Hari S. Venugopalan

Person

Somerset, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Underfill for light emitting device
- Patent number 7,843,074
- Issue date Nov 30, 2010
- Lumination LLC
- Xiang Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized contact design for thermosonic bonding of flip-chip devices
- Patent number 7,667,236
- Issue date Feb 23, 2010
- Lumination LLC
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip light emitting diode with a thermally stable multiple lay...
- Patent number 7,385,229
- Issue date Jun 10, 2008
- Lumination LLC
- Hari S. Venugopalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip light emitting diode with indium-tin-oxide based reflecti...
- Patent number 7,358,539
- Issue date Apr 15, 2008
- Lumination LLC
- Hari S. Venugopalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED with series-connected monolithically integrated mesas
- Patent number 7,285,801
- Issue date Oct 23, 2007
- Lumination, LLC
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GaN LED with solderable backside metal
- Patent number 7,190,005
- Issue date Mar 13, 2007
- Gelcore, LLC
- Shawn R. Gibb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip light emitting diode device without sub-mount
- Patent number 7,179,670
- Issue date Feb 20, 2007
- Gelcore, LLC
- Bryan S. Shelton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip light emitting diode with a thermally stable multiple lay...
- Patent number 7,141,828
- Issue date Nov 28, 2006
- Gelcore, LLC
- Hari S. Venugopalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increased light extraction from a nitride LED
- Patent number 7,125,734
- Issue date Oct 24, 2006
- Gelcore, LLC
- Michael J. Sackrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip light emitting diode with micromesas and a conductive mesh
- Patent number 7,064,356
- Issue date Jun 20, 2006
- Gelcore, LLC
- Emil P. Stefanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming aluminum-containing p-contacts for group III-ni...
- Patent number 7,022,550
- Issue date Apr 4, 2006
- GelCore LLC
- Hari S. Venugopalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package having improved light extraction
- Patent number 7,023,022
- Issue date Apr 4, 2006
- Emcore Corporation
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Led packages having improved light extraction
- Patent number 7,015,516
- Issue date Mar 21, 2006
- GelCore LLC
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized contact design for flip-chip LED
- Patent number 6,958,498
- Issue date Oct 25, 2005
- Emcore Corporation
- Bryan Shelton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GaN based LED lighting extraction efficiency using digital diffract...
- Patent number 6,903,379
- Issue date Jun 7, 2005
- GelCore LLC
- Michael Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GaN LED with solderable backside metal
- Patent number 6,787,435
- Issue date Sep 7, 2004
- GelCore LLC
- Shawn R. Gibb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device with improved light extraction
- Patent number 6,746,889
- Issue date Jun 8, 2004
- Emcore Corporation
- Ivan Eliashevich
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact to n-GaN with Au termination
- Patent number 6,653,215
- Issue date Nov 25, 2003
- Emcore Corporation
- Michael G. Brown
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LASER LIFT-OFF WITH IMPROVED LIGHT EXTRACTION
- Publication number 20100181584
- Publication date Jul 22, 2010
- Xiang Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Small footprint high power light emitting package with plurality of...
- Publication number 20080121902
- Publication date May 29, 2008
- GELCORE LLC
- Michael Sackrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill for light emitting device
- Publication number 20080061312
- Publication date Mar 13, 2008
- GELCORE LLC
- Xiang Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optimized contact design for thermosonic bonding of flip-chip devices
- Publication number 20070145379
- Publication date Jun 28, 2007
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip light emitting diode device without sub-mount
- Publication number 20070114557
- Publication date May 24, 2007
- GELCORE, LLC
- Bryan S. Shelton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lateral current GaN flip chip LED with shaped transparent substrate
- Publication number 20070096120
- Publication date May 3, 2007
- GELCORE LLC
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip light emitting diode with a thermally stable multiple lay...
- Publication number 20060261363
- Publication date Nov 23, 2006
- Emcore Corporation
- Hari S. Venugopalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASED LIGHT EXTRACTION FROM A NITRIDE LED
- Publication number 20060202223
- Publication date Sep 14, 2006
- GELCORE LLC
- Michael J. Sackrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High reflectivity p-contacts for group lll-nitride light emitting d...
- Publication number 20060186552
- Publication date Aug 24, 2006
- GELcore,LLC
- Hari S. Venugopalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thick laser-scribed GaN-on-sapphire optoelectronic devices
- Publication number 20050263854
- Publication date Dec 1, 2005
- Bryan S. Shelton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP LIGHT EMITTING DIODE WITH MICROMESAS AND A CONDUCTIVE MESH
- Publication number 20050230700
- Publication date Oct 20, 2005
- GELCORE, LLC
- Emil P. Stefanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High reflectivity p-contacts for group III-nitride light emitting d...
- Publication number 20050224990
- Publication date Oct 13, 2005
- GELCORE, LLC
- Hari S. Venugopalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED with series-connected monolithically integrated mesas
- Publication number 20050225973
- Publication date Oct 13, 2005
- GELCORE, LLC
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip light emitting diode device without sub-mount
- Publication number 20050194605
- Publication date Sep 8, 2005
- Bryan S. Shelton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GaN LED with solderable backside metal
- Publication number 20040232439
- Publication date Nov 25, 2004
- GELCORE LLC
- Shawn R. Gibb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP LIGHT EMITTING DIODE WITH INDIUM-TIN-OXIDE BASED REFLECTI...
- Publication number 20040201110
- Publication date Oct 14, 2004
- Emcore Corporation
- Hari S. Venugopalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP LIGHT EMITTING DIODE WITH A THERMALLY STABLE MULTIPLE LAY...
- Publication number 20040182914
- Publication date Sep 23, 2004
- Emcore Corporation
- Hari S. Venugopalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Led packages having improved light extraction
- Publication number 20040070004
- Publication date Apr 15, 2004
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic package having improved light extraction
- Publication number 20040065886
- Publication date Apr 8, 2004
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optimized contact design for flip-chip LED
- Publication number 20040061123
- Publication date Apr 1, 2004
- Emcore Corporation
- Bryan Shelton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GaN based LED lighting extraction efficiency using digital diffract...
- Publication number 20030213969
- Publication date Nov 20, 2003
- Emcore Corporation
- Michael Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GaN LED with solderable backside metal
- Publication number 20030010975
- Publication date Jan 16, 2003
- GELcore LLC
- Shawn R. Gibb
- H01 - BASIC ELECTRIC ELEMENTS

