Han-Ming HUANG

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,074,101
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixing belt of wearable device, method for manufacturing the same,...
- Patent number 11,968,788
- Issue date Apr 23, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Yong-Quan Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Voltage regulator device
- Patent number 11,835,979
- Issue date Dec 5, 2023
- Realtek Semiconductor Corp.
- Han-Hsiang Huang
- G05 - CONTROLLING REGULATING
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,823,887
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packages
- Patent number 11,756,928
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan
- Patent number 11,719,252
- Issue date Aug 8, 2023
- Acer Incorporated
- Yu-Ming Lin
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Voltage reduction circuit for bandgap reference voltage circuit
- Patent number 11,526,189
- Issue date Dec 13, 2022
- Realtek Semiconductor Corp.
- Han-Hsiang Huang
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method of assembling contacts into housing via respective contact c...
- Patent number 11,527,861
- Issue date Dec 13, 2022
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Tzu-Yao Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip wafer level packages
- Patent number 11,342,306
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current generation circuit
- Patent number 11,216,021
- Issue date Jan 4, 2022
- Realtek Semiconductor Corporation
- Han-Hsiang Huang
- G05 - CONTROLLING REGULATING
Information Patent Grant
Methods of forming multi-chip wafer level packages
- Patent number 11,189,596
- Issue date Nov 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing circuit board with embedded conductive circ...
- Patent number 11,058,014
- Issue date Jul 6, 2021
- Avary Holding (Shenzhen) Co., Limited.
- Xiao-Yan Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of capacitor structure
- Patent number 11,024,704
- Issue date Jun 1, 2021
- United Semiconductor (Xiamen) Co., Ltd.
- Wei-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 10,993,327
- Issue date Apr 27, 2021
- Avary Holding (Shenzhen) Co., Limited.
- Lin-Jie Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector and method making the same
- Patent number 10,777,929
- Issue date Sep 15, 2020
- FUDING PRECISION COMPONENTS (SHENZHEN) CO., LTD.
- Tzu-Yao Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 10,772,217
- Issue date Sep 8, 2020
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Lin-Jie Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip wafer level packages and methods of forming the same
- Patent number 10,763,239
- Issue date Sep 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 10,764,992
- Issue date Sep 1, 2020
- Avary Holding (Shenzhen) Co., Limited.
- Yong-Chao Wei
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 10,555,420
- Issue date Feb 4, 2020
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Han-Pei Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method
- Patent number 10,462,902
- Issue date Oct 29, 2019
- Avary Holding (Shenzhen) Co., Limited.
- Han-Pei Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 10,349,518
- Issue date Jul 9, 2019
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Han-Pei Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming semiconductor device
- Patent number 9,589,846
- Issue date Mar 7, 2017
- United Microelectronics Corp.
- Fu-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power factor-corrected resonant converter and parallel power factor...
- Patent number 9,263,941
- Issue date Feb 16, 2016
- Macroblock, Inc.
- Lon-Kou Chang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method of sorting a multi-bit per cell non-volatile memory and a mu...
- Patent number 8,995,196
- Issue date Mar 31, 2015
- Skymedi Corporation
- Han-Lung Huang
- G11 - INFORMATION STORAGE
Information Patent Grant
Common-core power factor correction resonant converter
- Patent number 8,937,463
- Issue date Jan 20, 2015
- Macroblock, Inc.
- Lon-Kou Chang
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method of programming a multi-bit per cell non-volatile memory
- Patent number 8,923,071
- Issue date Dec 30, 2014
- Skymedi Corporation
- Han-Lung Huang
- G11 - INFORMATION STORAGE
Information Patent Grant
Manufacturing method of anti punch-through leakage current metal-ox...
- Patent number 8,828,827
- Issue date Sep 9, 2014
- United Microelectronics Corporation
- Chun-Yao Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for controlling the equivalent resistance of a...
- Patent number 8,787,051
- Issue date Jul 22, 2014
- Macroblock, Inc.
- Lon-Kou Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of programming/reading a non-volatile memory with a sequence
- Patent number 8,730,725
- Issue date May 20, 2014
- Skymedi Corporation
- Han-Lung Huang
- G11 - INFORMATION STORAGE
Information Patent Grant
Method and system of dynamic data storage for error correction in a...
- Patent number 8,707,135
- Issue date Apr 22, 2014
- Skymedi Corporation
- Chih-Cheng Tu
