“Novel Thermally Reworkable Underfill Encapsulants for Flip-chip Applications,” by Lejun Wang and C.P. Wong, pp. 92-100, 1998 Electronics Components and Technology Conference. |
“Novel Thermally Reworkable Underfill Encapsulants for Flip-chip Applications,” by Lejun Wang and C.P. Wong, The Second IEEE International Symposium on Polymeric Electronics Packaging, Oct. 24-28, 1999, Gothenburg, Sweden. |
“Novel Thermally Reworkable Underfill Encapsulants for Flip-chip Applications,” by Lejun Wang and C.P. Wong, IEEE Transactions on Advanced Packaging, pp. 46-53, vol. 22, No. 1, Feb. 1999. |
“Syntheses and Characterizations of Thermally Reworkable Epoxy Resins, Part 1,” by Lejun Wang and C.P. Wong, Journal of Polymer Science, Part A: Polymer Chemistry, pp. 2991-3001, vol. 37, 1999. |
U.S. patent application Ser. No. 09/09/820,549, filed Mar. 29, 2001, entitled “Thermally Degradable Epoxy Underfills for Flip-Chip Applications.” |