Haiyong XU

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San Diego, CA, US

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Patents Applicationslast 30 patents

Information Patent Application
LAND GRID BASED MULTI SIZE PAD PACKAGE
- Publication number 20190043817
- Publication date Feb 7, 2019
- QUALCOMM Incorporated
- Manoj KADADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAND GRID BASED MULTI SIZE PAD PACKAGE
- Publication number 20180053740
- Publication date Feb 22, 2018
- QUALCOMM Incorporated
- Manoj KAKADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER (RDL) FAN-OUT WAFER LEVEL PACKAGING (FOWLP) ST...
- Publication number 20170373032
- Publication date Dec 28, 2017
- QUALCOMM Incorporated
- Jihoon OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALANCED CURRENT DISTRIBUTION STRUCTURE FOR LARGE CURRENT DELIVERY
- Publication number 20150364438
- Publication date Dec 17, 2015
- QUALCOMM Incorporated
- Haiyong XU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR