METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH PROTECTION LAYER

Abstract

A method for manufacturing a semiconductor device may comprise preparing a wafer having a front surface and a back surface. The wafer may have a plurality of semiconductor chips and scribe lines between the adjacent semiconductor chips. The wafer may be sawn along the scribe lines to form grooves between the adjacent semiconductor chips. A liquid protection material may be screen printed or spin-coated to form a protection layer on the back surface and within the grooves. The protection layer within the grooves may be more narrowly cut to form individual semiconductor devices and to leave a protection layer remaining thereon.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The example embodiments of the present invention will be readily understood with reference to the following detailed description thereof provided in conjunction with the accompanying drawings, wherein like reference numerals designate like structural elements.

FIG. 1 is a flow chart of a method for manufacturing a semiconductor device in accordance with an example embodiment of the present invention.

FIGS. 2 through 8 are views of each step of the method for manufacturing a semiconductor device of FIG. 1.

FIG. 9 is a cross-sectional view of another example of a semiconductor device manufactured by the method of FIG. 1.

FIG. 10 is a cross-sectional view of a semiconductor package using the semiconductor device of FIG. 9.

Claims

1. A method for manufacturing a semiconductor device, the method comprising: preparing a wafer having a front surface and a back surface, the wafer having a plurality of semiconductor chips;sawing the wafer to form grooves between the semiconductor chips;forming by screen printing a protection layer on the back surface and within the grooves; andsawing a portion of the protection layer within the grooves to form individual semiconductor devices each with a protection layer.

2. The method of claim 1, wherein the wafer has a tape attached to the front surface.

3. The method of claim 1, wherein the wafer includes scribe lines on the front surface and the wafer is cut therealong at a predetermined depth into the front surface.

4. The method of claim 1, wherein preparing the wafer includes attaching a tape to the front surface of the wafer and backlapping the back surface of the wafer.

5. The method of claim 1, wherein the grooves are formed at a first width and wherein the step of sawing a portion of the protection layer is performed at a second width more narrow than the first width.

6. The method of claim 1, wherein each of the semiconductor chips has a plurality of chip pads provided on the front surface.

7. The method of claim 6, wherein the semiconductor chip is a center pad type semiconductor chip.

8. The method of claim 1, wherein the semiconductor chips have a plurality of external connection terminals provided on the front surface.

9. The method of claim 8, wherein preparing the wafer includes attaching a tape to the front surface of the wafer and wherein the tape comprises a base film and an adhesive layer provided on the base film and the adhesive layer is formed of sufficient height to cover the external connection terminals.

10. The method of claim 1, wherein the protection layer is formed from a liquid protection material taken from a group including an insulating epoxy resin and a silicon based resin.

11. The method of claim 10, wherein forming the protection layer includes providing the liquid protection material on the back surface of the wafer, screen printing the liquid protection material on the back surface of the wafer including the grooves, and curing the liquid protection material.

12. The method of claim 1, wherein the step of sawing the wafer and the step of sawing the protection layer each are performed by one of a group consisting of a sawing blade, laser, and water.

13. A method for manufacturing a wafer level semiconductor device, the method comprising: preparing a wafer having a front surface and a back surface, the wafer having a plurality of semiconductor chips and scribe lines provided between the semiconductor devices;sawing the wafer along the scribe lines to form grooves between the semiconductor chips;forming a protection layer on the back surface and within the grooves; andsawing a portion of the protection layer within the grooves to form individual semiconductor devices each with a protection layer.

14. The method of claim 13, wherein the groove is formed of sufficient width to subsequently saw a portion the protection layer formed therein.

15. The method of claim 13, wherein the individual semiconductor devices each have a plurality of external connection terminals provided on the front surface thereof.

16. The method of claim 15, wherein the wafer has a tape attached to the front surface, and the tape comprises a base film and an adhesive layer provided on the base film and the adhesive layer is formed of sufficient height to cover the plurality of external connection terminals.

17. The method of claim 13, wherein the step of forming the protection layer is by one of a group comprising screen-printing and spin coating.

18. A method for manufacturing a semiconductor device, the method comprising: preparing a wafer having a front surface and a back surface, the wafer having a plurality of semiconductor chips and scribe lines provided between the adjacent semiconductor devices;half cutting the wafer along the scribe lines of the front surface;attaching a tape to the front surface of the wafer;sawing the back surface of the wafer to form grooves between the adjacent semiconductor chips;forming a protection layer on the back surface and within the grooves;curing the protection layer;sawing a portion of the protection layer within the grooves to form individual semiconductor devices each with a protection layer; andseparating the individual semiconductor devices from the tape.

19. The method of claim 18, wherein the grooves are formed at a first width sufficient to subsequently remove a portion of the protection layer within the grooves at a more narrow width.

20. The method of claim 19, wherein the semiconductor chips each have a plurality of external connection terminals provided on the front surface.

21. The method of claim 20, wherein the tape comprises a base film and an adhesive layer provided on the base film and the adhesive layer is sufficient to cover the external connection terminals.

22. The method of claim 18, wherein the step of forming the protection layer is by one of a group comprising screen-printing and spin coating.

23. A method of protecting a semiconductor device taken from a wafer of semiconductor devices, the method comprising: supporting the wafer at a front surface thereof;forming a gap of given width between semiconductor devices of the wafer to expose side surfaces of the semiconductor devices;attaching concurrently a protective material to a backside of the wafer and the side surfaces;removing a first portion of the protective material within the gap to leave a second portion thereof attached to the side surfaces; andremoving support of the wafer at the front surface thereof.

24. The method of protecting a semiconductor device according to claim 23, wherein the attaching step includes filling the gap with the protective material.