Hajime Sakamoto

Person

Gifu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Prepreg and method for producing same
- Patent number 10,927,226
- Issue date Feb 23, 2021
- Toho Tenax Co., Ltd.
- Takaya Suzuki
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed wiring board
- Patent number 10,804,191
- Issue date Oct 13, 2020
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 10,186,486
- Issue date Jan 22, 2019
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method for manufacturing the same
- Patent number 10,090,238
- Issue date Oct 2, 2018
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board having wiring structure for mounting multip...
- Patent number 9,893,016
- Issue date Feb 13, 2018
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board and method for manufacturing same
- Patent number 9,837,342
- Issue date Dec 5, 2017
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,711,439
- Issue date Jul 18, 2017
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board, method for manufacturing the same and semicon...
- Patent number 9,706,663
- Issue date Jul 11, 2017
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 9,420,697
- Issue date Aug 16, 2016
- Ibiden Co., Ltd.
- Yoshiyuki Iwata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element
- Patent number 9,245,838
- Issue date Jan 26, 2016
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing interposer
- Patent number 8,997,344
- Issue date Apr 7, 2015
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a printed circuit board having an embedded...
- Patent number 8,959,756
- Issue date Feb 24, 2015
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element, method of manufacturing semiconductor elemen...
- Patent number 8,822,323
- Issue date Sep 2, 2014
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element, method of manufacturing semiconductor elemen...
- Patent number 8,524,535
- Issue date Sep 3, 2013
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board manufacturing method
- Patent number 8,453,323
- Issue date Jun 4, 2013
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board and multilayer printed circuit boa...
- Patent number 8,438,727
- Issue date May 14, 2013
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element, method of manufacturing semiconductor elemen...
- Patent number 8,293,579
- Issue date Oct 23, 2012
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer and method for manufacturing interposer
- Patent number 8,188,378
- Issue date May 29, 2012
- Ibiden Co., Ltd.
- Hajime Sakamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Multilayer printed circuit board and multilayer printed circuit boa...
- Patent number 8,186,045
- Issue date May 29, 2012
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer and method for manufacturing interposer
- Patent number 8,178,790
- Issue date May 15, 2012
- Ibiden Co., Ltd.
- Toshiki Furutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and method for manufacturing interposer
- Patent number 8,173,907
- Issue date May 8, 2012
- Ibiden Co., Ltd.
- Hajime Sakamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Printed circuit board manufacturing method
- Patent number 8,079,142
- Issue date Dec 20, 2011
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element, method of manufacturing semiconductor elemen...
- Patent number 8,067,699
- Issue date Nov 29, 2011
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer and method for manufacturing interposer
- Patent number 8,058,563
- Issue date Nov 15, 2011
- Ibiden Co., Ltd.
- Hajime Sakamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for manufacturing multilayer printed circuit board
- Patent number 8,046,914
- Issue date Nov 1, 2011
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element connected to printed circuit board
- Patent number 7,999,387
- Issue date Aug 16, 2011
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element, method of manufacturing semiconductor elemen...
- Patent number 7,939,765
- Issue date May 10, 2011
- Ibiden Co., Ltd.
- Hajime Sakamoto
Information Patent Grant
Method of manufacturing multi-layer printed circuit board
- Patent number 7,908,745
- Issue date Mar 22, 2011
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element, method of manufacturing semiconductor elemen...
- Patent number 7,893,360
- Issue date Feb 22, 2011
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board
- Patent number 7,888,606
- Issue date Feb 15, 2011
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD
- Publication number 20190109085
- Publication date Apr 11, 2019
- IBIDEN CO., LTD.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20190098752
- Publication date Mar 28, 2019
- IBIDEN CO., LTD.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20180033732
- Publication date Feb 1, 2018
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170256470
- Publication date Sep 7, 2017
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170256478
- Publication date Sep 7, 2017
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160105960
- Publication date Apr 14, 2016
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE HAVING THE SAME
- Publication number 20160095219
- Publication date Mar 31, 2016
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160066423
- Publication date Mar 3, 2016
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE SAME AND SEMICON...
- Publication number 20160066422
- Publication date Mar 3, 2016
- IBIDEN CO., LTD.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20160027725
- Publication date Jan 28, 2016
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREPREG AND METHOD FOR PRODUCING SAME
- Publication number 20150274911
- Publication date Oct 1, 2015
- Takaya Suzuki
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20150223318
- Publication date Aug 6, 2015
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR ELEMENT
- Publication number 20150130079
- Publication date May 14, 2015
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20130177714
- Publication date Jul 11, 2013
- National University Corporation Nagoya University
- Yoshiyuki IWATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD MANUFACTURING METHOD
- Publication number 20120000068
- Publication date Jan 5, 2012
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER
- Publication number 20110265323
- Publication date Nov 3, 2011
- IBIDEN CO., LTD.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER
- Publication number 20110265324
- Publication date Nov 3, 2011
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMEN...
- Publication number 20100140803
- Publication date Jun 10, 2010
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOA...
- Publication number 20100031503
- Publication date Feb 11, 2010
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOA...
- Publication number 20100018049
- Publication date Jan 28, 2010
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMEN...
- Publication number 20090263939
- Publication date Oct 22, 2009
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER
- Publication number 20090231827
- Publication date Sep 17, 2009
- IBIDEN CO., LTD.
- Toshiki Furutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER
- Publication number 20090173522
- Publication date Jul 9, 2009
- IBIDEN CO., LTD.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER
- Publication number 20090175023
- Publication date Jul 9, 2009
- IBIDEN CO., LTD.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER
- Publication number 20090173530
- Publication date Jul 9, 2009
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMEN...
- Publication number 20090077796
- Publication date Mar 26, 2009
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD MANUFACTURING METHOD
- Publication number 20090070996
- Publication date Mar 19, 2009
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMEN...
- Publication number 20080230914
- Publication date Sep 25, 2008
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOA...
- Publication number 20080201944
- Publication date Aug 28, 2008
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMEN...
- Publication number 20080206926
- Publication date Aug 28, 2008
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hajime Sakamoto

