Harry Fuerhaupter

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Villa Park, IL, US

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic package including a polymer encapsulated die
- Patent number 6,093,972
- Issue date Jul 25, 2000
- Motorola, Inc.
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package including a polymer encapsulated die, and m...
- Patent number 5,895,229
- Issue date Apr 20, 1999
- Motorola, Inc.
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Immersion plating of tin-bismuth solder
- Patent number 5,435,838
- Issue date Jul 25, 1995
- Motorola, Inc.
- Cynthia M. Melton
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Immersion plating of tin-bismuth solder
- Patent number 5,391,402
- Issue date Feb 21, 1995
- Motorola
- Cynthia M. Melton
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tin-bismuth solder connection having improved high temperature prop...
- Patent number 5,320,272
- Issue date Jun 14, 1994
- Motorola, Inc.
- Cynthia Melton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polyimide coating having electroless metal plate
- Patent number 5,183,692
- Issue date Feb 2, 1993
- Motorola, Inc.
- Prosanto K. Mukerji
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...