Number | Date | Country | Kind |
---|---|---|---|
195 04 351 | Feb 1995 | DEX |
Filing Document | Filing Date | Country | Kind | 102e Date | 371c Date |
---|---|---|---|---|---|
PCT/DE95/01871 | 12/23/1995 | 11/7/1997 | 11/7/1997 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO96/24951 | 8/15/1996 |
Number | Name | Date | Kind |
---|---|---|---|
3765938 | Cranston | Oct 1973 | |
3869787 | Umbaugh | Mar 1975 | |
4340167 | Packer et al. | Jul 1982 | |
5075253 | Sliwa, Jr. | Dec 1991 |
Entry |
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IBM Technical Disclosure Bulletin, "Flip Chip Substrate Joining Process", r. 1970, US, vol. 12, No. 11, pp. 1-2. |