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20240363517
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240282589
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Hsiang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE (ESD) PROTECTION STRUCTURE
- Publication number 20240243120
- Publication date Jul 18, 2024
- MEDIATEK INC.
- Han-Sheng HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND MEASURING DEVICE FOR MEASURING REACTION FORCE AND TORQUE...
- Publication number 20240019324
- Publication date Jan 18, 2024
- SETEC CORPORATION
- HAN-RONG HUANG
- A63 - SPORTS GAMES AMUSEMENTS
Information Patent Application
POWER DELIVERY STRUCTURES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240021560
- Publication date Jan 18, 2024
- TAIWAN SEMICONDUTOR MANUFACTURING COMPANY, LTD.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20240014120
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGING-RESISTANT MICROBUMP STRUCTURES AND METHODS OF FORMING THE...
- Publication number 20230411345
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Han-Hsiang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20230369287
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASIN-SHAPED UNDERBUMP PLATES AND METHODS OF FORMING THE SAME
- Publication number 20230352428
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yen-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE PITCH CHIP INTERCONNECT STRUCTURE FOR BUMP BRIDGE AND HIGH TEM...
- Publication number 20230317577
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Chieh HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE REGULATOR DEVICE
- Publication number 20230035977
- Publication date Feb 2, 2023
- Realtek Semiconductor Corp.
- HAN-HSIANG HUANG
- G05 - CONTROLLING REGULATING
Information Patent Application
FIXING BELT OF WEARABLE DEVICE, METHOD FOR MANUFACTURING THE SAME,...
- Publication number 20220338356
- Publication date Oct 20, 2022
- Avary Holding (Shenzhen) Co., Limited.
- YONG-QUAN YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220302011
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN
- Publication number 20220290684
- Publication date Sep 15, 2022
- ACER INCORPORATED
- Yu-Ming Lin
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
MULTI-CHIP PACKAGES
- Publication number 20220246579
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE REDUCTION CIRCUIT FOR BANDGAP REFERENCE VOLTAGE CIRCUIT
- Publication number 20220011804
- Publication date Jan 13, 2022
- Realtek Semiconductor Corp.
- HAN-HSIANG HUANG
- G05 - CONTROLLING REGULATING
Information Patent Application
CURRENT GENERATION CIRCUIT
- Publication number 20210157352
- Publication date May 27, 2021
- REALTEK SEMICONDUCTOR CORPORATION
- Han-Hsiang HUANG
- G05 - CONTROLLING REGULATING
Information Patent Application
DEVICE AND METHOD FOR DETECTING COUPLING BETWEEN PHYSIOLOGICAL SIGNALS
- Publication number 20210106235
- Publication date Apr 15, 2021
- Crystalvue Medical Corporation
- Han-Ping HUANG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METHOD OF ASSEMBLING CONTACTS INTO HOUSING VIA RESPECTIVE CONTACT C...
- Publication number 20210075178
- Publication date Mar 11, 2021
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- TZU-YAO HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20200413529
- Publication date Dec 31, 2020
- Avary Holding (Shenzhen) Co., Limited.
- YONG-CHAO WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200413544
- Publication date Dec 31, 2020
- Avary Holding (Shenzhen) Co., Limited.
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-CHIP WAFER LEVEL PACKAGES
- Publication number 20200395335
- Publication date Dec 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MULTI-CHIP WAFER LEVEL PACKAGES
- Publication number 20200343220
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR AND METHOD MAKING THE SAME
- Publication number 20200052429
- Publication date Feb 13, 2020
- FU DING PRECISION COMPONENT (SHEN ZHEN) CO., LTD.
- TZU-YAO HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200045824
- Publication date Feb 6, 2020
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- HAN-PEI HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-CHIP WAFER LEVEL PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20190131273
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CONTACT WAFER TRANSPORT DEVICE
- Publication number 20170154803
- Publication date Jun 1, 2017
- WET Technology Co., Ltd.
- Yi-Cheng WANG
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
COMMON-CORE POWER FACTOR CORRECTION RESONANT CONVERTER
- Publication number 20140002035
- Publication date Jan 2, 2014
- Macroblock, Inc.
- Lon-Kou Chang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MANUFACTURING METHOD OF ANTI PUNCH-THROUGH LEAKAGE CURRENT METAL-OX...
- Publication number 20130344670
- Publication date Dec 26, 2013
- UNITED MICROELECTRONICS CORPORATION
- Chun-Yao LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROGRAMMING/READING A NON-VOLATILE MEMORY WITH A SEQUENCE
- Publication number 20130286733
- Publication date Oct 31, 2013
- HAN-LUNG HUANG
- G11 - INFORMATION STORAGE

