TREA

Haijun SHE

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  • San Jose, CA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Temperature stabilizing enclosure
    • Patent number 10,655,896
    • Issue date May 19, 2020
    • Invensense, Inc.
    • Muhammad Maaz Qazi
    • F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
  • Information Patent Grant

    Assembly and packaging of MEMS device
    • Patent number 10,472,231
    • Issue date Nov 12, 2019
    • Invensense, Inc.
    • Brian H. Kim
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Assembly and packaging of MEMS device
    • Patent number 9,508,663
    • Issue date Nov 29, 2016
    • Invensense, Inc.
    • Brian H. Kim
    • B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

  • Information Patent Application

    ASSEMBLY AND PACKAGING OF MEMS DEVICE
    • Publication number 20190308874
    • Publication date Oct 10, 2019
    • InvenSense, Inc.
    • Brian H. Kim
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    TEMPERATURE STABILIZING ENCLOSURE
    • Publication number 20170176062
    • Publication date Jun 22, 2017
    • InvenSense, Inc.
    • Muhammad Maaz QAZI
    • F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
  • Information Patent Application

    ASSEMBLY AND PACKAGING OF MEMS DEVICE
    • Publication number 20170044007
    • Publication date Feb 16, 2017
    • InvenSense, Inc.
    • Brian H. Kim
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    ASSEMBLY AND PACKAGING OF MEMS DEVICE
    • Publication number 20150028432
    • Publication date Jan 29, 2015
    • Brian H. Kim
    • B81 - MICRO-STRUCTURAL TECHNOLOGY