Habib Hichri

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
ARC residue-free etching
- Patent number 9,064,848
- Issue date Jun 23, 2015
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Xiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for simultaneously forming features of different depths in a...
- Patent number 8,901,005
- Issue date Dec 2, 2014
- International Business Machines Corporation
- Habib Hichri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ARC residue-free etching
- Patent number 8,901,006
- Issue date Dec 2, 2014
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Xiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce depth delta between dense and wide features in dua...
- Patent number 8,822,342
- Issue date Sep 2, 2014
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ravi Prakash Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive metal and diffusion barrier seed compositions, and metho...
- Patent number 8,735,284
- Issue date May 27, 2014
- International Business Machines Corporation
- Kelly Malone
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Conductive metal and diffusion barrier seed compositions, and metho...
- Patent number 8,647,535
- Issue date Feb 11, 2014
- International Business Machines Corporation
- Kelly Malone
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit system with reduced polysilicon residue and meth...
- Patent number 8,642,475
- Issue date Feb 4, 2014
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Xiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for simultaneously forming features of different depths in a...
- Patent number 8,492,280
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Habib Hichri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical inspection methods
- Patent number 8,168,451
- Issue date May 1, 2012
- International Business Machines Corporation
- Colin J. Brodsky
- G01 - MEASURING TESTING
Information Patent Grant
Liner protection in deep trench etching
- Patent number 8,030,157
- Issue date Oct 4, 2011
- International Business Machines Corporation
- Habib Hichri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical inspection methods
- Patent number 7,645,621
- Issue date Jan 12, 2010
- International Business Machines Corporation
- Colin Brodsky
- G01 - MEASURING TESTING
Information Patent Grant
Method for integrating liner formation in back end of line processing
- Patent number 7,544,609
- Issue date Jun 9, 2009
- International Business Machines Corporation
- Matthew S. Angyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deflection analysis system and method for circuit design
- Patent number 7,475,368
- Issue date Jan 6, 2009
- International Business Machines Corporation
- Matthew S. Angyal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Building metal pillars in a chip for structure support
- Patent number 7,456,098
- Issue date Nov 25, 2008
- International Business Machines Corporation
- Habib Hichri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Like integrated circuit devices with different depth
- Patent number 7,279,426
- Issue date Oct 9, 2007
- International Business Machines Corporation
- Habib Hichri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing damage to ulk dielectric during cross-linked polymer removal
- Patent number 7,253,100
- Issue date Aug 7, 2007
- International Business Machines Corporation
- Ronald A. DellaGuardia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlevel dielectric layer and metal layer sealing
- Patent number 7,214,608
- Issue date May 8, 2007
- International Business Machines Corporation
- Matthew S. Angyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable low-k interconnect structure with hybrid dielectric
- Patent number 7,135,398
- Issue date Nov 14, 2006
- International Business Machines Corporation
- John A. Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Building metal pillars in a chip for structure support
- Patent number 7,067,902
- Issue date Jun 27, 2006
- International Business Machines Corporation
- Habib Hichri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-k interlevel dielectric layer (ILD)
- Patent number 7,009,280
- Issue date Mar 7, 2006
- International Business Machines Corporation
- Matthew Angyal
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reliable low-k interconnect structure with hybrid dielectric
- Patent number 6,917,108
- Issue date Jul 12, 2005
- International Business Machines Corporation
- John A. Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for reducing thermo-mechanical stress in stack...
- Patent number 6,831,363
- Issue date Dec 14, 2004
- International Business Machines Corporation
- Timothy J. Dalton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer including a low dielectric constant thermosetti...
- Patent number 6,764,873
- Issue date Jul 20, 2004
- International Business Machines Corporation
- Habib Hichri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
ARC RESIDUE-FREE ETCHING
- Publication number 20150054179
- Publication date Feb 26, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Xiang HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE METAL AND DIFFUSION BARRIER SEED COMPOSITIONS, AND METHO...
- Publication number 20140072796
- Publication date Mar 13, 2014
- International Business Machines Corporation
- Kelly Malone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Simultaneously Forming Features of Different Depths in a...
- Publication number 20130295773
- Publication date Nov 7, 2013
- International Business Machines Corporation
