Hailong LUO

Person

Ningbo, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of a composite substrate of an acoustic wave r...
- Patent number 12,224,730
- Issue date Feb 11, 2025
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Herb He Huang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Packaging method of a film bulk acoustic resonator
- Patent number 12,081,191
- Issue date Sep 3, 2024
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION (SHANGHAI BRANCH)
- Hailong Luo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Thin film piezoelectric acoustic wave resonator and manufacturing m...
- Patent number 12,057,820
- Issue date Aug 6, 2024
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Herb He Huang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Packaging method and packaging structure of FBAR
- Patent number 12,028,043
- Issue date Jul 2, 2024
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Bulk acoustic wave resonator, filter and radio frequency communicat...
- Patent number 12,009,803
- Issue date Jun 11, 2024
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Packaging method and packaging structure of film bulk acoustic reso...
- Patent number 11,870,410
- Issue date Jan 9, 2024
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Fabrication method of photodetector and imaging sensor
- Patent number 11,764,245
- Issue date Sep 19, 2023
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package structure
- Patent number 11,562,980
- Issue date Jan 24, 2023
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package structure
- Patent number 11,450,582
- Issue date Sep 20, 2022
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask plate and fabrication method thereof
- Patent number 11,444,244
- Issue date Sep 13, 2022
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Package structure of wafer-level system-in-package
- Patent number 11,309,279
- Issue date Apr 19, 2022
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodetector and fabrication method, and imaging sensor
- Patent number 11,101,311
- Issue date Aug 24, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging method and package structure
- Patent number 10,978,421
- Issue date Apr 13, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level system-in-package packaging method and package structur...
- Patent number 10,910,286
- Issue date Feb 2, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method and package structure of wafer-level system-in-pac...
- Patent number 10,861,821
- Issue date Dec 8, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging method and package structure thereof
- Patent number 10,861,822
- Issue date Dec 8, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging method and package structure thereof
- Patent number 10,804,177
- Issue date Oct 13, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging method and package structure thereof
- Patent number 10,790,211
- Issue date Sep 29, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package structure and wafer level packaging method
- Patent number 10,784,229
- Issue date Sep 22, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level system packaging method and package structure
- Patent number 10,756,051
- Issue date Aug 25, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING STRUCTURE OF FILM BULK ACOUSTIC RESONATOR
- Publication number 20240313738
- Publication date Sep 19, 2024
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong LUO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGING STRUCTURE OF FILM BULK ACOUSTIC RESONATOR
- Publication number 20240106406
- Publication date Mar 28, 2024
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong LUO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
FILM BULK ACOUSTIC RESONATOR AND FABRICATION METHOD THEREOF
- Publication number 20230353118
- Publication date Nov 2, 2023
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Herb He HUANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MEMS DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20230336149
- Publication date Oct 19, 2023
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Wei LI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MEMS DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20230336157
- Publication date Oct 19, 2023
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Herb He HUANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
THIN-FILM BULK ACOUSTIC WAVE RESONATOR, FORMING METHOD, AND FILTER
- Publication number 20230198498
- Publication date Jun 22, 2023
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Wei LI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
FILM PIEZOELECTRIC ACOUSTIC RESONATOR, FILTER AND ELECTRONIC APPARATUS
- Publication number 20230024466
- Publication date Jan 26, 2023
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Herb He HUANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
FILM BULK ACOUSTIC RESONATOR AND FABRICATION METHOD THEREOF
- Publication number 20230006644
- Publication date Jan 5, 2023
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Herb He HUANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
FILM PIEZOELECTRIC ACOUSTIC WAVE FILTER AND FABRICATION METHOD THEREOF
- Publication number 20220368310
- Publication date Nov 17, 2022
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong LUO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
COMPOSITE SUBSTRATE, SURFACE ACOUSTIC WAVE RESONATOR, AND FABRICATI...
- Publication number 20220352870
- Publication date Nov 3, 2022
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Herb He HUANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
THIN FILM PIEZOELECTRIC ACOUSTIC WAVE RESONATOR AND MANUFACTURING M...
- Publication number 20220321093
- Publication date Oct 6, 2022
- Ningbo Semiconductor International Corporation
- Herb He HUANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
THIN FILM PIEZOELECTRIC ACOUSTIC WAVE RESONATOR AND MANUFACTURING M...
- Publication number 20220294414
- Publication date Sep 15, 2022
- Ningbo Semiconductor International Corporation
- Herb He HUANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
COMPOSITE SUBSTRATE FOR MANUFACTURING ACOUSTIC WAVE RESONATOR AND S...
- Publication number 20220247375
- Publication date Aug 4, 2022
- Ningbo Semiconductor International Corporation
- Herb He HUANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR FORMING FILM BULK ACOUSTIC RESONATOR
- Publication number 20220231651
- Publication date Jul 21, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Hailong LUO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BULK ACOUSTIC WAVE RESONATOR, FILTER AND RADIO FREQUENCY COMMUNICAT...
- Publication number 20220029603
- Publication date Jan 27, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Hailong LUO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
FABRICATION METHOD OF PHOTODETECTOR AND IMAGING SENSOR
- Publication number 20210366971
- Publication date Nov 25, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD AND PACKAGING STRUCTURE OF FILM BULK ACOUSTIC RESO...
- Publication number 20210242855
- Publication date Aug 5, 2021
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Hailong LUO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGING METHOD AND PACKAGING STRUCTURE OF FILM BULK ACOUSTIC RESO...
- Publication number 20210218381
- Publication date Jul 15, 2021
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Hailong LUO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGING METHOD AND PACKAGING STRUCTURE OF FBAR
- Publication number 20210194456
- Publication date Jun 24, 2021
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Hailong LUO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGING MODULE AND PACKAGING METHOD OF BAW RESONATOR
- Publication number 20210184645
- Publication date Jun 17, 2021
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Hailong Luo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
WAFER-LEVEL PACKAGE STRUCTURE
- Publication number 20210082869
- Publication date Mar 18, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE OF WAFER-LEVEL SYSTEM-IN-PACKAGE
- Publication number 20210043601
- Publication date Feb 11, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE STRUCTURE
- Publication number 20200402876
- Publication date Dec 24, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING METHOD AND PACKAGE STRUCTURE THEREOF
- Publication number 20200075444
- Publication date Mar 5, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING METHOD AND PACKAGE STRUCTURE THEREOF
- Publication number 20200075536
- Publication date Mar 5, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL SYSTEM-IN-PACKAGE PACKAGING METHOD AND PACKAGE STRUCTUR...
- Publication number 20200075442
- Publication date Mar 5, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL SYSTEM PACKAGING METHOD AND PACKAGE STRUCTURE
- Publication number 20200075538
- Publication date Mar 5, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE STRUCTURE AND WAFER LEVEL PACKAGING METHOD
- Publication number 20200075539
- Publication date Mar 5, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING METHOD AND PACKAGE STRUCTURE
- Publication number 20200075537
- Publication date Mar 5, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING METHOD AND PACKAGE STRUCTURE THEREOF
- Publication number 20200075443
- Publication date Mar 5, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong LUO
- H01 - BASIC ELECTRIC ELEMENTS

Hailong LUO

Person

Patents Grantslast 30 patents

Manufacturing method of a composite substrate of an acoustic wave r...

Packaging method of a film bulk acoustic resonator

Thin film piezoelectric acoustic wave resonator and manufacturing m...

Packaging method and packaging structure of FBAR

Bulk acoustic wave resonator, filter and radio frequency communicat...

Packaging method and packaging structure of film bulk acoustic reso...

Fabrication method of photodetector and imaging sensor

Wafer-level package structure

Wafer-level package structure

Mask plate and fabrication method thereof

Package structure of wafer-level system-in-package

Photodetector and fabrication method, and imaging sensor

Wafer-level packaging method and package structure

Wafer-level system-in-package packaging method and package structur...

Packaging method and package structure of wafer-level system-in-pac...

Wafer-level packaging method and package structure thereof

Wafer-level packaging method and package structure thereof

Wafer-level packaging method and package structure thereof

Wafer level package structure and wafer level packaging method

Wafer-level system packaging method and package structure

Patents Applicationslast 30 patents

PACKAGING STRUCTURE OF FILM BULK ACOUSTIC RESONATOR

PACKAGING STRUCTURE OF FILM BULK ACOUSTIC RESONATOR

FILM BULK ACOUSTIC RESONATOR AND FABRICATION METHOD THEREOF

MEMS DEVICE AND FABRICATION METHOD THEREOF

MEMS DEVICE AND FABRICATION METHOD THEREOF

THIN-FILM BULK ACOUSTIC WAVE RESONATOR, FORMING METHOD, AND FILTER

FILM PIEZOELECTRIC ACOUSTIC RESONATOR, FILTER AND ELECTRONIC APPARATUS

FILM BULK ACOUSTIC RESONATOR AND FABRICATION METHOD THEREOF

FILM PIEZOELECTRIC ACOUSTIC WAVE FILTER AND FABRICATION METHOD THEREOF

COMPOSITE SUBSTRATE, SURFACE ACOUSTIC WAVE RESONATOR, AND FABRICATI...

THIN FILM PIEZOELECTRIC ACOUSTIC WAVE RESONATOR AND MANUFACTURING M...

THIN FILM PIEZOELECTRIC ACOUSTIC WAVE RESONATOR AND MANUFACTURING M...

COMPOSITE SUBSTRATE FOR MANUFACTURING ACOUSTIC WAVE RESONATOR AND S...

METHOD FOR FORMING FILM BULK ACOUSTIC RESONATOR

BULK ACOUSTIC WAVE RESONATOR, FILTER AND RADIO FREQUENCY COMMUNICAT...

FABRICATION METHOD OF PHOTODETECTOR AND IMAGING SENSOR

PACKAGING METHOD AND PACKAGING STRUCTURE OF FILM BULK ACOUSTIC RESO...

PACKAGING METHOD AND PACKAGING STRUCTURE OF FILM BULK ACOUSTIC RESO...

PACKAGING METHOD AND PACKAGING STRUCTURE OF FBAR

PACKAGING MODULE AND PACKAGING METHOD OF BAW RESONATOR

WAFER-LEVEL PACKAGE STRUCTURE

PACKAGE STRUCTURE OF WAFER-LEVEL SYSTEM-IN-PACKAGE

WAFER-LEVEL PACKAGE STRUCTURE

WAFER-LEVEL PACKAGING METHOD AND PACKAGE STRUCTURE THEREOF

WAFER-LEVEL PACKAGING METHOD AND PACKAGE STRUCTURE THEREOF

WAFER-LEVEL SYSTEM-IN-PACKAGE PACKAGING METHOD AND PACKAGE STRUCTUR...

WAFER-LEVEL SYSTEM PACKAGING METHOD AND PACKAGE STRUCTURE

WAFER LEVEL PACKAGE STRUCTURE AND WAFER LEVEL PACKAGING METHOD

WAFER-LEVEL PACKAGING METHOD AND PACKAGE STRUCTURE

WAFER-LEVEL PACKAGING METHOD AND PACKAGE STRUCTURE THEREOF