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Patents Grantslast 30 patents

Information Patent Grant
Interconnect structure and a method of fabricating the same
- Patent number 8,462,516
- Issue date Jun 11, 2013
- Agency for Science Technology and Research
- Chee Khuen Stephen Wong
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Interconnect Structure And A Method Of Fabricating The Same
- Publication number 20100246150
- Publication date Sep 30, 2010
- Agency for Science Tecnology and Research
- Chee Khuen Stephen Wong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer level electroless copper metallization and bumping process, a...
- Publication number 20030216025
- Publication date Nov 20, 2003
- Haijing Lu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...