Han-Ming HUANG

Person

Patents Grantslast 30 patents

Package structure and method of fabricating the same

Fixing belt of wearable device, method for manufacturing the same,...

Voltage regulator device

Package structure and method of fabricating the same

Multi-chip packages

Fan

Voltage reduction circuit for bandgap reference voltage circuit

Method of assembling contacts into housing via respective contact c...

Multi-chip wafer level packages

Current generation circuit

Methods of forming multi-chip wafer level packages

Method of manufacturing circuit board with embedded conductive circ...

Manufacturing method of capacitor structure

Circuit board and method for manufacturing the same

Electrical connector and method making the same

Circuit board and method for manufacturing the same

Multi-chip wafer level packages and methods of forming the same

Circuit board and method for manufacturing the same

Circuit board and method for manufacturing the same

Circuit board and manufacturing method

Circuit board and method for manufacturing the same

Method of forming semiconductor device

Power factor-corrected resonant converter and parallel power factor...

Method of sorting a multi-bit per cell non-volatile memory and a mu...

Common-core power factor correction resonant converter

Method of programming a multi-bit per cell non-volatile memory

Manufacturing method of anti punch-through leakage current metal-ox...

Method and apparatus for controlling the equivalent resistance of a...

Method of programming/reading a non-volatile memory with a sequence

Method and system of dynamic data storage for error correction in a...

Patents Applicationslast 30 patents

METHOD OF FABRICATING PACKAGE STRUCTURE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

ELECTROSTATIC DISCHARGE (ESD) PROTECTION STRUCTURE

METHOD AND MEASURING DEVICE FOR MEASURING REACTION FORCE AND TORQUE...

POWER DELIVERY STRUCTURES AND METHODS OF MANUFACTURING THEREOF

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

BRIDGING-RESISTANT MICROBUMP STRUCTURES AND METHODS OF FORMING THE...

MULTI-CHIP PACKAGES AND METHODS OF FORMING THE SAME

BASIN-SHAPED UNDERBUMP PLATES AND METHODS OF FORMING THE SAME

FINE PITCH CHIP INTERCONNECT STRUCTURE FOR BUMP BRIDGE AND HIGH TEM...

VOLTAGE REGULATOR DEVICE

FIXING BELT OF WEARABLE DEVICE, METHOD FOR MANUFACTURING THE SAME,...

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

FAN

MULTI-CHIP PACKAGES

VOLTAGE REDUCTION CIRCUIT FOR BANDGAP REFERENCE VOLTAGE CIRCUIT

CURRENT GENERATION CIRCUIT

DEVICE AND METHOD FOR DETECTING COUPLING BETWEEN PHYSIOLOGICAL SIGNALS

METHOD OF ASSEMBLING CONTACTS INTO HOUSING VIA RESPECTIVE CONTACT C...

CIRCUIT BOARD

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTI-CHIP WAFER LEVEL PACKAGES

METHODS OF FORMING MULTI-CHIP WAFER LEVEL PACKAGES

ELECTRICAL CONNECTOR AND METHOD MAKING THE SAME

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTI-CHIP WAFER LEVEL PACKAGES AND METHODS OF FORMING THE SAME

NON-CONTACT WAFER TRANSPORT DEVICE

COMMON-CORE POWER FACTOR CORRECTION RESONANT CONVERTER

MANUFACTURING METHOD OF ANTI PUNCH-THROUGH LEAKAGE CURRENT METAL-OX...

METHOD OF PROGRAMMING/READING A NON-VOLATILE MEMORY WITH A SEQUENCE