Hajime SAIKI

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Cupertino, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing multi-layer wiring board
- Patent number 9,237,656
- Issue date Jan 12, 2016
- NGK Spark Plug Co., Ltd.
- Shinnosuke Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING MULTI-LAYER WIRING BOARD
- Publication number 20130160290
- Publication date Jun 27, 2013
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20130161079
- Publication date Jun 27, 2013
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER WIRING SUBSTRATE
- Publication number 20130111746
- Publication date May 9, 2013
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER WIRING SUBSTRATE, AND MULTILAYER...
- Publication number 20120312590
- Publication date Dec 13, 2012
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H01 - BASIC ELECTRIC ELEMENTS