Hans-Herrmann Oppermann

Person

Berlin, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Optical system, optical components, and method for manufacturing an...
- Patent number 11,726,263
- Issue date Aug 15, 2023
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Hans-Hermann Oppermann
- G02 - OPTICS
Information Patent Grant
Assembly comprising a substrate and two components including optica...
- Patent number 11,402,583
- Issue date Aug 2, 2022
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Hans-Hermann Oppermann
- G02 - OPTICS
Information Patent Grant
Markup system for optical system, carrier substrate, and method for...
- Patent number 11,385,404
- Issue date Jul 12, 2022
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Charles-Alix Manier
- G02 - OPTICS
Information Patent Grant
Method for manufacturing a semiconductor component and a semiconduc...
- Patent number 10,658,187
- Issue date May 19, 2020
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for arranging electronic switching elements, electronic swit...
- Patent number 9,917,070
- Issue date Mar 13, 2018
- Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung E.V.
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement of a substrate with at least one optical waveguide and...
- Patent number 9,507,107
- Issue date Nov 29, 2016
- Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung E.V.
- Hans-Hermann Oppermann
- G02 - OPTICS
Information Patent Grant
Optical coupling system having an optical coupler and a light-trans...
- Patent number 9,134,483
- Issue date Sep 15, 2015
- Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Hans-Hermann Oppermann
- G02 - OPTICS
Information Patent Grant
Component arrangement and method for production thereof
- Patent number 8,564,969
- Issue date Oct 22, 2013
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Hans-Hermann Oppermann
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
In vivo implantable coil assembly
- Patent number 8,521,303
- Issue date Aug 27, 2013
- University of Utah Reasearch Foundation
- Florian Solzbacher
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Self-assembly of components
- Patent number 7,861,914
- Issue date Jan 4, 2011
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Hans-Hermann Oppermann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Flip chip metallization method and devices
- Patent number 7,388,288
- Issue date Jun 17, 2008
- University of Utah Research Foundation
- Florian Solzbacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the formation of a spatial chip arrangement and spatial...
- Patent number 7,087,442
- Issue date Aug 8, 2006
- PAC Tech-Packaging Technologies GmbH
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact-bumpless chip contacting method and an electronic circuit p...
- Patent number 6,407,457
- Issue date Jun 18, 2002
- Smart Pac GmbH Technology Services
- Rolf Aschenbrenner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chips arranged in plurality of planes and electrically connected to...
- Patent number 6,281,577
- Issue date Aug 28, 2001
- PAC Tech-Packaging Technologies GmbH
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-contacting method requiring no contact bumps, and electronic c...
- Patent number 6,107,118
- Issue date Aug 22, 2000
- Zakel; Elke
- Rolf Aschenbrenner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip module with conductor paths on the chip bonding side of a chip...
- Patent number 6,093,971
- Issue date Jul 25, 2000
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of joining electronic components to a substrate
- Patent number 5,976,302
- Issue date Nov 2, 1999
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Hans Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for remelting a contact surface metallization
- Patent number 5,845,838
- Issue date Dec 8, 1998
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Jorg Gwiasda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR ARRANGEMENT
- Publication number 20230005877
- Publication date Jan 5, 2023
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASSIVE PARALLEL ASSEMBLY METHOD
- Publication number 20220319902
- Publication date Oct 6, 2022
- Huawei Technologies Duesseldorf GmbH
- Hans-Hermann OPPERMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SYSTEM, OPTICAL COMPONENTS, AND METHOD FOR MANUFACTURING AN...
- Publication number 20210018687
- Publication date Jan 21, 2021
- Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e,V.
- Hans-Hermann Oppermann
- G02 - OPTICS
Information Patent Application
OPTICAL SYSTEM, CARRIER SUBSTRATE, AND METHOD FOR MANUFACTURING AN...
- Publication number 20210018679
- Publication date Jan 21, 2021
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Charles-Alix Manier
- G02 - OPTICS
Information Patent Application
ASSEMBLY COMPRISING A SUBSTRATE AND TWO COMPONENTS INCLUDING OPTIC...
- Publication number 20210018686
- Publication date Jan 21, 2021
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Hans-Hermann Oppermann
- G02 - OPTICS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND A SEMICONDUC...
- Publication number 20190088490
- Publication date Mar 21, 2019
- Fraunhofer-Gesellschaft zur foerderung der Angewandten Forschung e.V.
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ARRANGING ELECTRONIC SWITCHING ELEMENTS, ELECTRONIC SWIT...
- Publication number 20170170141
- Publication date Jun 15, 2017
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGEMENT OF A SUBSTRATE WITH AT LEAST ONE OPTICAL WAVEGUIDE AND...
- Publication number 20150010270
- Publication date Jan 8, 2015
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Hans-Herrmann Oppermann
- G02 - OPTICS
Information Patent Application
Optical coupling system having an optical coupler and a light-trans...
- Publication number 20140254984
- Publication date Sep 11, 2014
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Hans-Herrmann Oppermann
- G02 - OPTICS
Information Patent Application
Component arrangement and method for production thereof
- Publication number 20120039056
- Publication date Feb 16, 2012
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLY OF COMPONENTS
- Publication number 20100096439
- Publication date Apr 22, 2010
- Fraunhofer-Gesellschaft zur foerderung der Angewandten Forschung e.V.
- Hans-Hermann Oppermann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Process for the formation of a spatial chip arrangement and spatial...
- Publication number 20020009828
- Publication date Jan 24, 2002
- PAC TECH - PACKAGING TECHNOLOGIES GMBH
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS

Hans-Herrmann Oppermann

Person

Patents Grantslast 30 patents

Optical system, optical components, and method for manufacturing an...

Assembly comprising a substrate and two components including optica...

Markup system for optical system, carrier substrate, and method for...

Method for manufacturing a semiconductor component and a semiconduc...

Method for arranging electronic switching elements, electronic swit...

Arrangement of a substrate with at least one optical waveguide and...

Optical coupling system having an optical coupler and a light-trans...

Component arrangement and method for production thereof

In vivo implantable coil assembly

Self-assembly of components

Flip chip metallization method and devices

Process for the formation of a spatial chip arrangement and spatial...

Contact-bumpless chip contacting method and an electronic circuit p...

Chips arranged in plurality of planes and electrically connected to...

Chip-contacting method requiring no contact bumps, and electronic c...

Chip module with conductor paths on the chip bonding side of a chip...

Method of joining electronic components to a substrate

Process for remelting a contact surface metallization

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING A SEMICONDUCTOR ARRANGEMENT

MASSIVE PARALLEL ASSEMBLY METHOD

OPTICAL SYSTEM, OPTICAL COMPONENTS, AND METHOD FOR MANUFACTURING AN...

OPTICAL SYSTEM, CARRIER SUBSTRATE, AND METHOD FOR MANUFACTURING AN...

ASSEMBLY COMPRISING A SUBSTRATE AND TWO COMPONENTS INCLUDING OPTIC...

METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND A SEMICONDUC...

METHOD FOR ARRANGING ELECTRONIC SWITCHING ELEMENTS, ELECTRONIC SWIT...

ARRANGEMENT OF A SUBSTRATE WITH AT LEAST ONE OPTICAL WAVEGUIDE AND...

Optical coupling system having an optical coupler and a light-trans...

Component arrangement and method for production thereof

SELF-ASSEMBLY OF COMPONENTS

Process for the formation of a spatial chip arrangement and spatial...