- Habib Hichri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARC RESIDUE-FREE ETCHING
- Publication number 20120256299
- Publication date Oct 11, 2012
- Xiang HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE METAL AND DIFFUSION BARRIER SEED COMPOSITIONS, AND METHO...
- Publication number 20120178241
- Publication date Jul 12, 2012
- International Business Machines Corporation
- Kelly Malone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO REDUCE DEPTH DELTA BETWEEN DENSE AND WIDE FEATURES IN DUA...
- Publication number 20120168957
- Publication date Jul 5, 2012
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Ravi Prakash SRIVASTAVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM WITH REDUCED POLYSILICON RESIDUE AND METH...
- Publication number 20120153474
- Publication date Jun 21, 2012
- International Business Machines Corporation
- Xiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL INSPECTION METHODS
- Publication number 20100112730
- Publication date May 6, 2010
- International Business Machines Corporation
- Colin Brodsky
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATION OF ION GETTERING MATERIAL IN DIELECTRIC
- Publication number 20090176350
- Publication date Jul 9, 2009
- International Business Machines Corporation
- MICHAEL P. BELYANSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLED MATERIAL PATTERN TRANSFER CONTRAST ENHANCEMENT
- Publication number 20090117360
- Publication date May 7, 2009
- International Business Machines Corporation
- Lawrence A. Clevenger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL INSPECTION METHODS
- Publication number 20090097017
- Publication date Apr 16, 2009
- International Business Machines Corporation
- Colin Brodsky
- G01 - MEASURING TESTING
Information Patent Application
GRADIENT DEPOSITION OF LOW-K CVD MATERIALS
- Publication number 20090026587
- Publication date Jan 29, 2009
- International Business Machines Corporation
- Matthew Angyal
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for Integrating Liner Formation in Back End of Line Processing
- Publication number 20080194099
- Publication date Aug 14, 2008
- International Business Machines Corporation
- Matthew S. Angyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIKE INTEGRATED CIRCUIT DEVICES WITH DIFFERENT DEPTH
- Publication number 20070273004
- Publication date Nov 29, 2007
- International Business Machines Corporation
- Habib Hichri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deflection analysis system and method for circuit design
- Publication number 20070174796
- Publication date Jul 26, 2007
- International Business Machines Corporation
- Matthew S. Angyal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REDUCING DAMAGE TO ULK DIELECTRIC DURING CROSS-LINKED POLYMER REMOVAL
- Publication number 20070111466
- Publication date May 17, 2007
- International Business Machines Corporation
- Ronald A. DellaGuardia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIKE INTEGRATED CIRCUIT DEVICES WITH DIFFERENT DEPTH
- Publication number 20070066073
- Publication date Mar 22, 2007
- International Business Machines Corporation
- Habib Hichri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTION OF LOSS OF PLASMA CONFINEMENT
- Publication number 20070007244
- Publication date Jan 11, 2007
- International Business Machines Corporation
- Habib Hichri
- G01 - MEASURING TESTING
Information Patent Application
Building metal pillars in a chip for structure support
- Publication number 20060190846
- Publication date Aug 24, 2006
- International Business Machines Corporation
- Habib Hichri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLEVEL DIELECTRIC LAYER AND METAL LAYER SEALING
- Publication number 20060024961
- Publication date Feb 2, 2006
- Matthew S. Angyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-K INTERLEVEL DIELECTRIC LAYER (ILD) AND METHOD
- Publication number 20050242414
- Publication date Nov 3, 2005
- International Business Machines Corporation
- Matthew Angyal
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Building metal pillars in a chip for structure support
- Publication number 20050118803
- Publication date Jun 2, 2005
- International Business Machines Corporation
- Habib Hichri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for removing impurities from low dielectric constant films...
- Publication number 20050087490
- Publication date Apr 28, 2005
- International Business Machines Corporation
- Mark S. Chace
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Reliable low-k interconnect structure with hybrid dielectric
- Publication number 20050023693
- Publication date Feb 3, 2005
- John A. Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer including a low dielectric constant thermosetti...
- Publication number 20040253457
- Publication date Dec 16, 2004
- Habib Hichri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Structure and method for reducing thermo-mechanical stress in stack...
- Publication number 20040113278
- Publication date Jun 17, 2004
- International Business Machines Corporation
- Timothy J. Dalton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reliable low-k interconnect structure with hybrid dielectric
- Publication number 20040094839
- Publication date May 20, 2004
- International Business Machines Corporation
- John A. Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer including a low dielectric constant thermosetti...
- Publication number 20040013887
- Publication date Jan 22, 2004
- International Business Machines Corporation
- Habib Hichri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Habib Hichri

