Haiying Li

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Atlanta, GA, US

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Patents Grantslast 30 patents

Information Patent Grant
No-flow reworkable epoxy underfills for flip-chip applications
- Patent number 6,570,029
- Issue date May 27, 2003
- Georgia Tech Research Corp.
- Lejun Wang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermally degradable epoxy underfills for flip-chip applications
- Patent number 6,498,260
- Issue date Dec 24, 2002
- Georgia Tech Research Corp.
- Lejun Wang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
No-flow reworkable epoxy underfills for flip-chip applications
- Publication number 20020035201
- Publication date Mar 21, 2002
- Lejun Wang
- C07 - ORGANIC CHEMISTRY
Information Patent Application
Thermally degradable epoxy underfills for flip-chip applications
- Publication number 20020013420
- Publication date Jan 31, 2002
- Lejun Wang
- C07 - ORGANIC CHEMISTRY