Hari S. Venugopalan

Person

Patents Grantslast 30 patents

Underfill for light emitting device

Optimized contact design for thermosonic bonding of flip-chip devices

Flip-chip light emitting diode with a thermally stable multiple lay...

Flip-chip light emitting diode with indium-tin-oxide based reflecti...

LED with series-connected monolithically integrated mesas

GaN LED with solderable backside metal

Flip-chip light emitting diode device without sub-mount

Flip-chip light emitting diode with a thermally stable multiple lay...

Increased light extraction from a nitride LED

Flip chip light emitting diode with micromesas and a conductive mesh

Methods for forming aluminum-containing p-contacts for group III-ni...

Microelectronic package having improved light extraction

Led packages having improved light extraction

Optimized contact design for flip-chip LED

GaN based LED lighting extraction efficiency using digital diffract...

GaN LED with solderable backside metal

Optoelectronic device with improved light extraction

Contact to n-GaN with Au termination

Patents Applicationslast 30 patents

LASER LIFT-OFF WITH IMPROVED LIGHT EXTRACTION

Small footprint high power light emitting package with plurality of...

Underfill for light emitting device

Optimized contact design for thermosonic bonding of flip-chip devices

Flip-chip light emitting diode device without sub-mount

Lateral current GaN flip chip LED with shaped transparent substrate

Flip-chip light emitting diode with a thermally stable multiple lay...

INCREASED LIGHT EXTRACTION FROM A NITRIDE LED

High reflectivity p-contacts for group lll-nitride light emitting d...

Thick laser-scribed GaN-on-sapphire optoelectronic devices

FLIP CHIP LIGHT EMITTING DIODE WITH MICROMESAS AND A CONDUCTIVE MESH

High reflectivity p-contacts for group III-nitride light emitting d...

LED with series-connected monolithically integrated mesas

Flip-chip light emitting diode device without sub-mount

GaN LED with solderable backside metal

FLIP-CHIP LIGHT EMITTING DIODE WITH INDIUM-TIN-OXIDE BASED REFLECTI...

FLIP-CHIP LIGHT EMITTING DIODE WITH A THERMALLY STABLE MULTIPLE LAY...

Led packages having improved light extraction

Microelectronic package having improved light extraction

Optimized contact design for flip-chip LED

GaN based LED lighting extraction efficiency using digital diffract...

GaN LED with solderable backside metal