Harry Chandra

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package having a low profile
- Patent number 10,991,644
- Issue date Apr 27, 2021
- ALLEGRO MICROSYSTEMS, LLC
- Paul A. David
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with input/output expansion
- Patent number 8,723,302
- Issue date May 13, 2014
- Stats Chippac Ltd.
- Harry Chandra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with a stackable package and me...
- Patent number 8,653,654
- Issue date Feb 18, 2014
- Stats Chippac Ltd.
- Harry Chandra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive vias in peripheral region co...
- Patent number 8,598,690
- Issue date Dec 3, 2013
- STATS ChipPAC, Ltd.
- Harry Chandra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of electrically connecting a shielding layer to ground throu...
- Patent number 8,110,441
- Issue date Feb 7, 2012
- STATS ChipPAC, Ltd.
- Harry Chandra
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PHOTORECEIVER ARRAY HAVING MICROLENSES
- Publication number 20220406830
- Publication date Dec 22, 2022
- ALLEGRO MICROSYSTEMS, LLC
- Bryan Cadugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING A LOW PROFILE
- Publication number 20210057314
- Publication date Feb 25, 2021
- ALLEGRO MICROSYSTEMS, LLC
- Paul A. David
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Electrically Connecting a Shield...
- Publication number 20120119348
- Publication date May 17, 2012
- STATS ChipPAC, Ltd.
- Harry Chandra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A STACKABLE PACKAGE AND ME...
- Publication number 20110140283
- Publication date Jun 16, 2011
- Harry Chandra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INPUT/OUTPUT EXPANSION
- Publication number 20100148344
- Publication date Jun 17, 2010
- Harry Chandra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Electrically Connecting a Shield...
- Publication number 20100072582
- Publication date Mar 25, 2010
- STATS ChipPAC, Ltd.
- Harry Chandra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light Emitting Chip Package With Metal Leads For Enhanced Heat Diss...
- Publication number 20100059783
- Publication date Mar 11, 2010
- Harry Chandra
- H01 - BASIC ELECTRIC ELEMENTS

Harry Chandra

Person

Patents Grantslast 30 patents

Integrated circuit package having a low profile

Integrated circuit package system with input/output expansion

Integrated circuit packaging system with a stackable package and me...

Semiconductor device having conductive vias in peripheral region co...

Method of electrically connecting a shielding layer to ground throu...

Patents Applicationslast 30 patents

PHOTORECEIVER ARRAY HAVING MICROLENSES

INTEGRATED CIRCUIT PACKAGE HAVING A LOW PROFILE

Semiconductor Device and Method of Electrically Connecting a Shield...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A STACKABLE PACKAGE AND ME...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INPUT/OUTPUT EXPANSION

Semiconductor Device and Method of Electrically Connecting a Shield...

Light Emitting Chip Package With Metal Leads For Enhanced Heat Diss...