Hanae Shimokawa

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Mechanical quantity measuring device and sensor unit
- Patent number 10,481,023
- Issue date Nov 19, 2019
- Hitachi Automotive Systems, Ltd.
- Hanae Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, mechanical quantity measuring device, and sem...
- Patent number 10,247,630
- Issue date Apr 2, 2019
- Hitachi Automotive Systems, Ltd.
- Hanae Shimokawa
- G01 - MEASURING TESTING
Information Patent Grant
Pb-free solder-connected structure
- Patent number 8,907,475
- Issue date Dec 9, 2014
- Renesas Electronics Corporation
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pb-free solder-connected structure and electronic device
- Patent number 8,503,189
- Issue date Aug 6, 2013
- Renesas Electronics Corporation
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor power module
- Patent number 8,125,090
- Issue date Feb 28, 2012
- Hitachi, Ltd.
- Tasao Soga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder composition for electronic devices
- Patent number 8,022,551
- Issue date Sep 20, 2011
- Renesas Electronics Corporation
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor power module including epoxy resin coating
- Patent number 8,004,075
- Issue date Aug 23, 2011
- Hitachi, Ltd.
- Tasao Soga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pb-free solder-connected structure and electronic device
- Patent number 7,709,746
- Issue date May 4, 2010
- Renesas Technology Corp.
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with lead-free solder
- Patent number 7,259,465
- Issue date Aug 21, 2007
- Hitachi, Ltd.
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor device having solder bumps reliably reflow solderable
- Patent number 7,145,236
- Issue date Dec 5, 2006
- Renesas Technology Corp.
- Kazuma Miura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 7,075,183
- Issue date Jul 11, 2006
- Hitachi, Ltd.
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method of producing an electronic device having a PB free solder co...
- Patent number 7,013,564
- Issue date Mar 21, 2006
- Hitachi, Ltd.
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pb-free solder-connected structure and electronic device
- Patent number 6,960,396
- Issue date Nov 1, 2005
- Hitachi, Ltd.
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 6,774,490
- Issue date Aug 10, 2004
- Hitachi, Ltd.
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electron device and semiconductor device
- Patent number 6,555,052
- Issue date Apr 29, 2003
- Hitachi, Ltd.
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module having solder bumps and solder portions with d...
- Patent number 6,486,411
- Issue date Nov 26, 2002
- Hitachi, Ltd.
- Kazuma Miura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus of manufacturing an electronic circuit board
- Patent number 6,204,490
- Issue date Mar 20, 2001
- Hitachi, Ltd.
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder used for connecting electronic parts on organic su...
- Patent number 5,942,185
- Issue date Aug 24, 1999
- Hitachi, Ltd.
- Tetsuya Nakatsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric appliance, printed circuit board, remained life estimation...
- Patent number 5,867,809
- Issue date Feb 2, 1999
- Hitachi, Ltd.
- Tasao Soga
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, MECHANICAL QUANTITY MEASURING DEVICE, AND SEM...
- Publication number 20180202883
- Publication date Jul 19, 2018
- Hitachi Automotive Systems, Ltd.
- Hanae SHIMOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mechanical Quantity Measuring Device and Sensor Unit
- Publication number 20170108390
- Publication date Apr 20, 2017
- Hitachi Automotive Systems, Ltd.
- Hanae SHIMOKAWA
- G01 - MEASURING TESTING
Information Patent Application
Pb-FREE SOLDER-CONNECTED STRUCTURE
- Publication number 20130286621
- Publication date Oct 31, 2013
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20100289148
- Publication date Nov 18, 2010
- Tasao Soga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pb-free solder-connected structure and electronic device
- Publication number 20100214753
- Publication date Aug 26, 2010
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20070246833
- Publication date Oct 25, 2007
- Tasao Soga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder composition for electronic devices
- Publication number 20070031279
- Publication date Feb 8, 2007
- Renesas Technology Corporation
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Pb-free solder-connected structure and electronic device
- Publication number 20060115994
- Publication date Jun 1, 2006
- Hanae Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electron device and semiconductor device
- Publication number 20030186072
- Publication date Oct 2, 2003
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device having solder bumps reliably reflow solderable
- Publication number 20030030149
- Publication date Feb 13, 2003
- Kazuma Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device
- Publication number 20020171157
- Publication date Nov 21, 2002
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Pb-free solder-connected structure and electronic device
- Publication number 20020163085
- Publication date Nov 7, 2002
- Hanae Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device
- Publication number 20020114726
- Publication date Aug 22, 2002
- Hitachi, Ltd
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Electronic device
- Publication number 20020100986
- Publication date Aug 1, 2002
- Hitachi, Ltd
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Electron device and semiconductor device
- Publication number 20020066583
- Publication date Jun 6, 2002
- Tasao Soga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pb-free solder-connected structure and electronic device
- Publication number 20020019077
- Publication date Feb 14, 2002
- Hanae Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technical field
- Publication number 20020009610
- Publication date Jan 24, 2002
- Hanae Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module and circuit substrate
- Publication number 20010050181
- Publication date Dec 13, 2001
- Kazuma Miura
- H01 - BASIC ELECTRIC ELEMENTS

Hanae Shimokawa

Person

Patents Grantslast 30 patents

Mechanical quantity measuring device and sensor unit

Semiconductor device, mechanical quantity measuring device, and sem...

Pb-free solder-connected structure

Pb-free solder-connected structure and electronic device

Semiconductor power module

Solder composition for electronic devices

Semiconductor power module including epoxy resin coating

Pb-free solder-connected structure and electronic device

Semiconductor device with lead-free solder

Semiconductor device having solder bumps reliably reflow solderable

Electronic device

Method of producing an electronic device having a PB free solder co...

Pb-free solder-connected structure and electronic device

Electronic device

Electron device and semiconductor device

Semiconductor module having solder bumps and solder portions with d...

Method and apparatus of manufacturing an electronic circuit board

Lead-free solder used for connecting electronic parts on organic su...

Electric appliance, printed circuit board, remained life estimation...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, MECHANICAL QUANTITY MEASURING DEVICE, AND SEM...

Mechanical Quantity Measuring Device and Sensor Unit

Pb-FREE SOLDER-CONNECTED STRUCTURE

SEMICONDUCTOR POWER MODULE

Pb-free solder-connected structure and electronic device

SEMICONDUCTOR POWER MODULE

Solder composition for electronic devices

Pb-free solder-connected structure and electronic device

Electron device and semiconductor device

Semiconductor device having solder bumps reliably reflow solderable

Electronic device

Pb-free solder-connected structure and electronic device

Electronic device

Electronic device

Electron device and semiconductor device

Pb-free solder-connected structure and electronic device

Technical field

Semiconductor module and circuit substrate