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Wafer Bonding Apparatus and Method
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Publication number 20240387451
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Publication date Nov 21, 2024
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H01 - BASIC ELECTRIC ELEMENTS
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COAXIAL CABLE CONNECTOR
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Publication date Aug 15, 2024
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EZCONN CORPORATION
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Chi Bin HUANG
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H01 - BASIC ELECTRIC ELEMENTS
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COMPOSITE HEAT DISSIPATION DEVICE
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Publication date Aug 8, 2024
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TAIWAN MICROLOOPS CORP.
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Chun-Hung LIN
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CHARGING SYSTEM FOR MOBILE DEVICE
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Publication date Jun 13, 2024
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ASUSTEK COMPUTER INC.
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Chia-Jui SHIH
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PCM DEVICE
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Publication date Jan 4, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Chang-Chih Huang
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H01 - BASIC ELECTRIC ELEMENTS
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ANALYSIS CARTRIDGE and ANALYSIS METHOD
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Publication number 20230383337
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Publication date Nov 30, 2023
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CREDO DIAGNOSTICS BIOMEDICAL PTE. LTD.
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Yu-Cheng Ou
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SEMICONDUCTOR DEVICE AND METHOD
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Publication number 20230378001
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Publication date Nov 23, 2023
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Tsai-Yu Huang
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H01 - BASIC ELECTRIC ELEMENTS
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SERVER CHASSIS
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Publication number 20230284410
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Publication date Sep 7, 2023
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INVENTEC (PUDONG) TECHNOLOGY CORPORATION
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HAN-SHENG CHEN
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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MICROWAVE HEATING APPARATUS
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Publication number 20230156877
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Publication date May 18, 2023
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WAVE POWER TECHNOLOGY INC.
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Hsuan-Hao TENG
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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