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Hao-Chieh Yung
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Hsinchu, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Method for fabricating oxide layers with different thicknesses
Patent number
6,660,593
Issue date
Dec 9, 2003
Winbond Electronics Corp.
Shing-Sing Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal-line structure having a spacer structure covering the sidewal...
Patent number
6,307,266
Issue date
Oct 23, 2001
Winbond Electronics Corp.
Hao-Chieh Yung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of enhancing CMP removal rate of polymer-like material and i...
Patent number
6,150,274
Issue date
Nov 21, 2000
Winbond Electronics Corp.
Ping Liou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal-line structure in integrated circuit and method of fabricatin...
Patent number
6,127,252
Issue date
Oct 3, 2000
Winbond Electronics Corp.
Hao-Chieh Yung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Precision breaking of semiconductor wafer into chips by applying an...
Patent number
6,075,280
Issue date
Jun 13, 2000
Winbond Electronics Corporation
Hao-Chieh Yung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing an inductor with resonant frequency and Q...
Patent number
6,057,202
Issue date
May 2, 2000
Windbond Electronics Corp.
Tzong-Liang Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and structure for preventing bonding pads from peeling cause...
Patent number
6,034,439
Issue date
Mar 7, 2000
Winbond Electronics Corporation
Kuo-Shi Teng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Method for fabricating oxide layers with different thicknesses
Publication number
20020081798
Publication date
Jun 27, 2002
Shing-Sing Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MONOLITHIC HIGH-Q INDUCTANCE DEVICE AND PROCESS FOR FABRICATING THE...
Publication number
20020008301
Publication date
Jan 24, 2002
PING LIOU
H01 - BASIC ELECTRIC ELEMENTS