Hajime Nakayama

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Multilayer wiring plate and method for fabricating same
- Patent number 10,027,012
- Issue date Jul 17, 2018
- Hitachi Chemical Company, Ltd.
- Hiroyuki Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the fabrication of wiring board for electrical tests
- Patent number 6,568,073
- Issue date May 27, 2003
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- G01 - MEASURING TESTING
Information Patent Grant
Wiring board for electrical tests with bumps having polymeric coating
- Patent number 6,133,534
- Issue date Oct 17, 2000
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- G01 - MEASURING TESTING
Information Patent Grant
Fabrication process of wiring board
- Patent number 5,664,325
- Issue date Sep 9, 1997
- Hitachi Chemical Co. Ltd.
- Naoki Fukutomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication process of wiring board
- Patent number 5,426,850
- Issue date Jun 27, 1995
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for metallizing glass surface
- Patent number 4,859,505
- Issue date Aug 22, 1989
- Hitachi Chemical Co., Ltd.
- Hajime Nakayama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER WIRING PLATE AND METHOD FOR FABRICATING SAME
- Publication number 20150357699
- Publication date Dec 10, 2015
- Hitachi Chemical Company, Ltd.
- Hiroyuki YAMAGUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Rotatable-and-swingable type of rotary joint device
- Publication number 20030154814
- Publication date Aug 21, 2003
- Rinzo Irie
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...