Person

Patents Grantslast 30 patents

Prepreg and method for producing same

Printed wiring board

Wiring board

Wiring substrate and method for manufacturing the same

Multilayer wiring board having wiring structure for mounting multip...

Multilayer wiring board and method for manufacturing same

Printed wiring board and method for manufacturing the same

Printed wiring board, method for manufacturing the same and semicon...

Method for manufacturing printed wiring board

Semiconductor element

Method for manufacturing interposer

Method of manufacturing a printed circuit board having an embedded...

Semiconductor element, method of manufacturing semiconductor elemen...

Semiconductor element, method of manufacturing semiconductor elemen...

Printed circuit board manufacturing method

Multilayer printed circuit board and multilayer printed circuit boa...

Semiconductor element, method of manufacturing semiconductor elemen...

Interposer and method for manufacturing interposer

Multilayer printed circuit board and multilayer printed circuit boa...

Interposer and method for manufacturing interposer

Interposer and method for manufacturing interposer

Printed circuit board manufacturing method

Semiconductor element, method of manufacturing semiconductor elemen...

Interposer and method for manufacturing interposer

Method for manufacturing multilayer printed circuit board

Semiconductor element connected to printed circuit board

Semiconductor element, method of manufacturing semiconductor elemen...

Method of manufacturing multi-layer printed circuit board

Semiconductor element, method of manufacturing semiconductor elemen...

Multilayer printed circuit board

Patents Applicationslast 30 patents

PRINTED WIRING BOARD

PRINTED WIRING BOARD

WIRING BOARD

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE HAVING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE SAME AND SEMICON...

MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING SAME

PREPREG AND METHOD FOR PRODUCING SAME

MULTILAYER WIRING BOARD

SEMICONDUCTOR ELEMENT

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD MANUFACTURING METHOD

INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER

INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER

SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMEN...

MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOA...

MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOA...

SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMEN...

INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER

INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER

INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER

INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER

SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMEN...

PRINTED CIRCUIT BOARD MANUFACTURING METHOD

SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMEN...

MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOA...

SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMEN...