 3, 2022
    • Chipbond Technology Corporation
    • Yu-Chen Ma
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Layout structure of a flexible circuit board
    • Patent number 11,309,238
    • Issue date Apr 19, 2022
    • Chipbond Technology Corporation
    • Yu-Chen Ma
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Circuit board
    • Patent number 10,999,928
    • Issue date May 4, 2021
    • Chipbond Technology Corporation
    • Yu-Chen Ma
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Chip package and circuit board thereof
    • Patent number 10,993,319
    • Issue date Apr 27, 2021
    • Chipbond Technology Corporation
    • Yu-Chen Ma
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Thin flip chip package structure
    • Patent number 8,497,571
    • Issue date Jul 30, 2013
    • Chipbond Technology Corporation
    • Chin-Tang Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Thin flip chip package structure
    • Patent number 8,471,372
    • Issue date Jun 25, 2013
    • Chipbound Technology Corporation
    • Chin-Tang Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    FLEXIBLE CIRCUIT BOARD
    • Publication number 20250071889
    • Publication date Feb 27, 2025
    • Chipbond Technology Corporation
    • Kung-Tzu Tu
    • G01 - MEASURING TESTING
  • Information Patent Application

    THIN FILM CIRCUIT BOARD
    • Publication number 20240389224
    • Publication date Nov 21, 2024
    • Chipbond Technology Corporation
    • Kung-Tzu Tu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20240074041
    • Publication date Feb 29, 2024
    • Chipbond Technology Corporation
    • Gwo-Shyan Sheu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230163061
    • Publication date May 25, 2023
    • Chipbond Technology Corporation
    • Yu-Chen Ma
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LAYOUT STRUCTURE OF FLEXIBLE CIRCUIT BOARD
    • Publication number 20230044345
    • Publication date Feb 9, 2023
    • Chipbond Technology Corporation
    • Yu-Chen Ma
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLEXIBLE CIRCUIT BOARD
    • Publication number 20220225496
    • Publication date Jul 14, 2022
    • Chipbond Technology Corporation
    • Gwo-Shyan Sheu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LAYOUT STRUCTURE OF A FLEXIBLE CIRCUIT BOARD
    • Publication number 20220104354
    • Publication date Mar 31, 2022
    • Chipbond Technology Corporation
    • Yu-Chen Ma
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LAYOUT STRUCTURE OF A FLEXIBLE CIRCUIT BOARD
    • Publication number 20220037238
    • Publication date Feb 3, 2022
    • Chipbond Technology Corporation
    • Yu-Chen Ma
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLIP CHIP INTERCONNECTION AND CIRCUIT BOARD THEREOF
    • Publication number 20210265255
    • Publication date Aug 26, 2021
    • Chipbond Technology Corporation
    • Yu-Chen Ma
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE AND CIRCUIT BOARD THEREOF
    • Publication number 20210257287
    • Publication date Aug 19, 2021
    • Chipbond Technology Corporation
    • Yu-Chen Ma
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLIP CHIP INTERCONNECTION AND CIRCUIT BOARD THEREOF
    • Publication number 20210202422
    • Publication date Jul 1, 2021
    • Chipbond Technology Corporation
    • Yu-Chen Ma
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLEXIBLE CIRCUIT BOARD HAVING A STIFFENING STRUCTURE
    • Publication number 20210204401
    • Publication date Jul 1, 2021
    • Chipbond Technology Corporation
    • Yu-Chen Ma
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    THIN FLIP CHIP PACKAGE STRUCTURE
    • Publication number 20120080783
    • Publication date Apr 5, 2012
    • Chin-Tang Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THIN FLIP CHIP PACKAGE STRUCTURE
    • Publication number 20120074545
    • Publication date Mar 29, 2012
    • Chin-Tang Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS