The present disclosure relates to a technical field of a heat dissipation device, and in particular, to a composite heat dissipation device.
Due to the improvement of 3D graphics software and its imaging function, graphics chips of the graphics cards for processing images have greatly improved its compute capability, which causes problems of heat rise of processors and problems of heat dissipation.
In related-art heat dissipation designs for the graphics cards, there are still many graphics cards that dissipate heat by means of air cooling, aside from liquid cooling. It is common practice to combine heat sinks and cooling fans. However, such combination of components often have limited heat dissipation efficiency for waste heat generated by electronic heat sources under the influence of the surrounding environment or due to the mutual interference between airflows. Therefore, the present application aims to solve the aforementioned technical problems.
In light of the above, the inventor of the present disclosure has devoted himself to doing research and studying scientific principles so as to solve the above problem of related-art techniques.
It is an objective of the present disclosure to provide a composite heat dissipation device with air outlets provided in a scattered arrangement, so that airflows do not interfere with each other, thereby improving heat dissipation performance.
Accordingly, the present disclosure provides a composite heat dissipation device, including a base, a cover, a first fan, and a second fan. The cover covers the base. A first heat dissipation area and a second heat dissipation area are arranged between the base and the cover. In the first heat dissipation area, the cover is provided with a first air inlet and a first air outlet communicating with the first air inlet. In the second heat dissipation area, the cover is provided with a second air inlet, a second air outlet, and a third air outlet, and the second air outlet and the third air outlet communicate with the second air inlet. The first fan is disposed on the base and arranged corresponding to the first air inlet and the first air outlet. The second fan is disposed on the base and arranged corresponding to the second air inlet, the second air outlet, and the third air outlet. The first air outlet and the second air outlet are arranged at two sides of the cover opposite to each other, and the third air outlet is arranged adjacent to the second air outlet.
The present disclosure provides the following function. In the second heat dissipation area, the number of the air outlets is greater than the number of the air inlets. Therefore, waste heat generated by the second heat dissipation member is quickly and sufficiently discharged to the outside of the cover. Further, a partition of the cover is used to block air circulation between the first heat dissipation area and the second heat dissipation area. An airflow direction in the second heat dissipation channel is opposite to an airflow direction in the first heat dissipation channel, so that waste heat generated by each electronic heat source may spread out to be discharged.
The technical content of the present disclosure is described in detail below with reference to the accompanying drawings. The accompanying drawings are only for reference and illustrative purposes, and are not intended to limit the present disclosure.
Referring to
The base 10 is substantially rectangular-shaped, which includes a plurality of support rods 11 and a plurality of studs 12. The support rods 11 are arranged at intervals and arranged in a horizontal direction and in a vertical direction. Some of the support rods 11 are provided with the studs 12 to be fastened to locking elements such as screws by treaded connection.
The cover 20 covers the base 10 and is arranged on one side of the base 10. A first heat dissipation area H1 and a second heat dissipation area H2 are arranged between the base 10 and the cover 20.
In one embodiment, the cover 20 may be made of a metal material and has a rectangular shape. The cover 20 mainly includes a panel 21, a left side plate 22, a right side plate 23, an upper side plate 24, and a lower side board 25, and the left side plate 22, the right side plate 23, the upper side plate 24, and the lower side board 25 are perpendicularly extended from the panel 21. The left side plate 22 is disposed opposite to the right side plate 23. The upper side plate 24 is disposed adjacent to the plate side plate 23.
A first air inlet 211 is defined on the panel 21 of the cover 20 in the first heat dissipation area H1. A first air outlet 221 communicating with the first air inlet 211 is defined on the left side plate 22 of the cover 20. A second air inlet 212 is defined on the panel 21 of the cover 20 in the second heat dissipation area H2. A second air outlet 231 communicating with the second air inlet 212 is defined on the right side plate 23 of the cover 20. A third air outlet 241 communicating with the second air inlet 212 is defined on the upper side plate 24 of the cover 20.
In one embodiment, the cover 20 further includes a partition 26. The partition 26 is disposed between the first heat dissipation area H1 and the second heat dissipation area H2, so as to block air circulation between the first heat dissipation area H1 and the second heat dissipation area H2.
The first fan 30 is a centrifugal fan disposed on the base 10 and arranged corresponding to the first air inlet 211 and the first air outlet 221. An impeller of the first fan 30 may be made of a metal material.
The second fan 40 is also a centrifugal fan. The second fan 40 is disposed on the base 10 and arranged corresponding to the second air inlet 212, the second air outlet 231, and the third air outlet 241. An impeller of the second fan 40 may be made of a metal material.
In one embodiment, the first heat dissipation area H1 includes a first heat dissipation channel C1 (as shown in
In one embodiment, the composite heat dissipation device 1 of the present disclosure further includes a first heat dissipation member 50 arranged in the first heat dissipation channel C1 and disposed between the first fan 30 and the first air outlet 221. The first heat dissipation member 50 may be a heat dissipation fin set.
In one embodiment, the second heat dissipation area H2 includes a second heat dissipation channel C2 (as shown in
In one embodiment, the composite heat dissipation device 1 of the present disclosure further includes a second heat dissipation member 60. The second heat dissipation member 60 is disposed in the second heat dissipation channel C2 and the third heat dissipation channel C3. The second heat dissipation member 60 includes a heat pipe 61 and two heat dissipation fin sets 62, the heat pipe 61 is U-shaped and arranged around an outer periphery of the second fan 40. One of the heat dissipation fin sets 62 is attached to the heat pipe 61 and disposed between the second fan 40 and the second air outlet 231. The other one of the heat dissipation fin sets 62 is attached to the heat pipe 61 and disposed between the second fan 40 and the third air outlet 241.
In one embodiment, the composite heat dissipation device 1 of the present disclosure further includes a vapor chamber (VC) 70. The vapor chamber 70 is disposed on the base 10 and is in thermal contact with the first heat dissipation member 50 and the second heat dissipation member 60.
Referring to
Please refer to
While this disclosure has been described by means of specific embodiments, numerous modifications and variations may be made thereto by those skilled in the art without departing from the scope and spirit of this disclosure set forth in the claims.
Number | Date | Country | Kind |
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112103695 | Feb 2023 | TW | national |