Hak-kyoon Byun

Person

Asan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packaging apparatus formed from semiconductor package...
- Patent number 9,245,863
- Issue date Jan 26, 2016
- Samsung Electronics Co., Ltd.
- Hae-jung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and package on package having the same
- Patent number 9,111,926
- Issue date Aug 18, 2015
- Samsung Electronics Co., Ltd.
- Hak-Kyoon Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and package on package having the same
- Patent number 8,759,967
- Issue date Jun 24, 2014
- Samsung Electronics Co., Ltd.
- Hak-Kyoon Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and package on package having the same
- Patent number 8,531,034
- Issue date Sep 10, 2013
- Samsung Electronics Co., Ltd.
- Hak-Kyoon Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 8,304,876
- Issue date Nov 6, 2012
- Samsung Electronics Co., Ltd.
- Hak-Kyoon Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having stack-type semiconductor package and metho...
- Patent number 8,184,449
- Issue date May 22, 2012
- Samsung Electronics Co., Ltd.
- Jung-Do Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate having variously sized ball pads, semiconductor pa...
- Patent number 7,795,743
- Issue date Sep 14, 2010
- Samsung Electronics Co., Ltd.
- Tae-Hun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for detaching a semiconductor chip from a tape
- Patent number 7,624,498
- Issue date Dec 1, 2009
- Samsung Electronics Co., Ltd.
- Youn-sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 7,541,680
- Issue date Jun 2, 2009
- Samsung Electronics Co., Ltd.
- Heung-kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND PACKAGE ON PACKAGE HAVING THE SAME
- Publication number 20140264940
- Publication date Sep 18, 2014
- Samsung Electronics Co., Ltd.
- Hak-Kyoon BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE APPARATUS
- Publication number 20140091463
- Publication date Apr 3, 2014
- Hae-jung YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND PACKAGE ON PACKAGE HAVING THE SAME
- Publication number 20140001649
- Publication date Jan 2, 2014
- Samsung Electronics Co., Ltd.
- Hak-Kyoon BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING A PACKAGE-ON-PACKAGE DEVICE AND PACKAGE-ON-P...
- Publication number 20130178016
- Publication date Jul 11, 2013
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PCB FOR MUF AND MOLDING STRUCTURE OF THE PCB
- Publication number 20130161800
- Publication date Jun 27, 2013
- Samsung Electronics Co., Ltd.
- Hak-kyoon BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR CHIP PACKAGE
- Publication number 20120315726
- Publication date Dec 13, 2012
- HAK-KYOON BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND PACKAGE ON PACKAGE HAVING THE SAME
- Publication number 20120153499
- Publication date Jun 21, 2012
- Samsung Electronics Co., Ltd.
- Hak-Kyoon BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF AND APPARATUS FOR DETACHING SEMICONDUCTOR CHIPS FROM A TAPE
- Publication number 20100037445
- Publication date Feb 18, 2010
- Samsung Electronics Co., Ltd.
- Youn-sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method for manufacturing the same
- Publication number 20100038765
- Publication date Feb 18, 2010
- SAMSUNG ELECTRONICS CO., LTD.
- Hak-Kyoon Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK-TYPE SEMICONDUCTOR PACKAGE, METHOD OF FORMING THE SAME AND EL...
- Publication number 20090085185
- Publication date Apr 2, 2009
- Samsung Electronics Co., Ltd.
- Hak-Kyoon BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING STACK-TYPE SEMICONDUCTOR PACKAGE AND METHO...
- Publication number 20090067143
- Publication date Mar 12, 2009
- Jung-Do Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DIE PICK UP APPARATUS AND METHOD THEREOF
- Publication number 20080160725
- Publication date Jul 3, 2008
- Samsung Electronics Co., Ltd.
- Hak-Kyoon BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DICING
- Publication number 20080160724
- Publication date Jul 3, 2008
- Samsung Electronics Co., Ltd.
- Hyun-Jung SONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi stack package and method of fabricating the same
- Publication number 20080111224
- Publication date May 15, 2008
- Hak-kyoon Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20080064215
- Publication date Mar 13, 2008
- Samsung Electronics Co., Ltd.
- Min-ok NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF AND APPARATUS FOR DETACHING SEMICONDUCTOR CHIPS FROM A TAPE
- Publication number 20070293022
- Publication date Dec 20, 2007
- Samsung Electronics Co., Ltd.
- Youn-sung KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE HAVING VARIOUSLY SIZED BALL PADS, SEMICONDUCTOR PA...
- Publication number 20070152350
- Publication date Jul 5, 2007
- Samsung Electronics Co., Ltd.
- Tae-Hun Kim
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device package
- Publication number 20070045828
- Publication date Mar 1, 2007
- Heung-kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS

Hak-kyoon Byun

Person

Patents Grantslast 30 patents

Semiconductor packaging apparatus formed from semiconductor package...

Semiconductor package and package on package having the same

Semiconductor package and package on package having the same

Semiconductor package and package on package having the same

Semiconductor package and method for manufacturing the same

Electronic device having stack-type semiconductor package and metho...

Wiring substrate having variously sized ball pads, semiconductor pa...

Apparatus for detaching a semiconductor chip from a tape

Semiconductor device package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND PACKAGE ON PACKAGE HAVING THE SAME

SEMICONDUCTOR PACKAGE APPARATUS

SEMICONDUCTOR PACKAGE AND PACKAGE ON PACKAGE HAVING THE SAME

METHODS OF FABRICATING A PACKAGE-ON-PACKAGE DEVICE AND PACKAGE-ON-P...

PCB FOR MUF AND MOLDING STRUCTURE OF THE PCB

METHOD OF MANUFACTURING A SEMICONDUCTOR CHIP PACKAGE

SEMICONDUCTOR PACKAGE AND PACKAGE ON PACKAGE HAVING THE SAME

METHOD OF AND APPARATUS FOR DETACHING SEMICONDUCTOR CHIPS FROM A TAPE

Semiconductor package and method for manufacturing the same

STACK-TYPE SEMICONDUCTOR PACKAGE, METHOD OF FORMING THE SAME AND EL...

ELECTRONIC DEVICE HAVING STACK-TYPE SEMICONDUCTOR PACKAGE AND METHO...

SEMICONDUCTOR DIE PICK UP APPARATUS AND METHOD THEREOF

METHOD OF DICING

Multi stack package and method of fabricating the same

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE

METHOD OF AND APPARATUS FOR DETACHING SEMICONDUCTOR CHIPS FROM A TAPE

WIRING SUBSTRATE HAVING VARIOUSLY SIZED BALL PADS, SEMICONDUCTOR PA...

Semiconductor device package