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H. Peter W. Hey
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Sunnyvale, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Flow diffuser to be used in electro-chemical plating system and method
Patent number
6,585,876
Issue date
Jul 1, 2003
Applied Materials Inc.
Yezdi N. Dordi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Reverse voltage bias for electro-chemical plating system and method
Patent number
6,551,484
Issue date
Apr 22, 2003
Applied Materials, Inc.
H. Peter W. Hey
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Segmenting of processing system into wet and dry areas
Patent number
6,551,488
Issue date
Apr 22, 2003
Applied Materials, Inc.
H. Peter W. Hey
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Interconnect line formed by dual damascene using dielectric layers...
Patent number
6,514,671
Issue date
Feb 4, 2003
Applied Materials, Inc.
Suketu A. Parikh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Deposition rate control on wafers with varying characteristics
Patent number
6,130,105
Issue date
Oct 10, 2000
Applied Materials, Inc.
Gregory F. Redinbo
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method and apparatus for improving film deposition uniformity on a...
Patent number
6,022,587
Issue date
Feb 8, 2000
Applied Materials, Inc.
H. Peter W. Hey
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
Information
Patent Application
Dynamic pulse plating for high aspect ratio features
Publication number
20030019755
Publication date
Jan 30, 2003
APPLIED MATERIALS, INC.
H. Peter W. Hey
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR