Haiyan Liu

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Tianjin, CN

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Patents Grantslast 30 patents

Information Patent Grant
Lead frame for assembling semiconductor device
- Patent number 8,643,156
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Shunan Qiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER DICING METHOD
- Publication number 20140024199
- Publication date Jan 23, 2014
- Shunan QIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR ASSEMBLING SEMICONDUCTOR DEVICE
- Publication number 20130234306
- Publication date Sep 12, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Shunan Qiu
- H01 - BASIC ELECTRIC ELEMENTS