Claims
- 1. A process for the fabrication of a wiring board, which comprises the following steps:(a) forming a first wiring pattern on a first side of a self-supporting carrier metal foil so as to obtain a self-supporting wiring sheet comprising the carrier metal foil and the first wiring pattern; (b) superposing and pressing the first side of said self-supporting wiring sheet on and against an insulating substrate so that the first wiring pattern is embedded in the insulating substrate and constitutes a surface with the insulating substrate; and (c) etching off desired portions of said carrier metal foil to form a second wiring pattern made of said carrier metal foil remaining on the surface constituted by the insulating substrate and the first wiring pattern.
- 2. The process of claim 1, wherein said self-supporting wiring sheet consists essentially of the carrier metal foil and the first wiring pattern.
- 3. A process for the fabrication of a wiring board, which comprises the following steps:(a) forming a first wiring pattern on a first side of a carrier metal foil so as to obtain a wiring sheet comprising the carrier metal foil and the first wiring pattern; (b) superposing and pressing the first side of said wiring sheet on and against an insulating substrate so that the first wiring pattern is embedded in the insulating substrate and the first wiring pattern and constitutes a surface with the insulating substrate; and (c) etching off desired portions of said carrier metal foil to form a second wiring pattern made of said carrier metal foil remaining on the surface constituted by the insulating substrate and the first wiring pattern.
- 4. The process of claim 3, wherein said wiring sheet is 20 to 100 μm thick.
- 5. The process of claim 3, wherein said wiring sheet consists essentially of the carrier metal foil and the first wiring pattern.
Priority Claims (4)
Number |
Date |
Country |
Kind |
3-316252 |
Nov 1991 |
JP |
|
4-104675 |
Apr 1992 |
JP |
|
5-99954 |
Apr 1993 |
JP |
|
9-333201 |
Dec 1993 |
JP |
|
Parent Case Info
This application is a continuation-in-part of U.S application Ser. No. 08/234,215, filed Apr. 28, 1994 now U.S. Pat. No. 6,133,534 and which is a continuation-in-part of U.S. application Ser. No. 07/983,342, filed on Nov. 30, 1992, entitled “FABRICATION PROCESS OF WIRING BOARD”, now U.S. Pat. No. 5,426,850 which is incorporated herein by reference.
US Referenced Citations (30)
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EP |
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Non-Patent Literature Citations (4)
Entry |
Chemical Abstracts, vol. 98, No. 2, Jan. 10, 1993. |
Chemical Abstracts, vol. 108, No. 12, Mar. 21, 1988. |
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Continuation in Parts (2)
|
Number |
Date |
Country |
Parent |
08/234215 |
Apr 1994 |
US |
Child |
09/036494 |
|
US |
Parent |
07/983342 |
Nov 1992 |
US |
Child |
08/234215 |
|
US |