Person

Patents Grantslast 30 patents

ARC residue-free etching

Method for simultaneously forming features of different depths in a...

ARC residue-free etching

Method to reduce depth delta between dense and wide features in dua...

Conductive metal and diffusion barrier seed compositions, and metho...

Conductive metal and diffusion barrier seed compositions, and metho...

Integrated circuit system with reduced polysilicon residue and meth...

Method for simultaneously forming features of different depths in a...

Optical inspection methods

Liner protection in deep trench etching

Optical inspection methods

Method for integrating liner formation in back end of line processing

Deflection analysis system and method for circuit design

Building metal pillars in a chip for structure support

Like integrated circuit devices with different depth

Reducing damage to ulk dielectric during cross-linked polymer removal

Interlevel dielectric layer and metal layer sealing

Reliable low-k interconnect structure with hybrid dielectric

Building metal pillars in a chip for structure support

Low-k interlevel dielectric layer (ILD)

Reliable low-k interconnect structure with hybrid dielectric

Structure and method for reducing thermo-mechanical stress in stack...

Semiconductor wafer including a low dielectric constant thermosetti...

Patents Applicationslast 30 patents

ARC RESIDUE-FREE ETCHING

CONDUCTIVE METAL AND DIFFUSION BARRIER SEED COMPOSITIONS, AND METHO...

Method for Simultaneously Forming Features of Different Depths in a...

ARC RESIDUE-FREE ETCHING

CONDUCTIVE METAL AND DIFFUSION BARRIER SEED COMPOSITIONS, AND METHO...

METHOD TO REDUCE DEPTH DELTA BETWEEN DENSE AND WIDE FEATURES IN DUA...

INTEGRATED CIRCUIT SYSTEM WITH REDUCED POLYSILICON RESIDUE AND METH...

OPTICAL INSPECTION METHODS

INTEGRATION OF ION GETTERING MATERIAL IN DIELECTRIC

SELF-ASSEMBLED MATERIAL PATTERN TRANSFER CONTRAST ENHANCEMENT

OPTICAL INSPECTION METHODS

GRADIENT DEPOSITION OF LOW-K CVD MATERIALS

Method for Integrating Liner Formation in Back End of Line Processing

LIKE INTEGRATED CIRCUIT DEVICES WITH DIFFERENT DEPTH

Deflection analysis system and method for circuit design

REDUCING DAMAGE TO ULK DIELECTRIC DURING CROSS-LINKED POLYMER REMOVAL

LIKE INTEGRATED CIRCUIT DEVICES WITH DIFFERENT DEPTH

DETECTION OF LOSS OF PLASMA CONFINEMENT

Building metal pillars in a chip for structure support

INTERLEVEL DIELECTRIC LAYER AND METAL LAYER SEALING

LOW-K INTERLEVEL DIELECTRIC LAYER (ILD) AND METHOD

Building metal pillars in a chip for structure support

Process for removing impurities from low dielectric constant films...

Reliable low-k interconnect structure with hybrid dielectric

Semiconductor wafer including a low dielectric constant thermosetti...

Structure and method for reducing thermo-mechanical stress in stack...

Reliable low-k interconnect structure with hybrid dielectric

Semiconductor wafer including a low dielectric constant thermosetti...