Harry-HakLay Chuang

Person

Zhubei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making gate structure of a semiconductor device
- Patent number 11,894,443
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal gate structure of a CMOS semiconductor device and method of f...
- Patent number 11,393,726
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed salicide structure to integrate a flash memory device with...
- Patent number 9,735,245
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Harry Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of forming ESD protection device
- Patent number 9,478,633
- Issue date Oct 25, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating spacers in a strained semiconductor device
- Patent number 9,419,099
- Issue date Aug 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Pin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mechanical stress enhancement in semiconductor devices
- Patent number 9,349,655
- Issue date May 24, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Carlos H. Diaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded nonvolatile memory
- Patent number 9,159,842
- Issue date Oct 13, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating spacers in a strained semiconductor device
- Patent number 9,117,840
- Issue date Aug 25, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Pin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for controlling shallow trench isolation step height
- Patent number 9,054,025
- Issue date Jun 9, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polysilicon design for replacement gate technology
- Patent number 8,890,260
- Issue date Nov 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for reducing gate resistance
- Patent number 8,836,035
- Issue date Sep 16, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving thermal stability of metal gate
- Patent number 8,835,294
- Issue date Sep 16, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Guan Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit metal gate structure and method of fabrication
- Patent number 8,735,235
- Issue date May 27, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced substrate coupling for inductors in semiconductor devices
- Patent number 8,697,517
- Issue date Apr 15, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating hybrid impact-ionization semiconductor device
- Patent number 8,680,619
- Issue date Mar 25, 2014
- Taiwan Semiconductor Manufacturing Compnay, Ltd.
- Ming Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating a first contact structure in a gate last process
- Patent number 8,669,153
- Issue date Mar 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiung-Han Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal gate semiconductor device
- Patent number 8,629,515
- Issue date Jan 14, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Han Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage device with partial silicon germanium epi source/drain
- Patent number 8,614,484
- Issue date Dec 24, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lee-Wee Teo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming high-K metal gate device
- Patent number 8,609,484
- Issue date Dec 17, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lee-Wee Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo alignment mark for a gate last process
- Patent number 8,598,630
- Issue date Dec 3, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gary Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of forming ESD protection device
- Patent number 8,598,656
- Issue date Dec 3, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dishing-free gap-filling with multiple CMPs
- Patent number 8,552,522
- Issue date Oct 8, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for improving gate contact
- Patent number 8,524,570
- Issue date Sep 3, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for protecting a gate structure during contact formation
- Patent number 8,497,169
- Issue date Jul 30, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Dyi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device scheme of HKMG gate-last process
- Patent number 8,487,382
- Issue date Jul 16, 2013
- Taiwan Semiconductor Maufacturing Company, Ltd.
- Sheng-Chen Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate stack for high-K/metal gate last process
- Patent number 8,476,126
- Issue date Jul 2, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of forming bipolar transistor device
- Patent number 8,461,621
- Issue date Jun 11, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating same
- Patent number 8,461,629
- Issue date Jun 11, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung Long Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a sealing structure for high-k metal gate
- Patent number 8,450,161
- Issue date May 28, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating a first contact structure in a gate last process
- Patent number 8,394,692
- Issue date Mar 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiung-Han Yeh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INDUCTOR EMBEDDED IN A SUBSTRATE OF A SEMICONDUCTOR DEVICE
- Publication number 20240332170
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Hung LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC TUNNEL JUNCTION (MTJ) HAVING A DIFFUSION BLOCKING SPACER L...
- Publication number 20240268236
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Feng Huang
- G11 - INFORMATION STORAGE
Information Patent Application
CAP LAYER FOR PAD OXIDATION PREVENTION
- Publication number 20240243080
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
- Publication number 20240234401
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Hung LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGES AND METHODS OF FORMATION
- Publication number 20240153895
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-HakLay CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
- Publication number 20240136346
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Hung LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING INSULATING STRUCTURE SURROUNDING THR...
- Publication number 20240096753
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE DEVICES IN BONDING LAYERS
- Publication number 20240088026
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Ching Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING INDUCTOR AND METHOD OF MANUFACTURING TH...
- Publication number 20240071911
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PYROELECTRIC DEVICE FOR A SEMICONDUCTOR DEVICE
- Publication number 20230413673
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Hai LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH PACKAGE STRUCTURE
- Publication number 20230395466
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER METALLIC STRUCTURE AND METHOD
- Publication number 20230377968
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE LEAKAGE PREVENTION
- Publication number 20230307322
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Bonding Method and Bonded Device Structure
- Publication number 20230299010
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Bonding Method and Bonded Device Structure
- Publication number 20230299041
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230292525
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ta Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnetic Tunnel Junction Device and Method of Forming the Same
- Publication number 20230189657
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Harry-HakLay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220352151
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry Hak-Lay CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING GATE STRUCTURE OF A SEMICONDUCTOR DEVICE
- Publication number 20220320314
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL GATE STRUCTURE OF A CMOS SEMICONDUCTOR DEVICE AND METHOD OF F...
- Publication number 20210082772
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Recessed Salicide Structure to Integrate a Flash Memory Device with...
- Publication number 20160056250
- Publication date Feb 25, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Harry Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SPACERS IN A STRAINED SEMICONDUCTOR DEVICE
- Publication number 20150228790
- Publication date Aug 13, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Pin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus of Forming ESD Protection Device
- Publication number 20140038376
- Publication date Feb 6, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrating a First Contact Structure in a Gate Last Process
- Publication number 20130196496
- Publication date Aug 1, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiung-Han Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING STRUCTURE FOR HIGH-K METAL GATE AND METHOD OF MAKING
- Publication number 20120225529
- Publication date Sep 6, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SPACERS IN A STRAINED SEMICONDUCTOR DEVICE
- Publication number 20120146057
- Publication date Jun 14, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Pin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL DEVICE SCHEME OF HMKG GATE-LAST PROCESS
- Publication number 20120056269
- Publication date Mar 8, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chen Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING A FIRST CONTACT STRUCTURE IN A GATE LAST PROCESS
- Publication number 20120045889
- Publication date Feb 23, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiung-Han Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL GATE SEMICONDUCTOR DEVICE
- Publication number 20120012948
- Publication date Jan 19, 2012
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. ("TSMC")
- Ching-Han Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FABRICATION METHOD INCLUDING HARD MASK AND SAC...
- Publication number 20110312141
- Publication date Dec 22, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shun-Jang Liao
- H01 - BASIC ELECTRIC ELEMENTS

