Harlan R. Isaak

Person

Costa Mesa, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Panel stacking of BGA devices to form three-dimensional modules
- Patent number 6,878,571
- Issue date Apr 12, 2005
- Staktek Group L.P.
- Harlan R. Isaak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel stacking of BGA devices to form three-dimensional modules
- Patent number 6,566,746
- Issue date May 20, 2003
- DPAC Technologies, Corp.
- Harlan R. Isaak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel stacking of BGA devices to form three-dimensional modules
- Patent number 6,544,815
- Issue date Apr 8, 2003
- Harlan R. Isaak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable flex circuit IC package and method of making same
- Patent number 6,514,793
- Issue date Feb 4, 2003
- DPAC Technologies Corp.
- Harlan R. Isaak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory stacking using anisotropic epoxy interconn...
- Patent number 6,472,735
- Issue date Oct 29, 2002
- Harlan R. Isaak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable flex circuit chip package and method of making same
- Patent number 6,426,240
- Issue date Jul 30, 2002
- Harlan R. Isaak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable flex circuit IC package and method of making same
- Patent number 6,426,549
- Issue date Jul 30, 2002
- Harlan R. Isaak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel stacking of BGA devices to form three-dimensional modules
- Patent number 6,404,043
- Issue date Jun 11, 2002
- Dense-Pac Microsystems, Inc.
- Harlan R. Isaak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable flex circuit chip package and method of making same
- Patent number 6,351,029
- Issue date Feb 26, 2002
- Harlan R. Isaak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable flex circuit IC package and method of making same
- Patent number 6,323,060
- Issue date Nov 27, 2001
- Dense-Pac Microsystems, Inc.
- Harlan R. Isaak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip stack and method of making same
- Patent number 6,180,881
- Issue date Jan 30, 2001
- Harlan Ruben Isaak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular panel stacking process
- Patent number 5,869,353
- Issue date Feb 9, 1999
- Dense-Pac Microsystems, Inc.
- Aaron Uri Levy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of interfacing detector array layers
- Patent number 5,832,599
- Issue date Nov 10, 1998
- Northrop Grumman Corporation
- Harlan R. Isaak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detector alignment board
- Patent number 5,661,267
- Issue date Aug 26, 1997
- Northrop Grumman Corporation
- Harlan R. Isaak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic edge connect process
- Patent number 5,621,193
- Issue date Apr 15, 1997
- Northrop Grumman Corporation
- Harlan R. Isaak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip stack and method of making same
- Patent number 5,612,570
- Issue date Mar 18, 1997
- Dense-Pac Microsystems, Inc.
- Floyd K. Eide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antistretch screen printing arrangement
- Patent number 5,003,870
- Issue date Apr 2, 1991
- Hughes Aircraft Company
- Harlan Isaak
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
Panel stacking of BGA devices to form three-dimensional modules
- Publication number 20030127746
- Publication date Jul 10, 2003
- Harlan R. Isaak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Panel stacking of BGA devices to form three-dimensional modules
- Publication number 20030064548
- Publication date Apr 3, 2003
- Harlan R. Isaak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional memory stacking using anisotropic epoxy interconn...
- Publication number 20020094603
- Publication date Jul 18, 2002
- Harlan R. Isaak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Panel stacking of BGA devices to form three-dimensional modules
- Publication number 20020053728
- Publication date May 9, 2002
- Harlan R. Isaak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable flex circuit IC package and method of making same
- Publication number 20020048849
- Publication date Apr 25, 2002
- Harlan R. Isaak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional memory stacking using anisotropic epoxy interconn...
- Publication number 20010054758
- Publication date Dec 27, 2001
- Harlan R. Isaak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Panel stacking of BGA devices to form three-dimensional modules
- Publication number 20010054770
- Publication date Dec 27, 2001
- Harlan R. Isaak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable flex circuit chip package and method of making same
- Publication number 20010035572
- Publication date Nov 1, 2001
- Harlan R. Isaak
- H01 - BASIC ELECTRIC ELEMENTS

Harlan R. Isaak

Person

Patents Grantslast 30 patents

Panel stacking of BGA devices to form three-dimensional modules

Panel stacking of BGA devices to form three-dimensional modules

Panel stacking of BGA devices to form three-dimensional modules

Stackable flex circuit IC package and method of making same

Three-dimensional memory stacking using anisotropic epoxy interconn...

Stackable flex circuit chip package and method of making same

Stackable flex circuit IC package and method of making same

Panel stacking of BGA devices to form three-dimensional modules

Stackable flex circuit chip package and method of making same

Stackable flex circuit IC package and method of making same

Chip stack and method of making same

Modular panel stacking process

Method of interfacing detector array layers

Detector alignment board

Ceramic edge connect process

Chip stack and method of making same

Antistretch screen printing arrangement

Patents Applicationslast 30 patents

Panel stacking of BGA devices to form three-dimensional modules

Panel stacking of BGA devices to form three-dimensional modules

Three-dimensional memory stacking using anisotropic epoxy interconn...

Panel stacking of BGA devices to form three-dimensional modules

Stackable flex circuit IC package and method of making same

Three-dimensional memory stacking using anisotropic epoxy interconn...

Panel stacking of BGA devices to form three-dimensional modules

Stackable flex circuit chip package and method of making same