Han-Shin Youn

Person

Cheonan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Package for semiconductor device including guide rings and manufact...
- Patent number 9,018,041
- Issue date Apr 28, 2015
- Samsung Electronics Co., Ltd.
- Han-shin Youn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device package including a he...
- Patent number 8,278,154
- Issue date Oct 2, 2012
- Samsung Electronics Co., Ltd.
- Han-Shin Youn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board including solder ball land having hole and semiconduc...
- Patent number 7,952,199
- Issue date May 31, 2011
- Samsung Electronics Co., Ltd.
- Sang-Gui Jo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board including solder ball land having hole and semiconduc...
- Patent number 7,667,325
- Issue date Feb 23, 2010
- Samsung Electronics Co., Ltd.
- Sang-Gui Jo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packaging mold and method of manufacturing semiconduc...
- Patent number 7,504,736
- Issue date Mar 17, 2009
- Samsung Electronics Co., Ltd.
- Sang-Uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, semiconductor chip package using the lead frame, and me...
- Patent number 7,436,049
- Issue date Oct 14, 2008
- Samsung Electronics Co., Ltd.
- Han-Shin Youn
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE FOR SEMICONDUCTOR DEVICE INCLUDING GUIDE RINGS AND MANUFACT...
- Publication number 20140051243
- Publication date Feb 20, 2014
- Samsung Electronics Co., Ltd.
- Han-shin YOUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130234310
- Publication date Sep 12, 2013
- Samsung Electronics Co., Ltd.
- Han-Shin Youn
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20120040498
- Publication date Feb 16, 2012
- Samsung Electronics Co., Ltd.
- Han-Shin YOUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD INCLUDING SOLDER ABLL LAND HAVING HOLE AND SEMICONDUC...
- Publication number 20100116539
- Publication date May 13, 2010
- Sang-Gui Jo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20100019372
- Publication date Jan 28, 2010
- Samsung Electronics Co., Ltd.
- Han-Shin YOUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD INCLUDING SOLDER BALL LAND HAVING HOLE AND SEMICONDUC...
- Publication number 20080036085
- Publication date Feb 14, 2008
- Samsung Electronics Co., Ltd.
- Sang-Gui JO
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH PROTECTION LAYER
- Publication number 20070190688
- Publication date Aug 16, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Han-Shin YOUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor packaging mold and method of manufacturing semiconduc...
- Publication number 20060214283
- Publication date Sep 28, 2006
- Sang-Uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip bonding structure using non-conductive adhesive and relat...
- Publication number 20060097377
- Publication date May 11, 2006
- Han-Shin Youn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame, semiconductor chip package using the lead frame, and me...
- Publication number 20050167791
- Publication date Aug 4, 2005
- Han-Shin Youn
- H01 - BASIC ELECTRIC ELEMENTS

Han-Shin Youn

Person

Patents Grantslast 30 patents

Package for semiconductor device including guide rings and manufact...

Method of fabricating a semiconductor device package including a he...

Circuit board including solder ball land having hole and semiconduc...

Circuit board including solder ball land having hole and semiconduc...

Semiconductor packaging mold and method of manufacturing semiconduc...

Lead frame, semiconductor chip package using the lead frame, and me...

Patents Applicationslast 30 patents

PACKAGE FOR SEMICONDUCTOR DEVICE INCLUDING GUIDE RINGS AND MANUFACT...

FLIP CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME

CIRCUIT BOARD INCLUDING SOLDER ABLL LAND HAVING HOLE AND SEMICONDUC...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME

CIRCUIT BOARD INCLUDING SOLDER BALL LAND HAVING HOLE AND SEMICONDUC...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH PROTECTION LAYER

Semiconductor packaging mold and method of manufacturing semiconduc...

Flip chip bonding structure using non-conductive adhesive and relat...

Lead frame, semiconductor chip package using the lead frame, and me...