Harry-HakLay Chuang

Person

Patents Grantslast 30 patents

Method of making gate structure of a semiconductor device

Metal gate structure of a CMOS semiconductor device and method of f...

Recessed salicide structure to integrate a flash memory device with...

Method and apparatus of forming ESD protection device

Method of fabricating spacers in a strained semiconductor device

Method for mechanical stress enhancement in semiconductor devices

Embedded nonvolatile memory

Method of fabricating spacers in a strained semiconductor device

Process for controlling shallow trench isolation step height

Polysilicon design for replacement gate technology

Method and apparatus for reducing gate resistance

Method for improving thermal stability of metal gate

Integrated circuit metal gate structure and method of fabrication

Reduced substrate coupling for inductors in semiconductor devices

Method of fabricating hybrid impact-ionization semiconductor device

Integrating a first contact structure in a gate last process

Metal gate semiconductor device

High voltage device with partial silicon germanium epi source/drain

Method for forming high-K metal gate device

Photo alignment mark for a gate last process

Method and apparatus of forming ESD protection device

Dishing-free gap-filling with multiple CMPs

Method and apparatus for improving gate contact

Method for protecting a gate structure during contact formation

Device scheme of HKMG gate-last process

Gate stack for high-K/metal gate last process

Method and apparatus of forming bipolar transistor device

Semiconductor device and method of fabricating same

Method of fabricating a sealing structure for high-k metal gate

Integrating a first contact structure in a gate last process

Patents Applicationslast 30 patents

INDUCTOR EMBEDDED IN A SUBSTRATE OF A SEMICONDUCTOR DEVICE

MAGNETIC TUNNEL JUNCTION (MTJ) HAVING A DIFFUSION BLOCKING SPACER L...

CAP LAYER FOR PAD OXIDATION PREVENTION

SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION

SEMICONDUCTOR DIE PACKAGES AND METHODS OF FORMATION

SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION

SEMICONDUCTOR DEVICE INCLUDING INSULATING STRUCTURE SURROUNDING THR...

PASSIVE DEVICES IN BONDING LAYERS

SEMICONDUCTOR DEVICE HAVING INDUCTOR AND METHOD OF MANUFACTURING TH...

PYROELECTRIC DEVICE FOR A SEMICONDUCTOR DEVICE

HIGH BANDWIDTH PACKAGE STRUCTURE

REDISTRIBUTION LAYER METALLIC STRUCTURE AND METHOD

BACKSIDE LEAKAGE PREVENTION

Wafer Bonding Method and Bonded Device Structure

Wafer Bonding Method and Bonded Device Structure

MEMORY STRUCTURE AND METHOD OF FORMING THE SAME

Magnetic Tunnel Junction Device and Method of Forming the Same

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MAKING GATE STRUCTURE OF A SEMICONDUCTOR DEVICE

METAL GATE STRUCTURE OF A CMOS SEMICONDUCTOR DEVICE AND METHOD OF F...

Recessed Salicide Structure to Integrate a Flash Memory Device with...

METHOD OF FABRICATING SPACERS IN A STRAINED SEMICONDUCTOR DEVICE

Method and Apparatus of Forming ESD Protection Device

Integrating a First Contact Structure in a Gate Last Process

SEALING STRUCTURE FOR HIGH-K METAL GATE AND METHOD OF MAKING

METHOD OF FABRICATING SPACERS IN A STRAINED SEMICONDUCTOR DEVICE

NOVEL DEVICE SCHEME OF HMKG GATE-LAST PROCESS

INTEGRATING A FIRST CONTACT STRUCTURE IN A GATE LAST PROCESS

METAL GATE SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE FABRICATION METHOD INCLUDING HARD MASK AND SAC...